JPS60103841U - 電子部品装置 - Google Patents

電子部品装置

Info

Publication number
JPS60103841U
JPS60103841U JP19512383U JP19512383U JPS60103841U JP S60103841 U JPS60103841 U JP S60103841U JP 19512383 U JP19512383 U JP 19512383U JP 19512383 U JP19512383 U JP 19512383U JP S60103841 U JPS60103841 U JP S60103841U
Authority
JP
Japan
Prior art keywords
molded body
electronic component
electronic parts
pedestal
parts equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19512383U
Other languages
English (en)
Other versions
JPS6320120Y2 (ja
Inventor
秋山　克彦
秀幸 高橋
寛隆 小林
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP19512383U priority Critical patent/JPS60103841U/ja
Publication of JPS60103841U publication Critical patent/JPS60103841U/ja
Application granted granted Critical
Publication of JPS6320120Y2 publication Critical patent/JPS6320120Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の電子部品装置の路線的拡大断面図、第２
図は本考案による電子部品装置の一例の路線的拡大断面
図、第３図はそのモールド作業の説明に供する構成図、
第４図は本考案による電子部品装置の他の例の路線的拡
大断面図である。 ２５は電子部品、１１は台座、１３は第１のモールド体
、２７は第２のモールド体、２４は蓋体である。 補正　昭５９．２．２１ 図面の簡単な説明を次のように補正する。 明細書第９頁、ｌ請１第４図はヨを１第４図及び第５図
は、と訂正する。

Claims (1)

    【実用新案登録請求の範囲】
  1. 台座の上に電子部品がマウントされると共に該電子部品
    に電気的に接続されたリード導体が上記台座の側方より
    突設されるように配置され上記台座の周面を覆い上記リ
    ード導体の外端を露出させて第１のモールド体が施され
    、該第１のモールド体上に該第１のモールド体との共働
    によって上記°　　電子部品を包囲する蓋体が配置され
    、該蓋体の周縁部を覆って上記第１のモールド体上に第
    ２のモールド体が施されてなる電子部品装置。
JP19512383U 1983-12-19 1983-12-19 電子部品装置 Granted JPS60103841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Publications (2)

Publication Number Publication Date
JPS60103841U true JPS60103841U (ja) 1985-07-15
JPS6320120Y2 JPS6320120Y2 (ja) 1988-06-03

Family

ID=30419181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19512383U Granted JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Country Status (1)

Country Link
JP (1) JPS60103841U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120833A (ja) * 2004-10-21 2006-05-11 Harvatek Corp 電気光学半導体のパッケージ構造
JP2008502159A (ja) * 2004-06-04 2008-01-24 クリー　インコーポレイテッド 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法
JP2015165551A (ja) * 2014-02-04 2015-09-17 セイコーインスツル株式会社 光センサ装置
JP2017050411A (ja) * 2015-09-02 2017-03-09 株式会社東芝 光半導体装置、およびその製造方法
WO2019059047A1 (ja) * 2017-09-20 2019-03-28 岩崎電気株式会社 発光装置、照明装置、及び発光装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008502159A (ja) * 2004-06-04 2008-01-24 クリー　インコーポレイテッド 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法
JP2006120833A (ja) * 2004-10-21 2006-05-11 Harvatek Corp 電気光学半導体のパッケージ構造
JP2015165551A (ja) * 2014-02-04 2015-09-17 セイコーインスツル株式会社 光センサ装置
JP2017050411A (ja) * 2015-09-02 2017-03-09 株式会社東芝 光半導体装置、およびその製造方法
WO2019059047A1 (ja) * 2017-09-20 2019-03-28 岩崎電気株式会社 発光装置、照明装置、及び発光装置の製造方法

Also Published As

Publication number Publication date
JPS6320120Y2 (ja) 1988-06-03

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