TWI265619B - Lead frame and semiconductor device using the same - Google Patents
Lead frame and semiconductor device using the same Download PDFInfo
- Publication number
- TWI265619B TWI265619B TW093114965A TW93114965A TWI265619B TW I265619 B TWI265619 B TW I265619B TW 093114965 A TW093114965 A TW 093114965A TW 93114965 A TW93114965 A TW 93114965A TW I265619 B TWI265619 B TW I265619B
- Authority
- TW
- Taiwan
- Prior art keywords
- grain
- grain step
- semiconductor wafer
- lead frame
- semiconductor device
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/0694—Broiling racks
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
- A47J37/067—Horizontally disposed broiling griddles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32052—Shape in top view
- H01L2224/32055—Shape in top view being circular or elliptic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Food Science & Technology (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003151378 | 2003-05-28 | ||
JP2004133376A JP4055158B2 (ja) | 2003-05-28 | 2004-04-28 | リードフレーム及びリードフレームを備えた半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504986A TW200504986A (en) | 2005-02-01 |
TWI265619B true TWI265619B (en) | 2006-11-01 |
Family
ID=33566716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093114965A TWI265619B (en) | 2003-05-28 | 2004-05-26 | Lead frame and semiconductor device using the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US20050006733A1 (ja) |
JP (1) | JP4055158B2 (ja) |
KR (1) | KR100582613B1 (ja) |
CN (2) | CN2733595Y (ja) |
HK (1) | HK1069675A1 (ja) |
TW (1) | TWI265619B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4055158B2 (ja) * | 2003-05-28 | 2008-03-05 | ヤマハ株式会社 | リードフレーム及びリードフレームを備えた半導体装置 |
JP2006351755A (ja) * | 2005-06-15 | 2006-12-28 | Renesas Technology Corp | 半導体装置 |
JP4963235B2 (ja) * | 2007-01-18 | 2012-06-27 | 矢崎総業株式会社 | 制御回路内蔵ユニット |
JP5173654B2 (ja) * | 2007-08-06 | 2013-04-03 | セイコーインスツル株式会社 | 半導体装置 |
JP5797126B2 (ja) * | 2012-02-06 | 2015-10-21 | 三菱電機株式会社 | 半導体装置 |
JP5954013B2 (ja) * | 2012-07-18 | 2016-07-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
CN108585799B (zh) * | 2018-05-11 | 2021-05-11 | 广东工业大学 | 一种新型陶瓷3d打印成型方法 |
CN113169150B (zh) * | 2021-03-10 | 2022-06-14 | 英诺赛科(苏州)半导体有限公司 | Iii族氮基半导体封装结构及其制造方法 |
CN113345846B (zh) * | 2021-06-03 | 2022-03-22 | 长鑫存储技术有限公司 | 封装结构及用于制造封装结构的方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2534251B2 (ja) * | 1987-02-20 | 1996-09-11 | 日東電工株式会社 | 半導体装置 |
JP2539432B2 (ja) * | 1987-05-27 | 1996-10-02 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
JP3018211B2 (ja) | 1992-02-20 | 2000-03-13 | 株式会社三井ハイテック | リードフレーム |
KR100552353B1 (ko) | 1992-03-27 | 2006-06-20 | 가부시키가이샤 히타치초엘에스아이시스템즈 | 리이드프레임및그것을사용한반도체집적회로장치와그제조방법 |
JPH05326815A (ja) | 1992-05-25 | 1993-12-10 | Matsushita Electron Corp | 半導体装置用リードフレーム |
JPH0661397A (ja) | 1992-08-12 | 1994-03-04 | Sony Corp | リードフレーム及びそれを用いた樹脂封止型半導体装置の樹脂封止方法 |
JPH0684979A (ja) * | 1992-09-01 | 1994-03-25 | Toshiba Corp | 樹脂封止型半導体装置 |
KR940016706A (ko) | 1992-12-31 | 1994-07-23 | 김광호 | 반도체 패키지 |
JPH06268143A (ja) | 1993-03-15 | 1994-09-22 | Seiko Epson Corp | リードフレーム及び半導体装置 |
JPH07211852A (ja) | 1994-01-21 | 1995-08-11 | Sony Corp | リードフレーム、それを用いた半導体装置及びその製造装置 |
JPH07335815A (ja) | 1994-06-13 | 1995-12-22 | Shinko Electric Ind Co Ltd | リードフレーム及びこれを用いた半導体装置 |
JPH0855954A (ja) | 1994-08-15 | 1996-02-27 | Sony Corp | リードフレーム及びそれを用いた半導体装置 |
JP2767404B2 (ja) * | 1994-12-14 | 1998-06-18 | アナムインダストリアル株式会社 | 半導体パッケージのリードフレーム構造 |
EP0834376A4 (en) * | 1995-06-20 | 2003-01-22 | Matsushita Electric Ind Co Ltd | BRAZING SUPPLY METAL, WELDED ELECTRONIC COMPONENT AND ELECTRONIC CIRCUIT PLATE |
JPH09129811A (ja) * | 1995-10-30 | 1997-05-16 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
JP3229816B2 (ja) | 1996-06-25 | 2001-11-19 | シャープ株式会社 | 樹脂封止型半導体装置の製造方法 |
KR20040045045A (ko) * | 1996-12-26 | 2004-05-31 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체장치 |
JP2000031371A (ja) * | 1998-07-09 | 2000-01-28 | Seiko Epson Corp | リードフレームおよびそれを用いて構成された半導体装置 |
JP3716101B2 (ja) | 1998-07-31 | 2005-11-16 | 株式会社日立製作所 | リードフレーム及びそれを用いた半導体装置の製造方法並びに半導体装置 |
JP2000286379A (ja) | 1999-01-28 | 2000-10-13 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2001127232A (ja) | 1999-10-27 | 2001-05-11 | Shinko Electric Ind Co Ltd | リードフレーム及びその製造方法 |
US6545344B2 (en) * | 2000-06-27 | 2003-04-08 | Texas Instruments Incorporated | Semiconductor leadframes plated with lead-free solder and minimum palladium |
JP4570797B2 (ja) | 2001-02-14 | 2010-10-27 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2003017646A (ja) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
JP2003110079A (ja) | 2001-10-01 | 2003-04-11 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP4055158B2 (ja) * | 2003-05-28 | 2008-03-05 | ヤマハ株式会社 | リードフレーム及びリードフレームを備えた半導体装置 |
-
2004
- 2004-04-28 JP JP2004133376A patent/JP4055158B2/ja not_active Expired - Fee Related
- 2004-05-25 KR KR1020040037093A patent/KR100582613B1/ko not_active IP Right Cessation
- 2004-05-26 US US10/853,148 patent/US20050006733A1/en not_active Abandoned
- 2004-05-26 TW TW093114965A patent/TWI265619B/zh not_active IP Right Cessation
- 2004-05-28 CN CNU2004200511954U patent/CN2733595Y/zh not_active Expired - Fee Related
- 2004-05-28 CN CNB2004100473001A patent/CN100385658C/zh not_active Expired - Fee Related
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2005
- 2005-03-09 HK HK05102057A patent/HK1069675A1/xx not_active IP Right Cessation
-
2007
- 2007-11-12 US US11/938,742 patent/US7964942B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4055158B2 (ja) | 2008-03-05 |
CN2733595Y (zh) | 2005-10-12 |
CN100385658C (zh) | 2008-04-30 |
TW200504986A (en) | 2005-02-01 |
US20080073764A1 (en) | 2008-03-27 |
JP2005012184A (ja) | 2005-01-13 |
CN1574330A (zh) | 2005-02-02 |
US7964942B2 (en) | 2011-06-21 |
HK1069675A1 (en) | 2005-05-27 |
US20050006733A1 (en) | 2005-01-13 |
KR100582613B1 (ko) | 2006-05-23 |
KR20040103778A (ko) | 2004-12-09 |
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