CN108155170A - 引线框 - Google Patents
引线框 Download PDFInfo
- Publication number
- CN108155170A CN108155170A CN201711261247.9A CN201711261247A CN108155170A CN 108155170 A CN108155170 A CN 108155170A CN 201711261247 A CN201711261247 A CN 201711261247A CN 108155170 A CN108155170 A CN 108155170A
- Authority
- CN
- China
- Prior art keywords
- face
- resin
- lead frame
- coating
- internal connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 154
- 239000011347 resin Substances 0.000 claims abstract description 154
- 239000011248 coating agent Substances 0.000 claims description 94
- 238000000576 coating method Methods 0.000 claims description 94
- 229910000679 solder Inorganic materials 0.000 abstract description 50
- 239000004065 semiconductor Substances 0.000 abstract description 46
- 239000000758 substrate Substances 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000003223 protective agent Substances 0.000 description 63
- 238000000034 method Methods 0.000 description 22
- 238000007747 plating Methods 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000005530 etching Methods 0.000 description 15
- 239000010931 gold Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 230000002787 reinforcement Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 238000007789 sealing Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
- H01L21/4832—Etching a temporary substrate after encapsulation process to form leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236122A JP6780903B2 (ja) | 2016-12-05 | 2016-12-05 | リードフレーム |
JP2016-236122 | 2016-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108155170A true CN108155170A (zh) | 2018-06-12 |
CN108155170B CN108155170B (zh) | 2022-11-22 |
Family
ID=62243450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711261247.9A Active CN108155170B (zh) | 2016-12-05 | 2017-12-04 | 引线框 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10727171B2 (zh) |
JP (1) | JP6780903B2 (zh) |
CN (1) | CN108155170B (zh) |
TW (1) | TWI741073B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210074621A1 (en) * | 2019-09-10 | 2021-03-11 | Amazing Microelectronic Corp. | Semiconductor package |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283275A (ja) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | ボンディングテ−プ、そのボンディングテ−プを用いた半導体装置及びその製造方法 |
JP2002110849A (ja) * | 2000-09-29 | 2002-04-12 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とそれに用いられる回路部材、および回路部材の製造方法 |
US20050062148A1 (en) * | 2000-03-25 | 2005-03-24 | Seo Seong Min | Semiconductor package |
US20050287711A1 (en) * | 2004-06-29 | 2005-12-29 | Advanced Semiconductor Engineering, Inc. | Leadframe of a leadless flip-chip package and method for manufacturing the same |
WO2007018237A1 (ja) * | 2005-08-10 | 2007-02-15 | Mitsui High-Tec, Inc. | 半導体装置及びその製造方法 |
US20120074547A1 (en) * | 2010-09-24 | 2012-03-29 | Byung Tai Do | Integrated circuit packaging system with lead encapsulation and method of manufacture thereof |
US20120261689A1 (en) * | 2011-04-13 | 2012-10-18 | Bernd Karl Appelt | Semiconductor device packages and related methods |
US20140167236A1 (en) * | 2012-12-14 | 2014-06-19 | Byung Tai Do | Integrated circuit packaging system with transferable trace lead frame |
CN104282637A (zh) * | 2014-10-31 | 2015-01-14 | 南通富士通微电子股份有限公司 | 倒装芯片半导体封装结构 |
US9331003B1 (en) * | 2014-03-28 | 2016-05-03 | Stats Chippac Ltd. | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7795079B2 (en) * | 2005-07-21 | 2010-09-14 | Chipmos Technologies Inc. | Manufacturing process for a quad flat non-leaded chip package structure |
US7232755B1 (en) * | 2005-08-02 | 2007-06-19 | Asat Ltd. | Process for fabricating pad frame and integrated circuit package |
US20090189296A1 (en) * | 2008-01-30 | 2009-07-30 | Chipmos Technologies Inc. | Flip chip quad flat non-leaded package structure and manufacturing method thereof and chip package structure |
JP5271949B2 (ja) * | 2009-09-29 | 2013-08-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8338924B2 (en) * | 2010-12-09 | 2012-12-25 | Qpl Limited | Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof |
-
2016
- 2016-12-05 JP JP2016236122A patent/JP6780903B2/ja active Active
-
2017
- 2017-11-21 TW TW106140226A patent/TWI741073B/zh active
- 2017-11-28 US US15/823,760 patent/US10727171B2/en active Active
- 2017-12-04 CN CN201711261247.9A patent/CN108155170B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283275A (ja) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | ボンディングテ−プ、そのボンディングテ−プを用いた半導体装置及びその製造方法 |
US20050062148A1 (en) * | 2000-03-25 | 2005-03-24 | Seo Seong Min | Semiconductor package |
JP2002110849A (ja) * | 2000-09-29 | 2002-04-12 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とそれに用いられる回路部材、および回路部材の製造方法 |
US20050287711A1 (en) * | 2004-06-29 | 2005-12-29 | Advanced Semiconductor Engineering, Inc. | Leadframe of a leadless flip-chip package and method for manufacturing the same |
WO2007018237A1 (ja) * | 2005-08-10 | 2007-02-15 | Mitsui High-Tec, Inc. | 半導体装置及びその製造方法 |
US20120074547A1 (en) * | 2010-09-24 | 2012-03-29 | Byung Tai Do | Integrated circuit packaging system with lead encapsulation and method of manufacture thereof |
US20120261689A1 (en) * | 2011-04-13 | 2012-10-18 | Bernd Karl Appelt | Semiconductor device packages and related methods |
US20140167236A1 (en) * | 2012-12-14 | 2014-06-19 | Byung Tai Do | Integrated circuit packaging system with transferable trace lead frame |
US9331003B1 (en) * | 2014-03-28 | 2016-05-03 | Stats Chippac Ltd. | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof |
CN104282637A (zh) * | 2014-10-31 | 2015-01-14 | 南通富士通微电子股份有限公司 | 倒装芯片半导体封装结构 |
Also Published As
Publication number | Publication date |
---|---|
US20180158760A1 (en) | 2018-06-07 |
TWI741073B (zh) | 2021-10-01 |
CN108155170B (zh) | 2022-11-22 |
US10727171B2 (en) | 2020-07-28 |
JP6780903B2 (ja) | 2020-11-04 |
JP2018093091A (ja) | 2018-06-14 |
TW201826480A (zh) | 2018-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180710 Address after: Japan Kagoshima Applicant after: Oguchi Electric Materials Co.,Ltd. Address before: Tokyo, Japan Applicant before: SH MATERIALS CO.,LTD. |
|
TA01 | Transfer of patent application right | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231122 Address after: The road development processing zone Kaohsiung city Taiwan China No. 24 Patentee after: CHANG WAH TECHNOLOGY Co.,Ltd. Address before: Japan Kagoshima Patentee before: Oguchi Electric Materials Co.,Ltd. |
|
TR01 | Transfer of patent right |