TWD176128S - 用於晶圓載運器之襯墊 - Google Patents
用於晶圓載運器之襯墊Info
- Publication number
- TWD176128S TWD176128S TW104305235F TW104305235F TWD176128S TW D176128 S TWD176128 S TW D176128S TW 104305235 F TW104305235 F TW 104305235F TW 104305235 F TW104305235 F TW 104305235F TW D176128 S TWD176128 S TW D176128S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- wafer
- support rail
- arched
- intervals
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000000007 visual effect Effects 0.000 abstract 2
- 239000000969 carrier Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
【物品用途】;本設計係關於一種用於晶圓載運器之襯墊。;【設計說明】;本設計之特點在於包含一拱形長形體,拱形長形體內鄰近二長側邊處各設有一支撐軌道,使各支撐軌道分別連結二短側邊。其中,二支撐軌道所夾設之區域內具有複數間隔設置之拱形形狀的晶圓嚙合段,且於各支撐軌道下方形成有複數間隔設置之向下延伸的細長錐形叉形部。藉由上述襯墊之形狀特徵,使得本設計之整體造型產生俐落且富有層次感之視覺意象,並對消費者產生獨特之視覺效果。;本設計物品於實際使用時,可藉由拱形形狀的晶圓嚙合段容置及保護所載運之晶圓的周緣,以防止載運晶圓時,因錯位或串槽所可能產生之損壞。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31271810P | 2010-03-11 | 2010-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD176128S true TWD176128S (zh) | 2016-06-01 |
Family
ID=44564174
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104305235F TWD176128S (zh) | 2010-03-11 | 2011-03-11 | 用於晶圓載運器之襯墊 |
TW104127340A TWI554455B (zh) | 2010-03-11 | 2011-03-11 | 晶圓載運器 |
TW100108271A TWI508905B (zh) | 2010-03-11 | 2011-03-11 | 晶圓載運器 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104127340A TWI554455B (zh) | 2010-03-11 | 2011-03-11 | 晶圓載運器 |
TW100108271A TWI508905B (zh) | 2010-03-11 | 2011-03-11 | 晶圓載運器 |
Country Status (9)
Country | Link |
---|---|
US (2) | US9472431B2 (zh) |
EP (1) | EP2544965B1 (zh) |
JP (1) | JP2013522885A (zh) |
KR (1) | KR20130054246A (zh) |
CN (1) | CN102883973B (zh) |
MY (1) | MY159162A (zh) |
SG (1) | SG184004A1 (zh) |
TW (3) | TWD176128S (zh) |
WO (1) | WO2011113033A2 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD740031S1 (en) * | 2010-10-19 | 2015-10-06 | Entegris, Inc. | Substrate container |
JP5881436B2 (ja) * | 2012-01-27 | 2016-03-09 | 信越ポリマー株式会社 | 基板収納容器 |
CN104350591B (zh) * | 2012-04-09 | 2017-02-22 | 恩特格里斯公司 | 晶片运送装置 |
CN103474383A (zh) * | 2013-09-06 | 2013-12-25 | 济南科盛电子有限公司 | 一种硅片盒 |
US10217655B2 (en) * | 2014-12-18 | 2019-02-26 | Entegris, Inc. | Wafer container with shock condition protection |
TWM510539U (zh) * | 2015-03-13 | 2015-10-11 | Entegris Inc | 使用於膜架傳送裝置的修改彈簧墊 |
US10832927B2 (en) * | 2015-12-18 | 2020-11-10 | Texas Instruments Incorporated | Interlocking nest wafer protector |
JP6673185B2 (ja) * | 2016-12-22 | 2020-03-25 | 株式会社Sumco | 緩衝材 |
CN106743648A (zh) * | 2016-12-25 | 2017-05-31 | 信宜市茂森科技实业有限公司 | 圆形玻璃转运架 |
TWI615335B (zh) * | 2017-03-24 | 2018-02-21 | 奇景光電股份有限公司 | 晶圓卡匣及其製造方法 |
US10811292B2 (en) * | 2018-09-12 | 2020-10-20 | Texas Instruments Incorporated | Transport packaging and method for expanded wafers |
EP3667711A1 (en) * | 2018-12-11 | 2020-06-17 | University of Vienna | An arbitrary-distance sample transfer in ultra-high vacuum |
CN109686689B (zh) * | 2018-12-14 | 2020-09-29 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆片装卸装置 |
KR20220035198A (ko) * | 2019-07-19 | 2022-03-21 | 엔테그리스, 아이엔씨. | 웨이퍼 쿠션 |
CN111300838A (zh) * | 2020-02-28 | 2020-06-19 | 北京市塑料研究所 | 晶圆承载器的制造方法及晶圆承载器 |
JP7414982B2 (ja) * | 2020-05-19 | 2024-01-16 | ミライアル株式会社 | 基板収納容器 |
JP2023537941A (ja) * | 2020-08-11 | 2023-09-06 | インテグリス・インコーポレーテッド | カセット押さえ |
US20230360941A1 (en) * | 2020-10-02 | 2023-11-09 | Entegris, Inc. | Wafer container and size adaption system therefor |
KR20220085343A (ko) | 2020-12-15 | 2022-06-22 | 주식회사 엘지에너지솔루션 | 전지 셀 운반용 내부 트레이 및 이를 구비한 전지 셀 운반용 트레이 |
CN113636195B (zh) * | 2021-07-16 | 2023-04-18 | 极研(福建)信息科技有限公司 | 一种用于嵌入式智能芯片的封装盒 |
CN114743905B (zh) * | 2022-04-19 | 2023-11-17 | 荣耀半导体材料(嘉善)有限公司 | 一种半导体晶片收纳容器 |
Family Cites Families (35)
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US4043451A (en) * | 1976-03-18 | 1977-08-23 | Fluoroware, Inc. | Shipping container for silicone semiconductor wafers |
US4061228A (en) * | 1976-12-20 | 1977-12-06 | Fluoroware, Inc. | Shipping container for substrates |
IT1181778B (it) * | 1985-05-07 | 1987-09-30 | Dynamit Nobel Silicon Spa | Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio |
US4721207A (en) * | 1986-04-28 | 1988-01-26 | Tensho Electric Industrial Co., Ltd. | Hard disk container |
US4752007A (en) * | 1986-12-11 | 1988-06-21 | Fluoroware, Inc. | Disk shipper |
US4966284A (en) | 1987-07-07 | 1990-10-30 | Empak, Inc. | Substrate package |
US4793488A (en) | 1987-07-07 | 1988-12-27 | Empak, Inc. | Package for semiconductor wafers |
US4949848A (en) | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
JPH0278246A (ja) | 1988-09-14 | 1990-03-19 | Kakizaki Seisakusho:Kk | 薄板処理用バスケット |
JPH0744020Y2 (ja) * | 1989-02-10 | 1995-10-09 | 信越ポリマー株式会社 | ウエーハ容器におけるウエーハ支持板 |
US5207324A (en) * | 1991-03-08 | 1993-05-04 | Fluoroware, Inc. | Wafer cushion for shippers |
US5228568A (en) * | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
US5255797A (en) | 1992-02-26 | 1993-10-26 | Fluoroware, Inc. | Wafer carrier with wafer retaining cushions |
US5273159A (en) * | 1992-05-26 | 1993-12-28 | Empak, Inc. | Wafer suspension box |
US5555981A (en) * | 1992-05-26 | 1996-09-17 | Empak, Inc. | Wafer suspension box |
US5362417A (en) | 1992-07-09 | 1994-11-08 | Xerox Corporation | Method of preparing a stable colloid of submicron particles |
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JPH07302833A (ja) * | 1994-05-09 | 1995-11-14 | Hitachi Cable Ltd | ウェハ用キャリア |
US5586658A (en) * | 1995-06-06 | 1996-12-24 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
US5816410A (en) * | 1994-07-15 | 1998-10-06 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
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JP2004051131A (ja) * | 2002-07-17 | 2004-02-19 | Yodogawa Hu-Tech Kk | ガラス基板搬送用ボックス |
JP2004158808A (ja) | 2002-11-08 | 2004-06-03 | Vantec Co Ltd | 半導体ウェハ搬送容器 |
JP4133407B2 (ja) * | 2003-02-13 | 2008-08-13 | ミライアル株式会社 | 薄板収納容器 |
JP4667769B2 (ja) | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
US20060042998A1 (en) * | 2004-08-24 | 2006-03-02 | Haggard Clifton C | Cushion for packing disks such as semiconductor wafers |
KR101395467B1 (ko) * | 2006-06-13 | 2014-05-14 | 엔테그리스, 아이엔씨. | 재사용이 가능한 웨이퍼 용기용 탄성 쿠션 |
CN101855716B (zh) * | 2007-11-09 | 2012-07-11 | 信越聚合物株式会社 | 保持器以及基板收纳容器 |
US8118169B2 (en) | 2008-04-25 | 2012-02-21 | Shin-Etsu Polymer Co., Ltd. | Retainer and substrate storage container provided with same retainer |
JP4999808B2 (ja) * | 2008-09-29 | 2012-08-15 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2011
- 2011-03-11 SG SG2012067203A patent/SG184004A1/en unknown
- 2011-03-11 KR KR1020127026369A patent/KR20130054246A/ko not_active Application Discontinuation
- 2011-03-11 US US13/583,886 patent/US9472431B2/en active Active
- 2011-03-11 TW TW104305235F patent/TWD176128S/zh unknown
- 2011-03-11 CN CN201180023390.9A patent/CN102883973B/zh active Active
- 2011-03-11 TW TW104127340A patent/TWI554455B/zh active
- 2011-03-11 JP JP2012557302A patent/JP2013522885A/ja active Pending
- 2011-03-11 EP EP11754236.5A patent/EP2544965B1/en active Active
- 2011-03-11 MY MYPI2012004027A patent/MY159162A/en unknown
- 2011-03-11 WO PCT/US2011/028243 patent/WO2011113033A2/en active Application Filing
- 2011-03-11 TW TW100108271A patent/TWI508905B/zh active
-
2016
- 2016-09-19 US US15/269,368 patent/US10276414B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI554455B (zh) | 2016-10-21 |
KR20130054246A (ko) | 2013-05-24 |
WO2011113033A2 (en) | 2011-09-15 |
US10276414B2 (en) | 2019-04-30 |
SG184004A1 (en) | 2012-10-30 |
EP2544965A2 (en) | 2013-01-16 |
TW201545959A (zh) | 2015-12-16 |
US20170062253A1 (en) | 2017-03-02 |
JP2013522885A (ja) | 2013-06-13 |
MY159162A (en) | 2016-12-30 |
CN102883973A (zh) | 2013-01-16 |
EP2544965A4 (en) | 2016-12-07 |
EP2544965B1 (en) | 2019-05-22 |
WO2011113033A3 (en) | 2012-01-05 |
TWI508905B (zh) | 2015-11-21 |
US9472431B2 (en) | 2016-10-18 |
TW201206791A (en) | 2012-02-16 |
US20130056389A1 (en) | 2013-03-07 |
CN102883973B (zh) | 2016-02-24 |
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