TW200846435A - Adhesive and connection structure using the same - Google Patents
Adhesive and connection structure using the same Download PDFInfo
- Publication number
- TW200846435A TW200846435A TW96145388A TW96145388A TW200846435A TW 200846435 A TW200846435 A TW 200846435A TW 96145388 A TW96145388 A TW 96145388A TW 96145388 A TW96145388 A TW 96145388A TW 200846435 A TW200846435 A TW 200846435A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- group
- resin
- compound
- meth
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006325559 | 2006-12-01 | ||
JP2007234590 | 2007-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200846435A true TW200846435A (en) | 2008-12-01 |
TWI359851B TWI359851B (ja) | 2012-03-11 |
Family
ID=39467789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96145388A TW200846435A (en) | 2006-12-01 | 2007-11-29 | Adhesive and connection structure using the same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5223679B2 (ja) |
KR (1) | KR101090577B1 (ja) |
CN (1) | CN101541903B (ja) |
TW (1) | TW200846435A (ja) |
WO (1) | WO2008065997A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI509045B (zh) * | 2010-03-25 | 2015-11-21 | Hitachi Chemical Co Ltd | 接著劑組成物及其使用、電路構件的連接構造體及其製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5315623B2 (ja) * | 2007-03-28 | 2013-10-16 | 横浜ゴム株式会社 | 硬化性樹脂組成物 |
CN103351829A (zh) * | 2007-09-05 | 2013-10-16 | 日立化成株式会社 | 粘接剂以及使用该粘接剂的连接结构体 |
JP2009108226A (ja) * | 2007-10-31 | 2009-05-21 | Yokohama Rubber Co Ltd:The | 硬化性樹脂組成物 |
CN101608107B (zh) * | 2008-06-16 | 2013-06-05 | 华东理工大学 | 粘接剂组合物及含该粘接剂组合物的各向异性导电粘接剂 |
CN104059547B (zh) * | 2008-09-30 | 2016-08-24 | 迪睿合电子材料有限公司 | 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法 |
JP5577635B2 (ja) * | 2008-10-09 | 2014-08-27 | 日立化成株式会社 | 接着剤組成物、回路接続用接着剤及び回路接続体 |
JP5891090B2 (ja) * | 2012-03-29 | 2016-03-22 | 富士フイルム株式会社 | インプリント用下層膜組成物およびこれを用いたパターン形成方法 |
CN102984610A (zh) * | 2012-12-08 | 2013-03-20 | 张情情 | 一种音响 |
JP6127806B2 (ja) * | 2013-07-24 | 2017-05-17 | 日立化成株式会社 | 接続材料、接続構造体及びその製造方法 |
JP2015025028A (ja) * | 2013-07-24 | 2015-02-05 | 日立化成株式会社 | 接続材料、これを用いた接続構造体及びその製造方法 |
GB2518363A (en) | 2013-09-18 | 2015-03-25 | Novalia Ltd | Circuit board assembly |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024826B2 (ja) * | 1979-01-12 | 1985-06-14 | 田岡化学工業株式会社 | 接着方法 |
JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
JP4720073B2 (ja) * | 2003-08-07 | 2011-07-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
KR100675412B1 (ko) * | 2003-09-09 | 2007-01-29 | 다이니폰 인사츠 가부시키가이샤 | 광학용 시트 및 그 제조방법 |
JP2005123025A (ja) * | 2003-10-16 | 2005-05-12 | Bridgestone Corp | 異方性導電フィルム |
CN101370892B (zh) * | 2006-01-17 | 2012-06-13 | 旭化成电子材料株式会社 | 聚亚胺树脂组合物及金属聚亚胺层压体 |
-
2007
- 2007-11-26 CN CN200780043737.XA patent/CN101541903B/zh not_active Expired - Fee Related
- 2007-11-26 KR KR1020097013674A patent/KR101090577B1/ko active IP Right Grant
- 2007-11-26 WO PCT/JP2007/072763 patent/WO2008065997A1/ja active Application Filing
- 2007-11-26 JP JP2008546976A patent/JP5223679B2/ja not_active Expired - Fee Related
- 2007-11-29 TW TW96145388A patent/TW200846435A/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI509045B (zh) * | 2010-03-25 | 2015-11-21 | Hitachi Chemical Co Ltd | 接著劑組成物及其使用、電路構件的連接構造體及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101541903B (zh) | 2013-04-17 |
CN101541903A (zh) | 2009-09-23 |
TWI359851B (ja) | 2012-03-11 |
JP5223679B2 (ja) | 2013-06-26 |
KR101090577B1 (ko) | 2011-12-08 |
KR20090096489A (ko) | 2009-09-10 |
JPWO2008065997A1 (ja) | 2010-03-04 |
WO2008065997A1 (fr) | 2008-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |