KR101090577B1 - 접착제 및 이것을 이용한 접속 구조체 - Google Patents

접착제 및 이것을 이용한 접속 구조체 Download PDF

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Publication number
KR101090577B1
KR101090577B1 KR1020097013674A KR20097013674A KR101090577B1 KR 101090577 B1 KR101090577 B1 KR 101090577B1 KR 1020097013674 A KR1020097013674 A KR 1020097013674A KR 20097013674 A KR20097013674 A KR 20097013674A KR 101090577 B1 KR101090577 B1 KR 101090577B1
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KR
South Korea
Prior art keywords
adhesive
parts
weight
group
connection terminal
Prior art date
Application number
KR1020097013674A
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English (en)
Korean (ko)
Other versions
KR20090096489A (ko
Inventor
시게끼 가또기
스나오 구도우
히로유끼 이자와
도시아끼 시라사까
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20090096489A publication Critical patent/KR20090096489A/ko
Application granted granted Critical
Publication of KR101090577B1 publication Critical patent/KR101090577B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
KR1020097013674A 2006-12-01 2007-11-26 접착제 및 이것을 이용한 접속 구조체 KR101090577B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006325559 2006-12-01
JPJP-P-2006-325559 2006-12-01
JPJP-P-2007-234590 2007-09-10
JP2007234590 2007-09-10

Publications (2)

Publication Number Publication Date
KR20090096489A KR20090096489A (ko) 2009-09-10
KR101090577B1 true KR101090577B1 (ko) 2011-12-08

Family

ID=39467789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097013674A KR101090577B1 (ko) 2006-12-01 2007-11-26 접착제 및 이것을 이용한 접속 구조체

Country Status (5)

Country Link
JP (1) JP5223679B2 (ja)
KR (1) KR101090577B1 (ja)
CN (1) CN101541903B (ja)
TW (1) TW200846435A (ja)
WO (1) WO2008065997A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5315623B2 (ja) * 2007-03-28 2013-10-16 横浜ゴム株式会社 硬化性樹脂組成物
CN103351829A (zh) * 2007-09-05 2013-10-16 日立化成株式会社 粘接剂以及使用该粘接剂的连接结构体
JP2009108226A (ja) * 2007-10-31 2009-05-21 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
CN101608107B (zh) * 2008-06-16 2013-06-05 华东理工大学 粘接剂组合物及含该粘接剂组合物的各向异性导电粘接剂
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP5577635B2 (ja) * 2008-10-09 2014-08-27 日立化成株式会社 接着剤組成物、回路接続用接着剤及び回路接続体
WO2011118719A1 (ja) * 2010-03-25 2011-09-29 日立化成工業株式会社 接着剤組成物及びその使用、並びに、回路部材の接続構造体及びその製造方法
JP5891090B2 (ja) * 2012-03-29 2016-03-22 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
CN102984610A (zh) * 2012-12-08 2013-03-20 张情情 一种音响
JP6127806B2 (ja) * 2013-07-24 2017-05-17 日立化成株式会社 接続材料、接続構造体及びその製造方法
JP2015025028A (ja) * 2013-07-24 2015-02-05 日立化成株式会社 接続材料、これを用いた接続構造体及びその製造方法
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003089775A (ja) 2001-07-05 2003-03-28 Bridgestone Corp 異方性導電フィルム
JP2005054140A (ja) 2003-08-07 2005-03-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP2005123025A (ja) 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024826B2 (ja) * 1979-01-12 1985-06-14 田岡化学工業株式会社 接着方法
KR100675412B1 (ko) * 2003-09-09 2007-01-29 다이니폰 인사츠 가부시키가이샤 광학용 시트 및 그 제조방법
CN101370892B (zh) * 2006-01-17 2012-06-13 旭化成电子材料株式会社 聚亚胺树脂组合物及金属聚亚胺层压体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003089775A (ja) 2001-07-05 2003-03-28 Bridgestone Corp 異方性導電フィルム
JP2005054140A (ja) 2003-08-07 2005-03-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP2005123025A (ja) 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム

Also Published As

Publication number Publication date
CN101541903B (zh) 2013-04-17
CN101541903A (zh) 2009-09-23
TWI359851B (ja) 2012-03-11
JP5223679B2 (ja) 2013-06-26
TW200846435A (en) 2008-12-01
KR20090096489A (ko) 2009-09-10
JPWO2008065997A1 (ja) 2010-03-04
WO2008065997A1 (fr) 2008-06-05

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