CN101541903B - 粘接剂和使用该粘接剂的连接结构体 - Google Patents

粘接剂和使用该粘接剂的连接结构体 Download PDF

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Publication number
CN101541903B
CN101541903B CN200780043737.XA CN200780043737A CN101541903B CN 101541903 B CN101541903 B CN 101541903B CN 200780043737 A CN200780043737 A CN 200780043737A CN 101541903 B CN101541903 B CN 101541903B
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CN
China
Prior art keywords
caking agent
methyl
resin
splicing ear
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200780043737.XA
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English (en)
Chinese (zh)
Other versions
CN101541903A (zh
Inventor
加藤木茂树
工藤直
伊泽弘行
白坂敏明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN101541903A publication Critical patent/CN101541903A/zh
Application granted granted Critical
Publication of CN101541903B publication Critical patent/CN101541903B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
CN200780043737.XA 2006-12-01 2007-11-26 粘接剂和使用该粘接剂的连接结构体 Expired - Fee Related CN101541903B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006325559 2006-12-01
JP325559/2006 2006-12-01
JP234590/2007 2007-09-10
JP2007234590 2007-09-10
PCT/JP2007/072763 WO2008065997A1 (fr) 2006-12-01 2007-11-26 Adhésif et structure de liaison utilisant celui-ci

Publications (2)

Publication Number Publication Date
CN101541903A CN101541903A (zh) 2009-09-23
CN101541903B true CN101541903B (zh) 2013-04-17

Family

ID=39467789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780043737.XA Expired - Fee Related CN101541903B (zh) 2006-12-01 2007-11-26 粘接剂和使用该粘接剂的连接结构体

Country Status (5)

Country Link
JP (1) JP5223679B2 (ja)
KR (1) KR101090577B1 (ja)
CN (1) CN101541903B (ja)
TW (1) TW200846435A (ja)
WO (1) WO2008065997A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5315623B2 (ja) * 2007-03-28 2013-10-16 横浜ゴム株式会社 硬化性樹脂組成物
CN103351829A (zh) * 2007-09-05 2013-10-16 日立化成株式会社 粘接剂以及使用该粘接剂的连接结构体
JP2009108226A (ja) * 2007-10-31 2009-05-21 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
CN101608107B (zh) * 2008-06-16 2013-06-05 华东理工大学 粘接剂组合物及含该粘接剂组合物的各向异性导电粘接剂
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP5577635B2 (ja) * 2008-10-09 2014-08-27 日立化成株式会社 接着剤組成物、回路接続用接着剤及び回路接続体
WO2011118719A1 (ja) * 2010-03-25 2011-09-29 日立化成工業株式会社 接着剤組成物及びその使用、並びに、回路部材の接続構造体及びその製造方法
JP5891090B2 (ja) * 2012-03-29 2016-03-22 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
CN102984610A (zh) * 2012-12-08 2013-03-20 张情情 一种音响
JP6127806B2 (ja) * 2013-07-24 2017-05-17 日立化成株式会社 接続材料、接続構造体及びその製造方法
JP2015025028A (ja) * 2013-07-24 2015-02-05 日立化成株式会社 接続材料、これを用いた接続構造体及びその製造方法
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1595207A (zh) * 2003-09-09 2005-03-16 大日本印刷株式会社 光学用片材及其制造方法
JP2005123025A (ja) * 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム
CN1639294A (zh) * 2002-06-28 2005-07-13 株式会社普利司通 各向异性导电薄膜

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024826B2 (ja) * 1979-01-12 1985-06-14 田岡化学工業株式会社 接着方法
JP4720073B2 (ja) * 2003-08-07 2011-07-13 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
CN101370892B (zh) * 2006-01-17 2012-06-13 旭化成电子材料株式会社 聚亚胺树脂组合物及金属聚亚胺层压体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1639294A (zh) * 2002-06-28 2005-07-13 株式会社普利司通 各向异性导电薄膜
CN1595207A (zh) * 2003-09-09 2005-03-16 大日本印刷株式会社 光学用片材及其制造方法
JP2005123025A (ja) * 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム

Also Published As

Publication number Publication date
CN101541903A (zh) 2009-09-23
TWI359851B (ja) 2012-03-11
JP5223679B2 (ja) 2013-06-26
TW200846435A (en) 2008-12-01
KR101090577B1 (ko) 2011-12-08
KR20090096489A (ko) 2009-09-10
JPWO2008065997A1 (ja) 2010-03-04
WO2008065997A1 (fr) 2008-06-05

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C06 Publication
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SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
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Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: HITACHI CHEMICAL CO. LTD. TO: HITACHI CHEMICAL CO., LTD.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130417

Termination date: 20211126

CF01 Termination of patent right due to non-payment of annual fee