MXPA03007490A - Chapas de metal refractario con textura uniforme y metodos de hacerlas. - Google Patents
Chapas de metal refractario con textura uniforme y metodos de hacerlas.Info
- Publication number
- MXPA03007490A MXPA03007490A MXPA03007490A MXPA03007490A MXPA03007490A MX PA03007490 A MXPA03007490 A MX PA03007490A MX PA03007490 A MXPA03007490 A MX PA03007490A MX PA03007490 A MXPA03007490 A MX PA03007490A MX PA03007490 A MXPA03007490 A MX PA03007490A
- Authority
- MX
- Mexico
- Prior art keywords
- uniform texture
- making
- methods
- same
- metal plates
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Forging (AREA)
- Powder Metallurgy (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Aerials With Secondary Devices (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
Un metodo para formar blancos de chisporroteo a partir de barras de tantalo o niobio de pureza requisita mediante un proceso en que se corta la barra en largos cortos y trabajo de presion de la barra a lo largo de ejes de trabajo ortogonales esencialmente que se alternan. Se aplican recocidos intermedios como sean necesarios para establecer una textura uniforme de grosor-ancho y ancho de area a traves del blanco, incluyendo el centro. La textura uniforme es una mezcla substancialmente constante de granos con orientacion, mejorando con ello el desarrollo de chisporroteo al proporcionar un indice de chisporroteo mas predecible para controlar el grosor de la pelicula.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26998301P | 2001-02-20 | 2001-02-20 | |
PCT/US2002/005033 WO2002070765A1 (en) | 2001-02-20 | 2002-02-20 | Refractory metal plates with uniform texture and methods of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA03007490A true MXPA03007490A (es) | 2004-09-06 |
Family
ID=23029400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA03007490A MXPA03007490A (es) | 2001-02-20 | 2002-02-20 | Chapas de metal refractario con textura uniforme y metodos de hacerlas. |
Country Status (21)
Country | Link |
---|---|
US (1) | US20020112789A1 (es) |
EP (1) | EP1366203B1 (es) |
JP (1) | JP4327460B2 (es) |
KR (1) | KR100966682B1 (es) |
CN (2) | CN1789476A (es) |
AT (1) | ATE339532T1 (es) |
AU (1) | AU2002257005B2 (es) |
BR (1) | BR0207384A (es) |
CA (1) | CA2438819A1 (es) |
CZ (1) | CZ20032246A3 (es) |
DE (1) | DE60214683T2 (es) |
ES (1) | ES2272707T3 (es) |
HK (1) | HK1066833A1 (es) |
HU (1) | HUP0303269A3 (es) |
IL (1) | IL157279A0 (es) |
MX (1) | MXPA03007490A (es) |
NO (1) | NO20033547L (es) |
NZ (1) | NZ527628A (es) |
PT (1) | PT1366203E (es) |
WO (1) | WO2002070765A1 (es) |
ZA (1) | ZA200306399B (es) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040016635A1 (en) * | 2002-07-19 | 2004-01-29 | Ford Robert B. | Monolithic sputtering target assembly |
JP4263900B2 (ja) * | 2002-11-13 | 2009-05-13 | 日鉱金属株式会社 | Taスパッタリングターゲット及びその製造方法 |
MXPA05011284A (es) * | 2003-04-23 | 2006-01-24 | Starck H C Inc | Blancos de rayos x de alecion de molibdeno que tienen estructura de grano uniforme. |
US7228722B2 (en) * | 2003-06-09 | 2007-06-12 | Cabot Corporation | Method of forming sputtering articles by multidirectional deformation |
CN1836307A (zh) * | 2003-06-20 | 2006-09-20 | 卡伯特公司 | 溅镀靶安装到垫板上的方法和设计 |
CN101857950B (zh) * | 2003-11-06 | 2012-08-08 | Jx日矿日石金属株式会社 | 钽溅射靶 |
US20070144623A1 (en) * | 2004-02-18 | 2007-06-28 | Wickersham Charles E Jr | Ultrasonic method for detecting banding in metals |
ATE509129T1 (de) * | 2004-03-26 | 2011-05-15 | Starck H C Inc | Töpfe aus refraktärem metall |
US7666243B2 (en) | 2004-10-27 | 2010-02-23 | H.C. Starck Inc. | Fine grain niobium sheet via ingot metallurgy |
US7998287B2 (en) | 2005-02-10 | 2011-08-16 | Cabot Corporation | Tantalum sputtering target and method of fabrication |
CA2606478C (en) | 2005-05-05 | 2013-10-08 | H.C. Starck Gmbh | Method for coating a substrate surface and coated product |
JP4904341B2 (ja) * | 2005-05-05 | 2012-03-28 | ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング | スパッタターゲット及びx線アノードを製造又は再処理するための被覆方法 |
US20070044873A1 (en) | 2005-08-31 | 2007-03-01 | H. C. Starck Inc. | Fine grain niobium sheet via ingot metallurgy |
CZ308045B6 (cs) * | 2006-03-07 | 2019-11-20 | Cabot Corp | Způsob výroby kovového výrobku a kovová deska, vyrobená tímto způsobem |
JP4974362B2 (ja) * | 2006-04-13 | 2012-07-11 | 株式会社アルバック | Taスパッタリングターゲットおよびその製造方法 |
US20080078268A1 (en) * | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
US7776166B2 (en) * | 2006-12-05 | 2010-08-17 | Praxair Technology, Inc. | Texture and grain size controlled hollow cathode magnetron targets and method of manufacture |
US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
US8197894B2 (en) * | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
US9095885B2 (en) * | 2007-08-06 | 2015-08-04 | H.C. Starck Inc. | Refractory metal plates with improved uniformity of texture |
US8250895B2 (en) * | 2007-08-06 | 2012-08-28 | H.C. Starck Inc. | Methods and apparatus for controlling texture of plates and sheets by tilt rolling |
US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
US8043655B2 (en) * | 2008-10-06 | 2011-10-25 | H.C. Starck, Inc. | Low-energy method of manufacturing bulk metallic structures with submicron grain sizes |
CN101920436B (zh) * | 2010-08-20 | 2011-10-26 | 宁夏东方钽业股份有限公司 | 溅射钽环件用钽条的制备工艺 |
CN102021523A (zh) * | 2010-09-29 | 2011-04-20 | 吴江南玻华东工程玻璃有限公司 | 一种解决镀膜玻璃边缘效应的方法 |
US9412568B2 (en) | 2011-09-29 | 2016-08-09 | H.C. Starck, Inc. | Large-area sputtering targets |
CN102658346A (zh) * | 2012-04-06 | 2012-09-12 | 宁夏东方钽业股份有限公司 | 一种大规格钽靶材的锻造方法 |
CN102699247B (zh) * | 2012-05-18 | 2014-06-18 | 宁夏东方钽业股份有限公司 | 一种超导钽棒的锻造方法 |
CN103861982B (zh) * | 2012-12-18 | 2016-06-15 | 宁夏东方钽业股份有限公司 | 一种铌旋转靶材铸锭的锻造方法 |
CN104419901B (zh) * | 2013-08-27 | 2017-06-30 | 宁波江丰电子材料股份有限公司 | 一种钽靶材的制造方法 |
US20160208377A1 (en) * | 2014-03-27 | 2016-07-21 | Jx Nippon Mining & Metals Corporation | Tantalum sputtering target and method for producing same |
EP3129176A1 (en) | 2014-04-11 | 2017-02-15 | H.C. Starck Inc. | High purity refractory metal sputtering targets which have a uniform random texture manufactured by hot isostatic pressing high purity refractory metal powders |
WO2016104878A1 (ko) * | 2014-12-22 | 2016-06-30 | 국방과학연구소 | 탄탈륨의 미세조직 및 집합조직 제어방법 |
JP6293928B2 (ja) | 2015-05-22 | 2018-03-14 | Jx金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
US10658163B2 (en) * | 2015-05-22 | 2020-05-19 | Jx Nippon Mining & Metals Corporation | Tantalum sputtering target, and production method therefor |
SG11201810892XA (en) * | 2017-03-30 | 2019-01-30 | Jx Nippon Mining & Metals Corp | Tantalum sputtering target |
US11062889B2 (en) | 2017-06-26 | 2021-07-13 | Tosoh Smd, Inc. | Method of production of uniform metal plates and sputtering targets made thereby |
US20190161850A1 (en) * | 2017-11-30 | 2019-05-30 | Tosoh Smd, Inc. | Ultra-fine grain size tantalum sputtering targets with improved voltage performance and methods thereby |
CN113574203A (zh) * | 2019-03-26 | 2021-10-29 | Jx金属株式会社 | 铌溅射靶 |
CN110983218B (zh) * | 2019-12-25 | 2021-09-03 | 西部超导材料科技股份有限公司 | 一种组织均匀的小规格纯铌棒材的制备方法 |
CN112143990B (zh) * | 2020-09-04 | 2022-01-07 | 中国航发北京航空材料研究院 | 一种钛合金β相大尺寸单晶的制备方法 |
CN116288091A (zh) * | 2023-03-28 | 2023-06-23 | 南昌大学 | 一种低温制备超细晶粒钽片的退火工艺 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2603980B2 (ja) * | 1988-01-13 | 1997-04-23 | 株式会社東芝 | 高断熱性鋳鉄 |
JP2796752B2 (ja) * | 1990-04-27 | 1998-09-10 | 日本軽金属株式会社 | 耐食皮膜用Al―Ni―Si合金製スパッタリングターゲット |
JPH06264233A (ja) * | 1993-03-12 | 1994-09-20 | Nikko Kinzoku Kk | Tft製造用スパッタリングタ−ゲット |
JP2857015B2 (ja) * | 1993-04-08 | 1999-02-10 | 株式会社ジャパンエナジー | 高純度アルミニウムまたはその合金からなるスパッタリングターゲット |
US5590389A (en) * | 1994-12-23 | 1996-12-31 | Johnson Matthey Electronics, Inc. | Sputtering target with ultra-fine, oriented grains and method of making same |
US5850755A (en) * | 1995-02-08 | 1998-12-22 | Segal; Vladimir M. | Method and apparatus for intensive plastic deformation of flat billets |
JPH10235670A (ja) * | 1997-02-26 | 1998-09-08 | Tosoh Corp | ポリオレフィン樹脂連続気泡発泡体の製造方法 |
US6569270B2 (en) * | 1997-07-11 | 2003-05-27 | Honeywell International Inc. | Process for producing a metal article |
US6348139B1 (en) * | 1998-06-17 | 2002-02-19 | Honeywell International Inc. | Tantalum-comprising articles |
US6348113B1 (en) * | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
US6464809B2 (en) * | 1998-11-30 | 2002-10-15 | Outokumpu Oyj | Processes for producing articles with stress-free slit edges |
JP3079378B1 (ja) * | 1999-02-10 | 2000-08-21 | 東京タングステン株式会社 | Moスパッターリングターゲット材及びその製造方法 |
JP2001020065A (ja) * | 1999-07-07 | 2001-01-23 | Hitachi Metals Ltd | スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料 |
US6878250B1 (en) * | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
US6331233B1 (en) * | 2000-02-02 | 2001-12-18 | Honeywell International Inc. | Tantalum sputtering target with fine grains and uniform texture and method of manufacture |
DE60136351D1 (de) * | 2000-05-22 | 2008-12-11 | Cabot Corp | Hochreines niobmetall und erzeugnisse daraus und verfahren zu dessen herstellung |
-
2002
- 2002-02-20 KR KR1020037010851A patent/KR100966682B1/ko active IP Right Grant
- 2002-02-20 HU HU0303269A patent/HUP0303269A3/hu unknown
- 2002-02-20 JP JP2002570787A patent/JP4327460B2/ja not_active Expired - Lifetime
- 2002-02-20 ES ES02726582T patent/ES2272707T3/es not_active Expired - Lifetime
- 2002-02-20 CN CNA200510128891XA patent/CN1789476A/zh active Pending
- 2002-02-20 CA CA002438819A patent/CA2438819A1/en not_active Abandoned
- 2002-02-20 IL IL15727902A patent/IL157279A0/xx unknown
- 2002-02-20 US US10/079,286 patent/US20020112789A1/en not_active Abandoned
- 2002-02-20 CZ CZ20032246A patent/CZ20032246A3/cs unknown
- 2002-02-20 AT AT02726582T patent/ATE339532T1/de active
- 2002-02-20 CN CNB028051009A patent/CN1238547C/zh not_active Expired - Fee Related
- 2002-02-20 DE DE60214683T patent/DE60214683T2/de not_active Expired - Lifetime
- 2002-02-20 PT PT02726582T patent/PT1366203E/pt unknown
- 2002-02-20 BR BR0207384-6A patent/BR0207384A/pt not_active Application Discontinuation
- 2002-02-20 NZ NZ527628A patent/NZ527628A/en unknown
- 2002-02-20 WO PCT/US2002/005033 patent/WO2002070765A1/en active IP Right Grant
- 2002-02-20 MX MXPA03007490A patent/MXPA03007490A/es active IP Right Grant
- 2002-02-20 EP EP02726582A patent/EP1366203B1/en not_active Revoked
- 2002-02-20 AU AU2002257005A patent/AU2002257005B2/en not_active Expired - Fee Related
-
2003
- 2003-08-11 NO NO20033547A patent/NO20033547L/no not_active Application Discontinuation
- 2003-08-18 ZA ZA200306399A patent/ZA200306399B/en unknown
-
2004
- 2004-12-10 HK HK04109794A patent/HK1066833A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004526863A (ja) | 2004-09-02 |
KR20030090645A (ko) | 2003-11-28 |
KR100966682B1 (ko) | 2010-06-29 |
CN1535322A (zh) | 2004-10-06 |
NO20033547L (no) | 2003-09-26 |
EP1366203B1 (en) | 2006-09-13 |
ZA200306399B (en) | 2004-08-18 |
EP1366203A1 (en) | 2003-12-03 |
CZ20032246A3 (cs) | 2004-03-17 |
EP1366203A4 (en) | 2004-07-28 |
HUP0303269A3 (en) | 2004-05-28 |
CN1789476A (zh) | 2006-06-21 |
CA2438819A1 (en) | 2002-09-12 |
AU2002257005B2 (en) | 2007-05-31 |
PT1366203E (pt) | 2006-12-29 |
BR0207384A (pt) | 2004-02-10 |
ATE339532T1 (de) | 2006-10-15 |
DE60214683D1 (de) | 2006-10-26 |
JP4327460B2 (ja) | 2009-09-09 |
NO20033547D0 (no) | 2003-08-11 |
ES2272707T3 (es) | 2007-05-01 |
NZ527628A (en) | 2004-07-30 |
HK1066833A1 (en) | 2005-04-01 |
CN1238547C (zh) | 2006-01-25 |
DE60214683T2 (de) | 2007-09-13 |
HUP0303269A2 (hu) | 2004-01-28 |
US20020112789A1 (en) | 2002-08-22 |
IL157279A0 (en) | 2004-02-19 |
WO2002070765A1 (en) | 2002-09-12 |
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Legal Events
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FG | Grant or registration |