KR910020873A - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR910020873A
KR910020873A KR1019910007554A KR910007554A KR910020873A KR 910020873 A KR910020873 A KR 910020873A KR 1019910007554 A KR1019910007554 A KR 1019910007554A KR 910007554 A KR910007554 A KR 910007554A KR 910020873 A KR910020873 A KR 910020873A
Authority
KR
South Korea
Prior art keywords
semiconductor device
bent
soldering
sealed
external lead
Prior art date
Application number
KR1019910007554A
Other languages
English (en)
Other versions
KR940008324B1 (ko
Inventor
야스히로 무라자와
나라시 도다
히로시 사와노
히데아로 미다시
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR910020873A publication Critical patent/KR910020873A/ko
Application granted granted Critical
Publication of KR940008324B1 publication Critical patent/KR940008324B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 한 실시예에 의한 반도체장치를 표시하는 요부측면도, 제2도는 이 발명의 별도의 발명의 한 실시예에 의한 반도체 장치를 표시하는 요부측면도, 제3도 및 제4도는 제2도에 표시한 반도체장치의 다른 실시예에 의한 반도체장치를 표시하는 요부측면도.

Claims (4)

  1. 반도체소자 및 이 반도체소자에 전기적으로 접속되어 외부에 돌출한 외부리드를 수지로 봉하여 막은 표면 실장형의 반도체장치이고, 상기 외부리드는 상기 반도체 장치의 납땜측과 반대방향으로 돌기하도록 절곡되고 또한 절곡된 외부리드의 길이는 상기 반도체장치의 외브리드 매설부로부터 상기 반도체장치의 저부까지의 길이보다 긴것을 특징으로 하는 반도체 장치.
  2. 반도체소자 및 이 반도체소자에 전기적으로 접속되어 외부에 돌출한 외부리드를 수지로 봉하여 막은 표면 실장형의 반도체장치이고, 상기 외부리드는 상기 반도체 장치의 납땜측과 역J자형으로 절곡된 것을 특징으로 하는 반도체 장치.
  3. 제2항에 있어서, 역 J자형으로 절곡된 외부리드의 선단은 납땜측과 역방향으로 반도체장치의 상면까지 뻗고, 반도체장치의 상하양면에 납땜을 가능하게 한것을 특징으로 하는 반도체 장치.
  4. 제3항에 있어서, 반도체장치의 상면가지 뻗은 외부리드의 선단은 반도체장치의 위쪽으로 돌출하도록 절곡된 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910007554A 1990-05-18 1991-05-10 반도체장치 KR940008324B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-126981 1990-05-18
JP2126981A JPH0423460A (ja) 1990-05-18 1990-05-18 半導体装置

Publications (2)

Publication Number Publication Date
KR910020873A true KR910020873A (ko) 1991-12-20
KR940008324B1 KR940008324B1 (ko) 1994-09-12

Family

ID=14948695

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910007554A KR940008324B1 (ko) 1990-05-18 1991-05-10 반도체장치

Country Status (3)

Country Link
US (1) US5055912A (ko)
JP (1) JPH0423460A (ko)
KR (1) KR940008324B1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634351B2 (ja) * 1991-04-23 1997-07-23 三菱電機株式会社 半導体装置
MY109101A (en) * 1992-05-25 1996-12-31 Hitachi Ltd Thin type semiconductor device, module structure using the device and method of mounting the device on board
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
EP1565045B1 (en) * 2004-02-12 2010-08-25 Askoll Holding S.r.l. Discrete electronic component and related assembling method
JP2015176907A (ja) 2014-03-13 2015-10-05 ルネサスエレクトロニクス株式会社 半導体装置
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール
JP2016062904A (ja) 2014-09-12 2016-04-25 株式会社東芝 半導体装置
US9647363B2 (en) * 2014-09-19 2017-05-09 Intel Corporation Techniques and configurations to control movement and position of surface mounted electrical devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181149A (en) * 1981-05-01 1982-11-08 Toshiba Corp Electronic part and mounting therefor
JPS6216552A (ja) * 1985-03-28 1987-01-24 Oki Electric Ind Co Ltd 半導体装置
JPS63199453A (ja) * 1987-02-16 1988-08-17 Hitachi Ltd 半導体装置
JPH01262651A (ja) * 1988-04-13 1989-10-19 Mitsubishi Electric Corp 半導体装置用パッケージ

Also Published As

Publication number Publication date
JPH0423460A (ja) 1992-01-27
US5055912A (en) 1991-10-08
KR940008324B1 (ko) 1994-09-12

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