KR910007094A - 수지밀봉형 반도체장치 - Google Patents
수지밀봉형 반도체장치 Download PDFInfo
- Publication number
- KR910007094A KR910007094A KR1019900014334A KR900014334A KR910007094A KR 910007094 A KR910007094 A KR 910007094A KR 1019900014334 A KR1019900014334 A KR 1019900014334A KR 900014334 A KR900014334 A KR 900014334A KR 910007094 A KR910007094 A KR 910007094A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- bed portion
- lead
- semiconductor substrate
- metal
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000011347 resin Substances 0.000 title claims 3
- 229920005989 resin Polymers 0.000 title claims 3
- 239000002184 metal Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2 도는 본 발명에 따른 수지 밀봉형 반도체 장치의 탑재된 상태를 나타낸 상면도.
Claims (1)
- 반도체 기판(10)에 형성되는 전극(11)과 이 반도체 기판(10)에 고착되는 금속제 베드부, 반도체 기판(10)의 전극층에 전기적으로 접속되는 금속세선(12), 이 금속세선(12)에 전기적으로 접속되며 상기 금속제 베드부 끝단에 대향하여 배치되는 리이드(13), 금속제 베드부에 형성되는 복스의 각부, 이들을 피복하는 밀봉 수지층을 구비하고 있으며, 금속제 베드부에 형성되는 서로 대향하는 각부에 근접하는 리이드 간격이 다른 리이드 간격보다 넓게 되어 있는 것을 특징으로 하는 수지 밀봉형 반도체 장치.※ 참고 사항 : 최초 출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94002040U KR940003288Y1 (en) | 1989-09-12 | 1994-02-03 | Plastic packaged semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-236408 | 1989-09-12 | ||
JP1236408A JP2637247B2 (ja) | 1989-09-12 | 1989-09-12 | 樹脂封止型半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910007094A true KR910007094A (ko) | 1991-04-30 |
Family
ID=17000314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900014334A KR910007094A (ko) | 1989-09-12 | 1990-09-12 | 수지밀봉형 반도체장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5045919A (ko) |
EP (1) | EP0419941B1 (ko) |
JP (1) | JP2637247B2 (ko) |
KR (1) | KR910007094A (ko) |
DE (1) | DE69024731T2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310526A (en) * | 1990-10-30 | 1994-05-10 | The Dow Chemical Company | Chemical sensor |
US5245214A (en) * | 1991-06-06 | 1993-09-14 | Northern Telecom Limited | Method of designing a leadframe and a leadframe created thereby |
JP2526787B2 (ja) * | 1993-07-01 | 1996-08-21 | 日本電気株式会社 | 半導体装置用リ―ドフレ―ム |
US5684332A (en) * | 1994-05-27 | 1997-11-04 | Advanced Semiconductor Engineering, Inc. | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom |
JPH09312375A (ja) * | 1996-03-18 | 1997-12-02 | Hitachi Ltd | リードフレーム、半導体装置及び半導体装置の製造方法 |
US6909179B2 (en) * | 1996-03-18 | 2005-06-21 | Renesas Technology Corp. | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
US5780772A (en) * | 1997-01-24 | 1998-07-14 | National Semiconductor Corporation | Solution to mold wire sweep in fine pitch devices |
KR100265461B1 (ko) * | 1997-11-21 | 2000-09-15 | 윤종용 | 더미본딩와이어를포함하는반도체집적회로소자 |
US6297078B1 (en) * | 1997-12-31 | 2001-10-02 | Intel Corporation | Integrated circuit package with bond wires at the corners of an integrated circuit |
US6444295B1 (en) * | 1998-12-29 | 2002-09-03 | Industrial Technology Research Institute | Method for improving integrated circuits bonding firmness |
US6225685B1 (en) * | 2000-04-05 | 2001-05-01 | Advanced Micro Devices, Inc. | Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins |
KR100642748B1 (ko) * | 2004-07-24 | 2006-11-10 | 삼성전자주식회사 | 리드 프레임과 패키지 기판 및 이들을 이용한 패키지 |
US8035188B2 (en) | 2004-07-28 | 2011-10-11 | Panasonic Corporation | Semiconductor device |
US20060220191A1 (en) * | 2005-04-01 | 2006-10-05 | Honeywell International Inc. | Electronic package with a stepped-pitch leadframe |
CN100573841C (zh) * | 2005-08-01 | 2009-12-23 | 松下电器产业株式会社 | 半导体装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5385541A (en) * | 1977-01-07 | 1978-07-28 | Hitachi Metals Ltd | Exhaust heat recovery system for industial firing furnace |
JPS5479563A (en) * | 1977-12-07 | 1979-06-25 | Kyushu Nippon Electric | Lead frame for semiconductor |
EP0078606A3 (en) * | 1981-11-02 | 1985-04-24 | Texas Instruments Incorporated | A semiconductor assembly with wire support |
JPS6046041A (ja) * | 1983-08-24 | 1985-03-12 | Nec Corp | 半導体装置 |
JPS60171734A (ja) * | 1984-02-17 | 1985-09-05 | Hitachi Ltd | 半導体装置 |
JPS62500338A (ja) * | 1984-09-27 | 1987-02-05 | モトロ−ラ・インコ−ポレ−テッド | 支持リ−ドの改良された構造をもつリ−ドフレ−ムおよびこれを用いる半導体装置 |
JPS6195559A (ja) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | リ−ドフレ−ム及びそれを用いた半導体装置 |
JPS63126257A (ja) * | 1986-11-17 | 1988-05-30 | Hitachi Ltd | 半導体装置 |
JPS63239831A (ja) * | 1987-03-27 | 1988-10-05 | Toshiba Corp | 半導体装置の製造方法 |
JPH0216565A (ja) * | 1988-07-05 | 1990-01-19 | Mitsubishi Electric Corp | 感光性樹脂組成物 |
JPH01315149A (ja) * | 1988-08-05 | 1989-12-20 | Hitachi Ltd | 半導体装置の製造方法 |
-
1989
- 1989-09-12 JP JP1236408A patent/JP2637247B2/ja not_active Expired - Fee Related
-
1990
- 1990-09-10 US US07/579,664 patent/US5045919A/en not_active Expired - Lifetime
- 1990-09-12 EP EP90117548A patent/EP0419941B1/en not_active Expired - Lifetime
- 1990-09-12 KR KR1019900014334A patent/KR910007094A/ko not_active Application Discontinuation
- 1990-09-12 DE DE69024731T patent/DE69024731T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0399445A (ja) | 1991-04-24 |
EP0419941A2 (en) | 1991-04-03 |
DE69024731T2 (de) | 1996-06-27 |
EP0419941A3 (en) | 1992-10-07 |
JP2637247B2 (ja) | 1997-08-06 |
US5045919A (en) | 1991-09-03 |
DE69024731D1 (de) | 1996-02-22 |
EP0419941B1 (en) | 1996-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
WICV | Withdrawal of application forming a basis of a converted application |