KR890012380A - 전자 소자 패키지 및 제조방법 - Google Patents
전자 소자 패키지 및 제조방법 Download PDFInfo
- Publication number
- KR890012380A KR890012380A KR1019880017869A KR880017869A KR890012380A KR 890012380 A KR890012380 A KR 890012380A KR 1019880017869 A KR1019880017869 A KR 1019880017869A KR 880017869 A KR880017869 A KR 880017869A KR 890012380 A KR890012380 A KR 890012380A
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- base end
- electronic device
- distal end
- leads
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 한 형태로 이용될 수 있는 몰드의 간단한 투시도.
제3도는 제2도의 몰드를 이용하여 만든 본 발명의 전자 소자 패키지 실시예의 3/4 사시도.
제4도는 본 발명의 패키지에 대한 다른 변형의 캐리어 구조와 조화된 리드 프레임의 말단부에 대한 단면도.
Claims (2)
- 캐리어 구조를 가진 전자 소자 패키지에 있어서, 전자 소자 결합 영역 주변에서 결합 영역 근처의 기부 단부, 결합 영역에서 떨어진 말단부 및 기부 단부와 말단부 사이의 중간 부분을 가진 각 리드로 다수의 리드를 구비하는 리드 프레임과, 리드 프레임에서 리드이 기부 단부에 결합된 전자 소자와, 각각의 리드에 대해 기부 단부의 적어도 일부분 및 전자 소자에 걸쳐 제1재료로 구성된 패키지 본체와, 적어도 몇몇의 리드에 대해 말단부의 적어도 일부분에 걸쳐 제2재료가 제1재료와 다른 재료로 구성된 캐리어 구조를 구비하며, 리드에 대한 중간 부분의 적어도 일부분이 어떤 재료로 덮여지지 않고 노출되어 있는 것을 특징으로 하는 캐리어 구조를 가진 전자 소자 패키지.
- 키리어 구조를 가진 전자 소자 패키지를 제조하는 방법에 있어서, 전자 소자 결함 영역 주변에서 결합 영역 근처의 기부 단부, 결합영역에서 떨어진 말단부 및 기부 단부와 말단부 사이의 중간 부분을 가진 각 리드로 다수의 리드를 구비하는 리드 프레임을 제공하는 단계와, 리드 프레임에서 리드의 기부 단부에 결합된 전자 소자 결합하는 단계와, 각각의 리드에 대해 기부 단부의 적어도 일부분 및 전자 소자에 걸쳐 제1재료로 구성된 패키지 본체를 제공하는 단계와, 적어도 몇몇의 리드에 대해 말단부의 적어도 일부분에 걸쳐 제2재료가 제1재료와 다른 재료로 구성된 캐리어 구조를 제공하는 단계를 구비하며, 리드에 대한 중간 부분의 적어도 일부분이 어떤 재료로 덮여지지 않고 노출되어 있는 것을 특징으로 하는 캐리어 구조를 가진 전자 소자 패키지 제조방법.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/141,013 US4837184A (en) | 1988-01-04 | 1988-01-04 | Process of making an electronic device package with peripheral carrier structure of low-cost plastic |
US141,013 | 1988-01-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890012380A true KR890012380A (ko) | 1989-08-26 |
KR970006531B1 KR970006531B1 (ko) | 1997-04-29 |
Family
ID=22493764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880017869A KR970006531B1 (ko) | 1988-01-04 | 1988-12-30 | 전자 소자 패키지 및 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4837184A (ko) |
JP (1) | JP2553924B2 (ko) |
KR (1) | KR970006531B1 (ko) |
GB (1) | GB2213640B (ko) |
HK (1) | HK87795A (ko) |
MY (1) | MY103475A (ko) |
SG (1) | SG30558G (ko) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234866A (en) * | 1985-03-25 | 1993-08-10 | Hitachi, Ltd. | Semiconductor device and process for producing the same, and lead frame used in said process |
JPH065637Y2 (ja) * | 1988-02-12 | 1994-02-09 | コーア株式会社 | チップ部品 |
US5260601A (en) * | 1988-03-14 | 1993-11-09 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
US5182631A (en) * | 1988-04-15 | 1993-01-26 | Nippon Telegraph And Telephone Corporation | Film carrier for RF IC |
US5344600A (en) * | 1989-06-07 | 1994-09-06 | Motorola, Inc. | Method for encapsulating semiconductor devices with package bodies |
US5023202A (en) * | 1989-07-14 | 1991-06-11 | Lsi Logic Corporation | Rigid strip carrier for integrated circuits |
US5150196A (en) * | 1989-07-17 | 1992-09-22 | Hughes Aircraft Company | Hermetic sealing of wafer scale integrated wafer |
US5115912A (en) * | 1990-03-27 | 1992-05-26 | R. H. Murphy Co., Inc. | Electrical component carrier with shock absorbing means |
US5114880A (en) * | 1990-06-15 | 1992-05-19 | Motorola, Inc. | Method for fabricating multiple electronic devices within a single carrier structure |
US5036381A (en) * | 1990-06-15 | 1991-07-30 | Motorola, Inc. | Multiple electronic devices within a single carrier structure |
KR940002444B1 (ko) * | 1990-11-13 | 1994-03-24 | 금성일렉트론 주식회사 | 반도체 소자의 패키지 어셈블리 방법 |
JPH081917B2 (ja) * | 1991-01-22 | 1996-01-10 | 株式会社東芝 | フィルムキャリアテ−プ |
US5132773A (en) * | 1991-02-06 | 1992-07-21 | Olin Corporation | Carrier ring having first and second ring means with bonded surfaces |
US5175007A (en) * | 1991-05-28 | 1992-12-29 | Motorola, Inc. | Mold assembly with separate encapsulating cavities |
US5213748A (en) * | 1991-06-27 | 1993-05-25 | At&T Bell Laboratories | Method of molding a thermoplastic ring onto a leadframe |
US5210375A (en) * | 1991-06-28 | 1993-05-11 | Vlsi Technology, Inc. | Electronic device package--carrier assembly ready to be mounted onto a substrate |
US5221812A (en) * | 1991-06-28 | 1993-06-22 | Vlsi Technology, Inc. | System for protecting leads to a semiconductor chip package during testing, burn-in and handling |
JPH05243455A (ja) * | 1992-03-02 | 1993-09-21 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5256598A (en) * | 1992-04-15 | 1993-10-26 | Micron Technology, Inc. | Shrink accommodating lead frame |
US5352633A (en) * | 1992-06-02 | 1994-10-04 | Texas Instruments Incorporated | Semiconductor lead frame lead stabilization |
JP2763234B2 (ja) * | 1992-06-23 | 1998-06-11 | 株式会社東芝 | 半導体装置 |
US5359225A (en) * | 1992-11-06 | 1994-10-25 | Intel Corporation | Thin, high leadcount package |
GB2274351A (en) * | 1993-01-19 | 1994-07-20 | Digital Equipment Int | I.C.Chip carriers |
US5661900A (en) * | 1994-03-07 | 1997-09-02 | Texas Instruments Incorporated | Method of fabricating an ultrasonically welded plastic support ring |
US6518088B1 (en) * | 1994-09-23 | 2003-02-11 | Siemens N.V. And Interuniversitair Micro-Electronica Centrum Vzw | Polymer stud grid array |
US5929517A (en) | 1994-12-29 | 1999-07-27 | Tessera, Inc. | Compliant integrated circuit package and method of fabricating the same |
US5696033A (en) * | 1995-08-16 | 1997-12-09 | Micron Technology, Inc. | Method for packaging a semiconductor die |
US5608359A (en) * | 1995-10-10 | 1997-03-04 | Motorola, Inc. | Function-differentiated temperature compensated crystal oscillator and method of producing the same |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
JP2933554B2 (ja) * | 1996-11-28 | 1999-08-16 | 九州日本電気株式会社 | 半導体装置およびその製造方法 |
GB2320132A (en) * | 1996-12-04 | 1998-06-10 | Ibm | Handling electronic modules |
US5821607A (en) * | 1997-01-08 | 1998-10-13 | Orient Semiconductor Electronics, Ltd. | Frame for manufacturing encapsulated semiconductor devices |
US5888849A (en) * | 1997-04-07 | 1999-03-30 | International Business Machines Corporation | Method for fabricating an electronic package |
US6271102B1 (en) * | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
US6977440B2 (en) * | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
US7335995B2 (en) * | 2001-10-09 | 2008-02-26 | Tessera, Inc. | Microelectronic assembly having array including passive elements and interconnects |
AU2002337834A1 (en) * | 2001-10-09 | 2003-04-22 | Tessera, Inc. | Stacked packages |
US6891276B1 (en) * | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
DE10348253B3 (de) * | 2003-10-16 | 2005-02-17 | Robert Bosch Gmbh | Verfahren zum Einkleben eines Chips in ein Premold-Gehäuse und zugehöringe Vorrichtung |
CN101295660B (zh) * | 2007-04-29 | 2011-03-23 | 中芯国际集成电路制造(上海)有限公司 | 芯片封装块定位装置、固定装置和解封装装置 |
US8319247B2 (en) * | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3267335A (en) * | 1963-08-14 | 1966-08-16 | Texas Instruments Inc | Carrying fixture for miniature circuit components |
US4102039A (en) * | 1977-02-14 | 1978-07-25 | Motorola, Inc. | Method of packaging electronic components |
JPS5519817A (en) * | 1978-07-28 | 1980-02-12 | Hitachi Ltd | Integrated circuit lead protecting device |
JPS60195959A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | リ−ドフレ−ムおよびその製造方法 |
US4701781A (en) * | 1984-07-05 | 1987-10-20 | National Semiconductor Corporation | Pre-testable semiconductor die package |
-
1988
- 1988-01-04 US US07/141,013 patent/US4837184A/en not_active Expired - Fee Related
- 1988-11-16 MY MYPI88001303A patent/MY103475A/en unknown
- 1988-12-21 SG SG1995904090A patent/SG30558G/en unknown
- 1988-12-21 GB GB8829795A patent/GB2213640B/en not_active Expired - Lifetime
- 1988-12-23 JP JP63323841A patent/JP2553924B2/ja not_active Expired - Lifetime
- 1988-12-30 KR KR1019880017869A patent/KR970006531B1/ko not_active IP Right Cessation
-
1995
- 1995-06-01 HK HK87795A patent/HK87795A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US4837184A (en) | 1989-06-06 |
SG30558G (en) | 1995-09-18 |
HK87795A (en) | 1995-06-09 |
JP2553924B2 (ja) | 1996-11-13 |
GB2213640B (en) | 1992-03-18 |
KR970006531B1 (ko) | 1997-04-29 |
GB8829795D0 (en) | 1989-02-15 |
MY103475A (en) | 1993-06-30 |
GB2213640A (en) | 1989-08-16 |
JPH01206658A (ja) | 1989-08-18 |
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FPAY | Annual fee payment |
Payment date: 20000329 Year of fee payment: 4 |
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LAPS | Lapse due to unpaid annual fee |