KR101737680B1 - 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법 - Google Patents

기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법 Download PDF

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Publication number
KR101737680B1
KR101737680B1 KR1020147016863A KR20147016863A KR101737680B1 KR 101737680 B1 KR101737680 B1 KR 101737680B1 KR 1020147016863 A KR1020147016863 A KR 1020147016863A KR 20147016863 A KR20147016863 A KR 20147016863A KR 101737680 B1 KR101737680 B1 KR 101737680B1
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KR
South Korea
Prior art keywords
illumination
optical system
projection
substrate
plane
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KR1020147016863A
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English (en)
Korean (ko)
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KR20140109892A (ko
Inventor
마사키 가토
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가부시키가이샤 니콘
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/22—Telecentric objectives or lens systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/008—Systems specially adapted to form image relays or chained systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G02B17/0804—Catadioptric systems using two curved mirrors
    • G02B17/0812—Catadioptric systems using two curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020147016863A 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법 KR101737680B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011278290 2011-12-20
JPJP-P-2011-278290 2011-12-20
JP2012024058 2012-02-07
JPJP-P-2012-024058 2012-02-07
PCT/JP2012/076326 WO2013094286A1 (ja) 2011-12-20 2012-10-11 基板処理装置、デバイス製造システム、及びデバイス製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020177010558A Division KR101849508B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010559A Division KR101848590B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20140109892A KR20140109892A (ko) 2014-09-16
KR101737680B1 true KR101737680B1 (ko) 2017-05-18

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Family Applications (5)

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KR1020187034105A KR101961605B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020147016863A KR101737680B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020187009744A KR101924309B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010558A KR101849508B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010559A KR101848590B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

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KR1020187034105A KR101961605B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

Family Applications After (3)

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KR1020187009744A KR101924309B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010558A KR101849508B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010559A KR101848590B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

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JP (6) JP6056770B2 (zh)
KR (5) KR101961605B1 (zh)
CN (3) CN105425553B (zh)
TW (5) TWI648601B (zh)
WO (1) WO2013094286A1 (zh)

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KR101961605B1 (ko) * 2011-12-20 2019-03-22 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR101880792B1 (ko) * 2012-07-13 2018-07-20 가부시키가이샤 니콘 기판 처리 장치 및 디바이스 제조 방법
JP6160620B2 (ja) * 2012-08-06 2017-07-12 株式会社ニコン 処理装置およびデバイス製造方法
CN104885012B (zh) * 2012-11-06 2017-07-28 株式会社尼康 偏振光分束器、基板处理装置、器件制造***及器件制造方法
JP6217651B2 (ja) * 2012-12-18 2017-10-25 株式会社ニコン 基板処理装置、デバイス製造システム及びデバイス製造方法
CN110451316B (zh) * 2014-09-04 2021-01-05 株式会社尼康 基板处理装置
TW201624142A (zh) * 2014-09-26 2016-07-01 Orc Mfg Co Ltd 直接曝光裝置
CN106292187A (zh) * 2015-05-13 2017-01-04 鸿富锦精密工业（深圳）有限公司 曝光方法
US10983389B2 (en) 2016-03-04 2021-04-20 Applied Materials, Inc. Wire grid polarizer manufacturing method
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
EP3485322A4 (en) * 2016-07-15 2020-08-19 Light Field Lab, Inc. SELECTIVE PROPAGATION OF ENERGY IN A LUMINOUS FIELD AND HOLOGRAPHIC WAVE GUIDE NETWORKS
KR101856500B1 (ko) * 2016-07-26 2018-06-21 재단법인 대구경북첨단의료산업진흥재단 레이저 가공된 포토마스크를 이용한 미세유체칩 제조방법
AU2019206621A1 (en) 2018-01-14 2020-07-30 Light Field Lab, Inc. Systems and methods for transverse energy localization in energy relays using ordered structures
DE102019128198B3 (de) * 2019-10-18 2021-02-25 Laser Imaging Systems Gmbh Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat
TWI730831B (zh) * 2020-07-02 2021-06-11 光群雷射科技股份有限公司 增亮膜的轉印式製造方法及增亮膜
JP2022023357A (ja) 2020-07-27 2022-02-08 デンカ株式会社 シグナルの低下を改善した検査試薬

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TW201333638A (zh) 2013-08-16
TW201921163A (zh) 2019-06-01
JP2019113867A (ja) 2019-07-11
KR101924309B1 (ko) 2018-11-30
JPWO2013094286A1 (ja) 2015-04-27
KR101849508B1 (ko) 2018-05-28
KR20170046189A (ko) 2017-04-28
KR20180038586A (ko) 2018-04-16
TW202024810A (zh) 2020-07-01
JP6677333B2 (ja) 2020-04-08
TW201921162A (zh) 2019-06-01
JP2017045074A (ja) 2017-03-02
JP6927348B2 (ja) 2021-08-25
JP6323542B2 (ja) 2018-05-16
TWI691805B (zh) 2020-04-21
KR20170045389A (ko) 2017-04-26
KR20140109892A (ko) 2014-09-16
CN107255858A (zh) 2017-10-17
JP6436216B2 (ja) 2018-12-12
WO2013094286A1 (ja) 2013-06-27
TW201727387A (zh) 2017-08-01
JP2018028697A (ja) 2018-02-22
KR101961605B1 (ko) 2019-03-22
CN104011597A (zh) 2014-08-27
TWI668526B (zh) 2019-08-11
TWI709830B (zh) 2020-11-11
CN105425553B (zh) 2018-08-28
JP6056770B2 (ja) 2017-01-11
KR101848590B1 (ko) 2018-04-12
CN107255858B (zh) 2020-05-29
KR20180128523A (ko) 2018-12-03
JP2020126241A (ja) 2020-08-20
TWI585541B (zh) 2017-06-01
CN104011597B (zh) 2017-05-10
JP2018049286A (ja) 2018-03-29
CN105425553A (zh) 2016-03-23
JP6512265B2 (ja) 2019-05-15
TWI648601B (zh) 2019-01-21

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