KR100966985B1 - 전자 부품 포장용 커버 테이프 및 전자 부품 포장체 - Google Patents
전자 부품 포장용 커버 테이프 및 전자 부품 포장체 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
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- Y10T428/24975—No layer or component greater than 5 mils thick
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
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Abstract
전자 부품 포장용 캐리어 테이프에 열 봉지할 수 있는 전자 부품 포장용 커버 테이프로서 적어도 기재층, 쿠션층, 수지 B로 이루어진 열 봉지 추종층 및 열 봉지층이 이 순서에 적층되고, 상기 수지 A의 ISO306에 의해 측정한 비캇트 연화점 온도 Ta(승온 속도: 50℃/시, 하중: 10N)와 상기 수지 B의 ISO306에 의해 측정한 비캇트 연화점 온도 Tb(승온 속도: 50℃/시, 하중: 10N)가 하기 관계식 1을 만족시키고, 상기 열 봉지 추종층의 두께가 2㎛ 이상 15㎛ 이하인 전자 부품 포장용 커버 테이프.
관계식 1: Ta-Tb≥3(℃)
Description
[도 2] 도 2는 2층으로 이루어지는 기재층을 설치한 전자 부품 포장용 커버 테이프의 일례를 나타내는 개략 단면도이다.
[도 3] 도 3은 본 발명에 관한 전자 부품 포장용 커버 테이프와 캐리어 테이프의 열 봉지시의 상태의 일례를 나타내는 개략 단면도이다.
[도 4] 도 4는 본 발명에 관한 전자 부품 포장용 커버 테이프를 캐리어 테이프로부터 박리한 후의 상태의 일례를 나타내는 개략 단면도이다.
[도 5] 도 5는 본 발명에 관한 전자 부품 포장용 커버 테이프를 열 봉지한 전자 부품 포장체의 일례를 나타내는 사시도이다.
비캇트 연화점 | 휨 탄성율 | 분자량 분포 | |
℃ | MPa | ||
메탈로센 LLDPE 1 | 98 | 240 | 4.5 |
메탈로센 LLDPE 2 | 104 | 240 | 2.5 |
메탈로센 LLDPE 3 | 96 | 190 | 2.5 |
메탈로센 LLDPE 4 | 84 | 130 | 4.5 |
메탈로센 LLDPE 5 | 83 | 120 | 2.5 |
메탈로센 LLDPE 6 | 92 | 140 | 2.5 |
조성 | 실시예 1 | 실시예 2 | 실시예 3 | |
기재층 1 | 재료 | 2축 연신 PET | 2축 연신 PET | 2축 연신 PET |
두께(㎛) | (12) | (12) | (12) | |
기재층 2 | 재료 | 2축 연신 6 나일론 | 2축 연신 6 나일론 | 2축 연신 6 나일론 |
두께(㎛) | (12) | (12) | (12) | |
쿠션층 | 재료 | 메탈로센 LLDPE1 | 메탈로센 LLDPE3 | 메탈로센 LLDPE3 |
두께(㎛) | (20) | (20) | (15) | |
열 봉지 추종층 | 재료 | 메탈로센 LLDPE4 | 메탈로센 LLDPE5 | 메탈로센 LLDPE5 |
두께(㎛) | (5) | (5) | (10) | |
열 봉지층 | 재료 | 아크릴 수지 | 아크릴 수지 | 아크릴 수지 |
두께(㎛) | (0.5) | (0.5) | (0.5) | |
Ta-Tb | ℃ | 14 | 13 | 13 |
열 봉지 조건 1 | 박리 강도 | ◎ | ◎ | ◎ |
박리 범위 | ○ | ◎ | ◎ | |
막대 오염 | ◎ | ◎ | ○ | |
열 봉지 조건 2 | 박리 강도 | ○ | ○ | ○ |
박리 범위 | ◎ | ◎ | ◎ | |
막대 오염 | ◎ | ◎ | ○ |
조성 | 실시예 4 | 실시예 5 | 실시예 6 | |
기재층 1 | 재료 | 2축 연신 PET | 2축 연신 PET | 2축 연신 PET |
두께(㎛) | (25) | (25) | (25) | |
기재층 2 | 재료 | - | - | - |
두께(㎛) | - | - | - | |
쿠션층 | 재료 | 메탈로센 LLDPE2 | 메탈로센 LLDPE2 | 메탈로센 LLDPE3 |
두께(㎛) | (20) | (15) | (15) | |
열 봉지 추종층 | 재료 | 메탈로센 LLDPE6 | 메탈로센 LLDPE6 | 메탈로센 LLDPE6 |
두께(㎛) | (5) | (10) | (10) | |
열 봉지층 | 재료 | 아크릴 수지 | 아크릴 수지 | 아크릴 수지 |
두께(㎛) | (0.5) | (0.5) | (0.5) | |
Ta-Tb | ℃ | 12 | 12 | 4 |
열 봉지 조건 1 | 박리 강도 | △ | △ | △ |
박리 범위 | ○ | ○ | ◎ | |
막대 오염 | ◎ | ◎ | ○ | |
열 봉지 조건 2 | 박리 강도 | ◎ | ◎ | ◎ |
박리 범위 | ◎ | ◎ | ◎ | |
막대 오염 | ◎ | ○ | △ |
조성 | 비교예 1 | 비교예 2 | 비교예 3 | |
기재층 1 | 재료 | 2축 연신 PET | 2축 연신 PET | 2축 연신 PET |
두께(㎛) | (25) | (25) | (25) | |
기재층 2 | 재료 | - | - | - |
두께(㎛) | - | - | - | |
쿠션층 | 재료 | - | 메탈로센 LLDPE3 | 메탈로센 LLDPE2 |
두께(㎛) | - | (5) | (25) | |
열 봉지 추종층 | 재료 | 메탈로센 LLDPE5 | 메탈로센 LLDPE5 | - |
두께(㎛) | (25) | (20) | - | |
열 봉지층 | 재료 | 아크릴 수지 | 아크릴 수지 | 아크릴 수지 |
두께(㎛) | (0.5) | (0.5) | (0.5) | |
Ta-Tb | ℃ | - | 13 | - |
열 봉지 조건 1 | 박리 강도 | ◎ | ◎ | × |
박리 범위 | ◎ | ◎ | ○ | |
막대 오염 | × | × | ◎ | |
열 봉지 조건 2 | 박리 강도 | ○ | ○ | △ |
박리 범위 | ◎ | ○ | × | |
막대 오염 | ×× | ×× | ◎ |
2 기재층
2A, 2B 2층으로 했을 경우의 기재층
3 쿠션층
4 열 봉지 추종층
5 열 봉지층
6 열 봉지용 막대
7 열 봉지된 부분
7A 박리에 의해 열 봉지층이 전사한 부분
8 캐리어 테이프
9 엠보스 부분
10 전자 부품 포장체
Claims (14)
- 전자 부품 포장용 캐리어 테이프에 열 봉지할 수 있는 전자 부품 포장용 커버 테이프로서,
적어도 기재층, 수지 A로 이루어진 쿠션층, 수지 B로 이루어진 열 봉지 추종층 및 열 봉지층이 이 순서로 적층되고,
상기 수지 A의 ISO306에 의해 측정한 비캇트((Vicat) 연화점 온도 Ta(승온 속도: 50℃/시, 하중: 10N)와 상기 수지 B의 ISO306에 의해 측정한 비캇트 연화점 온도 Tb(승온 속도: 50℃/시, 하중: 10N)가 하기 관계식 1을 만족시키고,
상기 열 봉지 추종층의 두께가 2㎛ 이상 15㎛ 이하인 전자 부품 포장용 커버 테이프.
관계식 1: Ta-Tb≥3(℃) - 청구항 1에 있어서,
비캇트 연화점 온도 Ta와 비캇트 연화점 온도 Tb가 하기 관계식 2를 만족시키는 전자 부품 포장용 커버 테이프.
관계식 2: Ta-Tb≥10(℃) - 청구항 1 또는 청구항 2에 있어서,
비캇트 연화점 온도 Ta가 96℃ 이상, 115℃ 이하인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
비캇트 연화점 온도 Tb가 75℃ 이상 93℃ 이하인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
수지 A가 직쇄상 저밀도 폴리에틸렌, 수소 첨가 스티렌계 엘라스토머, 에틸렌 아세트산 비닐 공중합체, 또는 이들의 군으로부터 선택되는 두 가지 이상이 배합된 수지 조성물인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
수지 B가 직쇄상 저밀도 폴리에틸렌, 수소 첨가 스티렌계 엘라스토머, 에틸렌 아세트산 비닐 공중합체, 또는 이들의 군으로부터 선택되는 두 가지 이상이 배합된 수지 조성물인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
수지 A 및 수지 B의 ISO178에 의해 측정한 휨 탄성율이 각각 70 MPa 이상 250 MPa 이하인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
상기 쿠션층의 두께가 15㎛ 이상 35㎛ 이하인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
상기 열 봉지 추종층이 상기 열 봉지층과 인접하고 있는 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
상기 열 봉지 추종층이 상기 쿠션층과 인접하고 있는 전자 부품 포장용 커버 테이프. - 청구항 10에 있어서,
수지 A 및 수지 B의 모두가 에틸렌 α-올레핀 공중합체로 이루어진 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 있어서,
수지 A 및 수지 B의 중량 평균 분자량/수평균 분자량으로 표시되는 분자량 분포가 5 이하인 전자 부품 포장용 커버 테이프. - 청구항 1 또는 청구항 2에 기재된 전자 부품 포장용 커버 테이프와 전자 부품 포장용 캐리어 테이프가 열 봉지되어 얻어진 것을 특징으로 하는 전자 부품 포장체.
- 청구항 13에 있어서,
상기 커버 테이프를 상기 캐리어 테이프로부터 박리할 때 열 봉지된 영역에 있어서, 상기 열 봉지층과 상기 열 봉지 추종층 사이에 박리가 생기는 전자 부품 포장체.
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US (1) | US7931965B2 (ko) |
EP (1) | EP2311749B1 (ko) |
JP (1) | JP4438906B1 (ko) |
KR (1) | KR100966985B1 (ko) |
CN (1) | CN102119108B (ko) |
HK (1) | HK1153439A1 (ko) |
MY (1) | MY156166A (ko) |
TW (1) | TW201006672A (ko) |
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KR20100028672A (ko) | 2010-03-12 |
WO2010018791A1 (ja) | 2010-02-18 |
TW201006672A (en) | 2010-02-16 |
EP2311749B1 (en) | 2013-04-17 |
EP2311749A4 (en) | 2012-08-08 |
EP2311749A1 (en) | 2011-04-20 |
CN102119108B (zh) | 2012-07-04 |
US20100266826A1 (en) | 2010-10-21 |
HK1153439A1 (en) | 2012-03-30 |
TWI329065B (ko) | 2010-08-21 |
MY156166A (en) | 2016-01-15 |
JP4438906B1 (ja) | 2010-03-24 |
CN102119108A (zh) | 2011-07-06 |
US7931965B2 (en) | 2011-04-26 |
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