WO2011158550A1 - カバーテープ - Google Patents
カバーテープ Download PDFInfo
- Publication number
- WO2011158550A1 WO2011158550A1 PCT/JP2011/059545 JP2011059545W WO2011158550A1 WO 2011158550 A1 WO2011158550 A1 WO 2011158550A1 JP 2011059545 W JP2011059545 W JP 2011059545W WO 2011158550 A1 WO2011158550 A1 WO 2011158550A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- layer
- cover tape
- heat seal
- thermoplastic resin
- Prior art date
Links
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Definitions
- the present invention relates to a cover tape used for a package of electronic parts.
- the surface mounting electronic component is stored in a carrier tape in which embossed pockets that can be stored in accordance with the shape of the electronic component are continuously formed.
- a cover tape is stacked on the upper surface of the carrier tape as a cover material, and both ends of the cover tape are continuously heat-sealed in the length direction with a heated seal bar to form a package.
- the cover tape material a material in which a biaxially stretched polyester film is used as a base material and a heat seal layer of a thermoplastic resin is laminated is used.
- the peel strength may increase or decrease over time due to the temperature and humidity affected by the storage environment of the cover tape or the packaging and storage environment that contains the electronic components, and may deviate from the proper range. is there.
- the packaging body which accommodated the electronic component in order to remove the water
- the cover tape is heat-sealed to the carrier tape in an environment of 60 ° C. A baking process of about 24 hours is performed in an environment of 72 hours or 80 ° C.
- an electronic component may adhere to the heat seal surface of the cover tape, which may cause a mounting failure when the component is mounted on the substrate.
- the adhesive strength of the electronic components is not limited to the fact that it has an appropriate peel strength and the variation in peel strength is sufficiently small. Therefore, there is a need for a cover tape having a high peel strength that does not occur.
- a method of imparting stability of peel strength a method of making the heat seal layer into a sea-island pattern, a method of cohesive failure inside the layer by mixing an incompatible resin with the intermediate layer or the heat seal layer, heat A method for adjusting the wettability of the surface by corona treatment on the seal surface has been proposed (see Patent Documents 2 to 5). However, it did not consider the adhesion of the components to the cover tape when the package containing the electronic components was stored in a high temperature environment.
- an electrostatic diffusion layer in which conductive fine particles and a surfactant are added to a thermoplastic resin such as polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, and acrylic resin is provided.
- a thermoplastic resin such as polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, and acrylic resin.
- Patent Document 6 a cover tape has been proposed in which an electrostatic induction preventing layer is provided between the intermediate layer and the heat seal layer, so that there is little variation in peel seal strength and peel charge can be suppressed.
- Patent Document 6 it is not clear about the resin which comprises an intermediate
- the electronic component may be inspected for the presence or absence of the component, the storage direction of the component, and the loss or bending of the lead while being stored in the package.
- the cover tape needs to have high transparency for inspection of the components stored in the package.
- a transparent cover tape has been proposed (see Patent Document 8), but the heat seal layer has relatively large particles such as tin oxide and zinc oxide for the purpose of preventing electrostatic charging. Since conductive fine particles were added, the transparency of the cover tape was lowered, the haze value exceeded 20% in most cases, and a higher transparency was required.
- JP 2000-327024 A Japanese Patent Laid-Open No. 7-223684 JP-A-4-279466 JP 2006-219137 A JP-A-8-192886 JP 2005-178073 A JP-A-8-258888
- the present invention has an appropriate peel strength and a sufficiently small variation in peel strength when heat-sealed to a plastic carrier tape such as polystyrene or polycarbonate, and the tape does not break due to an impact due to high-speed peeling, and in a high temperature environment. It is an object of the present invention to provide a cover tape that does not cause adhesion of electronic components even when left for a long time, has excellent properties of excellent peel strength over time, and has high transparency as required. .
- the present inventors have provided a release layer made of another resin composition between an intermediate layer made of a specific resin and a heat seal layer, and tensile of the release layer and the heat seal layer.
- a cover tape that can overcome all the problems can be obtained.
- the present invention has been found. That is, the present invention includes a base material layer (A) and an intermediate layer (B), a release layer (C) mainly composed of a thermoplastic resin, and a heat seal mainly composed of a thermoplastic resin that can be heat sealed to a carrier tape.
- the thermoplastic resin comprising at least the layer (D) and forming the release layer (C) has a tensile storage modulus (c) at 23 ° C. of 1 ⁇ 10 6 Pa or more and 1 ⁇ 10 8 Pa or less, and heat
- the thermoplastic resin forming the sealing layer (D) has a tensile storage modulus (d) at 23 ° C. of 1 ⁇ 10 8 or more and 1 ⁇ 10 10 Pa or less, and the ratio of (c) and (d) is 1 ⁇ 10 4 ⁇ (d) / (c) ⁇ 1 ⁇ 10.
- the tensile storage modulus (c) of the thermoplastic resin forming the release layer (C) is measured by the method described in 9.4 of JIS K 7244-1-1996.
- the intermediate layer includes at least a base layer (A), an intermediate layer (B), a release layer (C), and a heat seal layer (D) that can be heat sealed to a carrier tape.
- B contains, as a main component, a linear low density polyethylene having a tensile modulus of 200 MPa or less polymerized using a metallocene catalyst
- the release layer (C) contains a conductive material and contains an aromatic vinyl group.
- a cover tape comprising an aromatic vinyl-conjugated diene copolymer hydrogenated resin in an amount of 15 to 35% by mass as a main component is provided.
- the intermediate layer (B) preferably comprises a linear low density polyethylene resin having a density of 0.900 to 0.925 ⁇ 10 3 kg / m 3 .
- the resin constituting the intermediate layer (B) more preferably comprises a metallocene linear low density polyethylene resin.
- the thermoplastic resin composing the release layer (C) is acrylic resin, polyester resin, ethylene-vinyl acetate copolymer resin, ethylene-acrylic acid copolymer resin, ethylene-methacrylic acid copolymer resin, styrene-butadiene copolymer.
- the thermoplastic resin which comprises a heat seal layer (D) consists of an acrylic resin, ester resin, a styrene resin, or these 2 or more types of combinations. At least one of the release layer (C) and the heat seal layer (D) preferably contains 2 to 15 parts by mass of the carbon nanomaterial with respect to 100 parts by mass of the thermoplastic resin constituting the layer.
- the carbon nanomaterial added to at least one layer of the release layer (C) and the heat seal layer (D) is more preferably a carbon nanofiber.
- At least one layer of the release layer (C) and the heat seal layer (D) has fine particles obtained by imparting conductivity to the metal oxide as conductive fine particles.
- the release layer (C) and the heat seal layer (D) ) Is preferably 1 ⁇ 10 4 to 1 ⁇ 10 12 ⁇ . More preferably, the conductive fine particles are antimony-doped tin oxide.
- the cover tape of the present invention preferably has optical properties such that the total light transmittance is 70% or more and the haze value is 30% or less, preferably 15% or less.
- this invention includes the electronic component package which used the said cover tape as a cover material of the carrier tape which consists of thermoplastic resins.
- the cover tape of the present invention maintains heat-sealability with respect to plastic carrier tapes such as polystyrene and polycarbonate, maintains a stable peel strength even after a long time after heat-seal, and is also excellent in cover tape transparency.
- the present invention provides a cover tape that can significantly suppress the adhesion of storage components to the cover tape even by long-term aging in a high temperature environment such as 60 to 80 ° C.
- the release layer (C) contains a conductive material, even when a small and lightweight electronic component is stored in the carrier tape, Troubles in the mounting process such as pop-out of electronic components due to charging of the cover tape can be suppressed.
- the cover tape of the present invention comprises at least a base material layer (A), an intermediate layer (B), a release layer (C), and a heat seal layer (D).
- An example of the structure of the cover tape of the present invention is shown in FIG.
- the base material layer (A) is a layer containing biaxially stretched polyester or biaxially stretched nylon, and biaxially stretched polyethylene terephthalate (PET), biaxially stretched polyethylene naphthalate (PEN), or biaxially stretched. 6,6-nylon, 6-nylon, and biaxially stretched polypropylene can be particularly preferably used.
- Biaxially-stretched PET, biaxially-stretched PEN, biaxially-stretched 6,6-nylon, biaxially-stretched 6-nylon, and biaxially-stretched polypropylene are not only those commonly used but also antistatic for antistatic treatment What applied or kneaded an agent, or what gave corona treatment, an easily-adhesive process, etc. can be used. If the base material layer is too thin, the tensile strength of the cover tape itself is lowered, and therefore, when the cover tape is peeled off, “film breakage” tends to occur. On the other hand, if it is too thick, not only will the adhesiveness of the cover tape be reduced, but it will also lead to an increase in cost.
- middle layer (B) is laminated
- the resin constituting the intermediate layer (B) is a linear low-density polyethylene (hereinafter referred to as LLDPE) that is particularly flexible and has an appropriate rigidity and a high tear strength at room temperature.
- LLDPE linear low-density polyethylene
- a resin having a density in the range of 0.900 to 0.925 ⁇ 10 3 kg / m 3 is used.
- the intermediate layer (B) When the density is less than 0.900 ⁇ 10 3 kg / m 3 , the intermediate layer (B) easily protrudes from the edge of the cover tape due to heat and pressure of the heat seal when the cover tape is heat-sealed, and the heat-sealing iron becomes dirty. Easy to cause. On the other hand, if it is higher than 0.925 ⁇ 10 3 kg / m 3, when the cover tape is heat-sealed, the intermediate layer (B) cannot be sufficiently softened, so that the variation in peel strength when peeling the cover tape increases. .
- LLDPE includes those polymerized with a Ziegler type catalyst and those polymerized with a metallocene catalyst (hereinafter referred to as m-LLDPE). Since m-LLDPE can control the molecular weight distribution narrowly, the occurrence of adhesiveness due to low crystallization and the lowering of the melting point more than necessary are suppressed, and the tear strength is particularly high. Among them, the tensile elasticity calculated from the change in tensile stress when the amount of strain was 3% to 6% was measured using a JIS K 6251 dumbbell-shaped test specimen No. 1 at a tensile speed of 100 mm / min. What has a rate of 200 MPa or less is used.
- the intermediate layer (B) relaxes the variation in the iron pressure when the hot iron hits the cover tape, and adheres uniformly to the base material layer and the release layer.
- peeling the cover tape there is an effect of suppressing variation in peel strength.
- the tensile modulus exceeds 200 MPa
- the adhesion between the m-LLDPE constituting the intermediate layer and the thermoplastic resin constituting the release layer (C) becomes non-uniform, and the peel strength when peeling the cover tape. Invite the variation.
- m-LLDPE is preferably used as the intermediate layer (B) of the present invention.
- the above-mentioned m-LLDPE is a copolymer of ethylene with an olefin having 3 or more carbon atoms as a comonomer, preferably a linear, branched or aromatic nucleus substituted with 3 to 18 carbon atoms.
- linear monoolefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, -Octadecene and the like.
- branched monoolefin examples include 3-methyl-1-butene, 3-methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene and the like.
- styrene etc. are mentioned as a monoolefin substituted by the aromatic nucleus.
- These comonomers can be copolymerized with ethylene singly or in combination of two or more.
- polyenes such as butadiene, isoprene, 1,3-hexadiene, dicyclopentadiene, and 5-ethylidene-2-norbornene may be copolymerized.
- the ⁇ -olefin content in the copolymer is preferably 1 to 20 mol%, from the viewpoint of obtaining a sufficient effect of improving tape breakage, and more preferably 10 to 15 mol%.
- the thickness of the intermediate layer (B) is generally 5 to 50 ⁇ m, preferably 10 to 40 ⁇ m. If the thickness of the intermediate layer (B) is less than 5 ⁇ m, the adhesive strength between the base material layer (A) and the intermediate layer (B) may be insufficient, and if it exceeds 50 ⁇ m, the total thickness of the cover tape is thick. When heat-sealing the cover tape to the carrier tape, it may be difficult to obtain sufficient peel strength.
- a release layer (C) mainly composed of a thermoplastic resin is provided between the intermediate layer (B) and the heat seal layer (D).
- the thermoplastic resin used for the release layer (C) is acrylic resin, polyester resin, ethylene-vinyl acetate copolymer resin (hereinafter referred to as EVA), ethylene-acrylic acid copolymer resin, ethylene-methacrylic acid copolymer. Any of a resin, a styrene-butadiene copolymer resin, an aromatic vinyl-conjugated diene copolymer hydrogenated resin, or a combination thereof.
- those having a tensile storage modulus of 1 ⁇ 10 6 Pa or more and 1 ⁇ 10 8 Pa or less at room temperature of 23 ° C. are preferable, and more preferably 1 ⁇ 10 6 Pa to 5 ⁇ 10. 7 Pa. If it is less than 1 ⁇ 10 6 Pa, it is too soft, so that the release layer is easily broken when the cover tape is peeled off from the carrier tape, and if it exceeds 1 ⁇ 10 8 Pa, it is too hard to obtain the stability of peeling. It's hard to be done.
- the tensile storage modulus of any of the release layer (C) and the heat seal layer (D) described later is the same as that for the thermoplastic resin or thermoplastic resin composition used in each layer.
- thermoplastic resin used for the release layer (C) an olefin-styrene block copolymer resin containing an olefin component at a ratio of 50 to 85% by mass can be suitably used.
- the copolymer resin include a hydrogenated resin of a styrene-conjugated diene block copolymer, such as a hydrogenated resin of a styrene-butadiene diblock copolymer, a hydrogenated resin of a styrene-butadiene-styrene triblock copolymer, Hydrogenated resin of styrene-isoprene diblock copolymer, hydrogenated resin of styrene-isoprene-styrene triblock copolymer, hydrogenated resin of styrene-butadiene random copolymer, hydrogenated resin of styrene-isoprene random copolymer, hydrogenated resin of s
- SEPS hydrogenated resin of styrene-isoprene-styrene triblock copolymer
- SEBS hydrogenated resin of styrene-butadiene-styrene triblock copolymer
- SBBS partially hydrogenated resin
- Adhesiveness with (D) can also be improved.
- the thermoplastic resin used for the release layer (C) comprises a hydrogenated resin of a styrene-conjugated diene copolymer, and has a density in the range of 0.890 to 0.920 ⁇ 10 3 kg / m 3 . Preferably, it may be in the range of 0.905 to 0.920 ⁇ 10 3 kg / m 3 .
- the mass average molecular weight may be between 50,000 and 150,000.
- the thermoplastic resin used for the release layer (C) may be a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15 to 35% by mass.
- the cover tape of the present invention is peeled between the release layer (C) and the heat seal layer (D).
- the aromatic vinyl group content is less than 15% by mass, the intermediate layer (B
- the adhesiveness with the m-LLDPE is good, the adhesiveness with the heat seal layer (D) is not sufficient, and the peel strength required for the cover tape cannot be obtained.
- the adhesiveness between the release layer (C) and the heat seal layer (D) is likely to change abruptly due to the change in heat caused by the heat trowel during heat sealing. It is difficult to obtain the desired peel strength, and when the cover tape is peeled off, the peel strength is likely to vary.
- the thickness of the release layer (C) is usually in the range of 0.1 to 3 ⁇ m, preferably 0.1 to 1.5 ⁇ m.
- the heat seal layer (D) may not exhibit sufficient peel strength.
- the thickness of the release layer (C) exceeds 3 ⁇ m, the cost is likely to increase, and there is a possibility that the peel strength varies when the cover tape is peeled off.
- the release layer (C) and the heat seal layer (D) are usually formed by coating, but when formed by a coating method, the thickness here is the thickness after drying. .
- the heat seal layer (D) which has a thermoplastic resin as a main component is formed on the surface of a peeling layer (C).
- the thermoplastic resin for the heat seal layer (D) include acrylic resins, polyester resins, styrene resins, and ethylene-vinyl acetate copolymer resins.
- acrylic resin is extremely excellent in heat sealability with respect to polystyrene, polycarbonate, polyester resin and the like which are materials constituting the carrier tape.
- the measured tensile storage modulus at a is preferably at 1 ⁇ 10 10 Pa or less at 1 ⁇ 10 8 or more at 23 ° C. room temperature.
- the addition of an inorganic filler makes it difficult for electronic components to adhere in a temperature environment of 60 to 80 ° C., and has excellent heat sealability against polystyrene or polycarbonate carrier tape. It is done.
- acrylic resin constituting the heat seal layer (D) examples include acrylic acid esters such as methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, and methacrylic acid. It is a resin obtained by polymerizing at least one of methacrylic acid esters such as butyl and cyclohexyl methacrylate, and may be a resin obtained by copolymerizing two or more of these.
- Polyester resins are resins obtained by condensation polymerization of dicarboxylic acids such as terephthalic acid, isophthalic acid, succinic acid, glutaric acid, and adipic acid, and dialcohols such as ethylene glycol, propylene glycol, butylene glycol, and cyclohexanedimethanol.
- dicarboxylic acids such as terephthalic acid, isophthalic acid, succinic acid, glutaric acid, and adipic acid
- dialcohols such as ethylene glycol, propylene glycol, butylene glycol, and cyclohexanedimethanol.
- the resin which copolymerized 2 or more types of these may be sufficient.
- a polyethylene elastomer obtained by condensation polymerization of dicarboxylic acid and polyethylene glycol can also be used.
- resin containing 50% by mass or more of at least one acrylic residue such as the above-mentioned acrylic acid ester and methacrylic acid ester, and a resin obtained by copolymerizing two or more of these, for example, an acrylic-styrene copolymer. Resin may be used.
- the thickness of the heat seal layer (D) is in the range of 0.1 to 5 ⁇ m, preferably 0.1 to 3 ⁇ m, more preferably 0.1 to 0.5 ⁇ m.
- the heat seal layer (D) may not exhibit sufficient peel strength.
- the thickness of the heat seal layer exceeds 5 ⁇ m, not only the cost increases, but also the peel strength tends to vary when the cover tape is peeled off.
- the release layer (C) and / or the heat seal layer (D) contains a conductive material, preferably conductive fine particles, as necessary.
- the conductive fine particles include conductive tin oxide particles, conductive zinc oxide particles, and conductive titanium oxide particles.
- tin oxide doped with antimony, phosphorus, or gallium can be used more favorably because it exhibits high conductivity and has little decrease in transparency.
- the conductive tin oxide particles, the conductive zinc oxide particles, and the conductive titanium oxide particles, spherical or needle-shaped particles, or a mixture thereof can be used. In particular, when antimony-doped tin oxide is used, a cover tape having good antistatic performance can be obtained.
- the addition amount of the conductive fine particles is usually 100 to 1000 parts by mass, preferably 200 to 800 parts by mass with respect to 100 parts by mass of the thermoplastic resin constituting the release layer (C) and / or the heat seal layer (D). Part.
- the addition amount of the conductive fine particles is less than 100 parts by mass, the surface resistivity on the heat seal layer (D) side of the cover tape may not be 10 12 ⁇ or less, which exceeds 1000 parts by mass. Then, since the relative amount of the thermoplastic resin is reduced, it may be difficult to obtain sufficient peel strength by heat sealing, and the cost is increased.
- the release layer (C) and / or the heat seal layer (D) can also contain at least one carbon nanomaterial of carbon nanotubes and carbon nanofibers as a conductive material. Among these, carbon nanofibers having an aspect ratio of 10 to 10,000 are preferable.
- the amount of carbon nanomaterial added to the release layer (C) and / or the heat seal layer (D) is 0.5 to 15 parts by mass, preferably 2 to 100 parts by mass of the thermoplastic resin constituting the layer. -15 parts by mass, more preferably 3-10 parts by mass. When the addition amount is less than 0.5 parts by mass, the effect of imparting conductivity by adding the carbon nanomaterial cannot be sufficiently obtained. On the other hand, when it exceeds 15 parts by mass, the cost is increased and the transparency of the cover tape is lowered.
- the cover tape of the present invention can have a haze of 30% or less, preferably 15% or less by the above-mentioned means, and it is possible to inspect defective storage parts or the like through the cover tape.
- the ratio of the tensile storage elastic modulus (c) at 23 ° C. of the resin forming the release layer (C) to the tensile storage elastic modulus (d) at 23 ° C. of the heat seal layer (D) (d ) / (C) is in the range of 1 ⁇ 10 4 ⁇ (d) / (c) ⁇ 1 ⁇ 10 5.
- the cover tape of the present invention is 72 hours in an environment of 60 ° C. in order to remove moisture contained in the sealing resin in a state where it is heat-sealed on the surface of the carrier tape containing electronic components as described above.
- baking is performed in an environment of 80 ° C. for about 24 hours.
- the cover tape of the present invention has a small variation in peel strength, and the content of the heat seal layer (D) on the electronic component of the contents when stored at a high temperature such as 60 to 80 ° C. for a long time.
- the adhesiveness can be controlled, it is preferable to add an inorganic filler to the heat seal layer (D) in order to more reliably prevent adhesion.
- the inorganic filler to be added is an inorganic filler such as spherical or crushed talc particles, silica particles, alumina particles, mica particles, calcium carbonate, and magnesium carbonate.
- silica particles can be used more suitably because they can easily achieve the target particle size of the present application, have good dispersibility, and have little decrease in transparency when added to the heat seal layer (D). Can do.
- the silica fine particles it is more preferable to subject the silica fine particles to a surface treatment with at least one aliphatic oxide-modified polysiloxane selected from the group consisting of polysiloxane modified with propylene oxide or polysiloxane modified with ethylene oxide.
- a surface treatment with at least one aliphatic oxide-modified polysiloxane selected from the group consisting of polysiloxane modified with propylene oxide or polysiloxane modified with ethylene oxide.
- the inorganic filler 10 to 50 parts by mass of an inorganic filler having a median diameter (D50) of less than 50 nm, or a median diameter (D50) with respect to 100 parts by mass of the thermoplastic resin constituting the heat seal layer (D). It is preferable to contain 20 to 60 parts by mass or 20 to 100 parts by mass of an inorganic filler having a thickness of 50 to 300 nm. In addition, when the inorganic filler has a median diameter (D50) of less than 200 nm and includes, for example, 10 to 50 parts by mass, the transparency of the cover tape is maintained.
- the heat seal layer (D) contains inorganic fillers of these particle sizes, not only can the blocking when the cover tape is wound be suppressed, but also the package containing electronic components is stored in a high temperature environment. However, prevention of adhesion of electronic components to the cover tape becomes more reliable. Further, by adding fillers having different particle diameters, it is possible to suppress the decrease in the transparency of the cover tape in addition to the effect of suppressing the adhesion of the above-mentioned storage parts. Inspection of lead bending etc. can be performed through the cover tape.
- the method for producing the cover tape is not particularly limited, and a general method can be used.
- an anchor coating agent such as polyurethane, polyester, polyolefin, or polyethyleneimine is applied on the surface of the base layer (A), for example, a biaxially stretched polyester film, and m-LLDPE serving as the intermediate layer (B) is the main component.
- the resin composition is extruded from a T-die and coated on the application surface of the anchor coating agent to form a two-layer film composed of the base material layer (A) and the intermediate layer (B).
- the release layer (C) of the present invention can be coated on the surface of the intermediate layer (B), for example, with a gravure coater, reverse coater, kiss coater, air knife coater, Mayer bar coater, dip coater or the like.
- the surface of the intermediate layer (B) is preferably subjected to corona treatment or ozone treatment, and particularly preferably corona treatment.
- the resin composition constituting the heat seal layer (D) on the release layer (C) applied to the intermediate layer (B) is, for example, a gravure coater, reverse coater, kiss coater, air knife coater, Mayer bar coater, dip coater, etc.
- the target cover tape can be obtained by coating.
- the intermediate layer (B) is formed in advance by a T-die casting method or an inflation method, and this is formed into a film of the base layer (A) and an anchor coating agent such as polyurethane, polyester, polyolefin, etc.
- a film composed of the base layer (A) and the intermediate layer (B) can be obtained by a dry laminating method in which the adhesive layer is bonded via a film, and a release layer (C) and a heat seal layer (D) are formed on the surface of the intermediate layer (B). ) Can be applied to obtain the target cover tape.
- the target cover tape can be obtained by sand lamination as another method. That is, a film constituting the first intermediate layer is formed by a T die casting method or an inflation method. Next, between the film of the first intermediate layer and the base material layer (A) film, a molten resin composition containing m-LLDPE as a main component is supplied to form a second intermediate layer and laminated. After obtaining a laminated film composed of the base layer (A) of the cover tape and the intermediate layer (B) composed of the first intermediate layer and the second intermediate layer, further on the surface on the intermediate layer (B) side The target cover tape can be obtained by applying the release layer (C) and the heat seal layer (D). In the case of this method, as in the above method, it is common to use a substrate layer (A) coated with an anchor coating agent on the surface on which the film is laminated.
- an antistatic treatment can be performed on at least one surface of the cover tape as necessary.
- the antistatic agent include anionic, cationic, nonionic, and betaine surfactant antistatic agents, polymer antistatic agents, and conductive materials such as roll coaters and lippers using gravure rolls. It can be applied by a coater, spray or the like.
- the film surface is preferably subjected to a corona discharge treatment or an ozone treatment before the antistatic treatment, and a corona discharge treatment is particularly preferred.
- Cover tape is used as a cover for carrier tape, which is a container for electronic components.
- the carrier tape is a belt-like object having a width of about 8 mm to 100 mm having a recess for accommodating electronic components.
- the material constituting the carrier tape is not particularly limited, and commercially available materials can be used, for example, polystyrene, polyester, polycarbonate, polyvinyl chloride, etc. Can do.
- Carrier tapes are those that are made conductive by kneading carbon black or carbon nanotubes into the resin, those that are kneaded with an antistatic agent or conductive material, or surfactant-type antistatic agents or polypyrrole on the surface.
- an antistatic property can be used by applying a coating liquid in which a conductive material such as polythiophene is dispersed in an organic binder such as acrylic.
- a packaging body containing electronic components can be obtained by, for example, storing the electronic components in the electronic component storage portion of the carrier tape and then using the cover tape as a lid and continuously heat-sealing both edges in the longitudinal direction of the cover tape. Obtained by packaging and winding on a reel. Electronic parts and the like are stored and transported by packaging in this form.
- the package of the present invention can be used for storing and transporting various electronic components such as connectors, ICs, diodes, transistors, capacitors, resistors, LEDs, and the like, and in particular, LEDs, transistors, diodes and the like having a thickness of 1 mm or less In electronic parts, troubles when mounting electronic parts can be greatly suppressed.
- the package containing the electronic parts etc. is peeled off the cover tape intermittently while being transported through the hole for feeding provided in the longitudinal edge of the carrier tape, and the presence, direction, It can be taken out while checking the position.
- the cover tape when peeling off the cover tape, if the peel strength is too small, the cover tape may be peeled off and the stored parts may fall off. If it is too large, it will be difficult to peel off the carrier tape and the cover tape will be peeled off. Since it may break during the peeling operation, when it is heat-sealed at 120 to 220 ° C., it should have a peel strength of 0.05 to 1.0 N, preferably 0.1 to 0.7 N. The strength variation is preferably 0.4N, preferably less than 0.3N.
- Test piece thickness 200 ⁇ m (Part 4)
- Frequency 10Hz
- Vibration mode I Temperature increase rate: 12 ° C / min
- the test pieces were dissolved in cyclohexane, [c-1] to [c-4], [c-5] in water, and [d-1] to [d-3] in MEK. After diluting, it was coated on a polytetrafluoroethylene plate, put in for 12 hours at a temperature of 60 ° C., and then taken out and left for 24 hours in an atmosphere at a temperature of 23 ° C. and a relative humidity of 50%. Measurements were made.
- m-LLDPE Umerit 0520F (manufactured by Ube Maruzen Polyethylene), thickness 40 ⁇ m, density 0.904 ⁇ 10 3 kg / m 3 (A-2) m-LLDPE: Harmolex NF464N (manufactured by Nippon Polyethylene), thickness 40 ⁇ m, density 0.918 ⁇ 10 3 kg / m 3 (A-3) m-LLDPE: Umerit 2540F (manufactured by Ube Maruzen Polyethylene), thickness 40 ⁇ m, density 0.923 ⁇ 10 3 kg / m 3 (A-4) m-LLDPE: Evolue SP3010 (manufactured by Prime Polymer), thickness 30 ⁇ m, density 0.926 ⁇ 10 3 kg / m 3 (A-5) m-LLDPE: Excellen FX CX1001 (manufactured by Sumitomo Chemical Co., Ltd.
- C resin (Release layer (C) resin) (C-1) Resin: Tuftec H1141 (manufactured by Asahi Kasei Chemicals), SEBS, storage elastic modulus at 23 ° C .; 2 ⁇ 10 7 Pa (C-2) Resin: Septon 2002 (manufactured by Kuraray), SEPS, storage elastic modulus at 23 ° C.
- (Resin for heat seal layer (D)) (D-1) Acrylic resin 1: Dianal BR-116 (manufactured by Mitsubishi Rayon Co., Ltd.), storage elastic modulus at a glass transition temperature of 50 ° C. and 23 ° C .; 2 ⁇ 10 9 Pa (D-2) Acrylic resin 2: Dianal BR-113 (manufactured by Mitsubishi Rayon Co., Ltd.), storage elastic modulus at a glass transition temperature of 75 ° C. and 23 ° C .; 1 ⁇ 10 10 Pa (D-3) Acrylic resin 3: Dianal BR-1122 (manufactured by Mitsubishi Rayon Co., Ltd.), storage elastic modulus at glass transition temperatures of 27 ° C.
- Example 1 Using [(a-1) m-LLDPE] polymerized with a metallocene catalyst as a raw material resin, it was kneaded at 200 ° C. using a single-screw extruder with a diameter of 40 mm, and extruded through a T-die at a line speed of 20 m / min. An intermediate layer film having a thickness of 40 ⁇ m was obtained. A biaxially stretched polyester film having a thickness of 12 ⁇ m is coated with a polyester-based anchor coating agent by a gravure method, and then the intermediate layer film [(a-1) m-LLDPE] is pasted to form a biaxial A laminated film composed of a stretched polyester layer and an m-LLDPE layer was obtained.
- the m-LLDPE surface of this film was subjected to corona treatment, and [(c-1) resin] dissolved in cyclohexane was dried on the surface subjected to the corona treatment by a gravure method so that the dry thickness was 0.
- the film was applied to a thickness of 8 ⁇ m to form a release layer.
- a solid copolymer of a random copolymer of butyl methacrylate and methyl methacrylate [(d-1) acrylic resin] and [(e-1) inorganic filler] as a heat seal layer on the coated surface of the release layer was a solid copolymer of a random copolymer of butyl methacrylate and methyl methacrylate [(d-1) acrylic resin] and [(e-1) inorganic filler] as a heat seal layer on the coated surface of the release layer.
- Example 2 As described in Table 1, (c-14) the conductive material was blended in an amount of 400 parts by weight with respect to 100 parts by weight of the resin in the release layer, and the same as in Example 1, except that the blending ratio and composition described in Table 1 were used.
- a cover tape was prepared. (Examples 3 to 9, Comparative Examples 2 to 10) A cover tape was produced in the same manner as in Example 1 except that the intermediate layer, the release layer, and the heat seal layer were formed using raw materials such as the resins described in Tables 1 and 2. (Comparative Example 1) A cover tape was produced in the same manner as in Example 1 except that the intermediate layer was not provided and a release layer and a heat seal layer were sequentially formed on a 50 ⁇ m thick base material layer.
- Example 10 Using [(a-1) m-LLDPE] polymerized with a metallocene catalyst as a raw material resin, it was kneaded at 200 ° C. using a single screw extruder with a diameter of 40 mm, and extruded through a T die at a line speed of 20 m per minute. An intermediate layer film having a thickness of 40 ⁇ m was obtained. A biaxially stretched polyester film having a thickness of 12 ⁇ m is coated with a polyester-based anchor coating agent by a gravure method, and then the intermediate layer film [(a-1) m-LLDPE] is pasted to form a biaxial A laminated film composed of a stretched polyester layer and an m-LLDPE layer was obtained.
- the m-LLDPE surface of this film was subjected to corona treatment, and [(c-1) resin] dissolved in cyclohexane was dried on the surface subjected to the corona treatment with a dry thickness of 1 ⁇ m by a gravure method. It was coated to a thickness to form a release layer.
- Example 11 to 17, Comparative Examples 14, 15, 17 to 23 A cover tape was produced in the same manner as in Example 10 except that the intermediate layer, the release layer, and the heat seal layer were formed using raw materials such as the resins described in Tables 3 and 4.
- Comparative Example 13 A cover tape was produced in the same manner as in Example 10 except that the intermediate layer was not provided and a release layer and a heat seal layer were sequentially formed on a 50 ⁇ m thick base material layer.
- Comparative Example 16 A cover tape was produced in the same manner as in Example 10 except that the conductive material and the inorganic filler were not blended in the heat seal layer, and the constitution described in Table 4 was adopted.
- Comparative Example 24 A cover tape was produced in the same manner as in Example 10 except that the heat seal layer was not provided and the intermediate layer and the release layer were configured as shown in Table 4.
- “Excellent” means that the number of parts attached to the cover tape is in the range of 0-5, “good” means that the number is in the range of 6-10, and “bad” means 10-20. Indicated. The results are shown in the column of sealability in Table 1, Table 2, Table 3, and Table 4. (3) Baking resistance 50 electronic components (Stanley LED: 1.6 mm ⁇ 0.8 mm) were placed on the heat seal layer surface of the cover tape stretched horizontally, and placed in an 80 ° C. environment for 24 hours. After taking out from the 80 ° C environment, leave it in an atmosphere of 23 ° C and 50% relative humidity for 1 hour, and then turn the cover tape upside down in an atmosphere of 23 ° C and 50% relative humidity, so that the electronic components become cover tape.
- Stanley LED 1.6 mm ⁇ 0.8 mm
- the number of adhered particles was counted.
- the number of parts attached to the cover tape is indicated as “excellent” if it is in the range of 0-5, “good” if it is in the range of 6-10, and “bad” if it exceeds 10 parts. did.
- the results are shown in the baking resistance column of Tables 1 and 2. The same evaluation was performed under the condition of 72 hours in a 60 ° C. environment, but the same result as in the case of 24 hours in the 80 ° C. environment was obtained.
- the cover tape was peeled off at a speed of 300 mm / min and a peeling angle of 180 ° in an atmosphere of a temperature of 23 ° C. and a relative humidity of 50%.
- the average peel strength in the range of 0.3 to 0.9 N when heat-sealed at a seal iron temperature of 190 ° C. is “excellent” and heat-sealed at a seal iron temperature of either 140 ° C. or 190 ° C.
- Those having an average peel strength in the range of 0.3 to 0.9 N were indicated as “good”, and those having an average peel strength other than the above were indicated as “bad”.
- the results are shown in the column of sealability in Table 1, Table 2, Table 3, and Table 4.
- a sample having an average peel strength in the range of 0.4 ⁇ 0.1 N is defined as “excellent”, a sample in the range of 0.4 ⁇ 0.2 N is defined as “good”, and a sample having an average peel strength other than the above is “ Described as “bad”.
- the results are shown in the column of sealability in Table 1, Table 2, Table 3, and Table 4.
- the average peel strength is 0.5, 1.0, 1.5 N or more by adjusting the seal head temperature with respect to the polystyrene carrier tape.
- heat sealing was performed.
- the carrier tape with the cover tape sealed was cut out to a length of 550 mm, and the pocket bottom of the carrier tape was attached to a vertical wall to which a double-sided adhesive tape was attached.
- the cover tape was peeled off by 50 mm from the upper part of the affixed carrier tape, the cover tape was sandwiched between clips, and a weight having a mass of 1000 g was attached to the clip.
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Abstract
Description
テープ切れの対策として、二軸延伸したポリエステルフィルムなどの基材とヒートシール層の間にポリプロピレンやナイロンやポリウレタンなどの耐衝撃性や引裂伝播抵抗に優れた層を設ける方法(特許文献1参照)が提案されているが、これらの方法によっても前記の高速でカバーテープをキャリアテープから剥離する際には、十分にテープ切れを抑制することは困難であった。
更に、電子部品を収納した包装体では、封止樹脂に含まれる水分を除去するために、ベーキング処理をする必要がある。このような電子部品の量産性の向上のためには、ベーキング温度を上げ、ベーキングの時間を短くする必要があり、最近ではカバーテープをキャリアテープにヒートシールした状態で、60℃の環境下で72時間または80℃の環境下で24時間程度のベーキング処理を行うようになってきている。このような場合、カバーテープのヒートシール面に電子部品が付着してしまい、基板上に部品を実装する際に実装不良を起こすことがある。
このような状況から、適度の剥離強度を有するとともに剥離強度のバラツキが十分小さく、高速剥離による衝撃によってもテープ切れが起こらないことに加えて、前記のような高温環境下においても電子部品の付着が起こらない、剥離強度の安定性の高いカバーテープが必要となってきている。
剥離強度の安定性を付与させる方法として、ヒートシール層を海島状のパターンにする方法や、中間層もしくはヒートシール層に非相溶の樹脂を混ぜ合わせることで層内を凝集破壊させる方法、ヒートシール表面にコロナ処理を施すことで表面の濡れ性を調節する方法などが提案されている(特許文献2~5参照)。しかしながら、電子部品を収納した包装体が高温環境下で保管された際のカバーテープへの部品付着について考慮したものではなかった。
また、中間層とヒートシール層間に静電誘導防止層を設けることにより、剥離シール強度のバラツキが少なく、剥離帯電を抑制できるカバーテープが提案されている(特許文献6)。しかしながら、特許文献6では、中間層、静電誘導防止層、及びシーラント層を構成する樹脂について明確ではなく、剥離強度のバラツキについては言及されていない。
この要求に応じて、透明性を有するカバーテープが提案されているが(特許文献8参照)、静電気の帯電を防止することを目的にヒートシール層に酸化錫や酸化亜鉛といった比較的粒子の大きい導電性微粒子を添加していたため、カバーテープの透明性が低下し、曇価が20%を超えるものが殆どであり、更に透明性の高いものが求められていた。
即ち本発明は、基材層(A)と中間層(B)、熱可塑性樹脂を主成分とする剥離層(C)、及びキャリアテープにヒートシール可能な熱可塑性樹脂を主成分とするヒートシール層(D)を少なくとも含んでなり、剥離層(C)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(c)が1×106Pa以上で1×108Pa以下であり、ヒートシール層(D)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(d)が1×108以上で1×1010Pa以下であり、(c)と(d)の比が、1×104≧(d)/(c)≧1×10であるカバーテープである。剥離層(C)を形成する熱可塑性樹脂の引張貯蔵弾性率(c)は、JIS K 7244-1-1996の9.4記載の方法で測定される。
また、本発明の一態様では、基材層(A)、中間層(B)、剥離層(C)、及びキャリアテープにヒートシール可能なヒートシール層(D)を少なくとも含んでなり、中間層(B)が、メタロセン触媒を用いて重合した引張弾性率が200MPa以下の直鎖低密度ポリエチレンを主成分として含み、剥離層(C)が、導電材を含有すると共に、芳香族ビニル基の含有量が15~35質量%である芳香族ビニル-共役ジエン共重合体の水素添加樹脂を主成分として含んでなる、カバーテープが提供される。
剥離層(C)を構成する熱可塑性樹脂は、アクリル系樹脂、ポリエステル系樹脂、エチレン-酢酸ビニル共重合樹脂、エチレン-アクリル酸共重合樹脂、エチレン-メタクリル酸共重合樹脂、スチレン-ブタジエン共重合樹脂およびその水素添加樹脂、スチレン-イソプレン共重合樹脂およびその水素添加樹脂のいずれか、またはこれら二種以上の組み合わせからなることが好ましい。またヒートシール層(D)を構成する熱可塑性樹脂は、アクリル系樹脂、エステル系樹脂、スチレン系樹脂のいずれか、またはこれら二種以上の組み合わせからなることが好ましい。
剥離層(C)、ヒートシール層(D)の少なくとも一層は、層を構成する熱可塑性樹脂100質量部に対して、カーボンナノ材料を2~15質量部を含有することが好ましい。また、剥離層(C)、ヒートシール層(D)の少なくとも一層に添加するカーボンナノ材はカーボンナノファイバーであることが更に好ましい。
一方で、ヒートシール層(D)の熱可塑性樹脂100質量部に対して、メジアン径(D50)が50~300nmの無機フィラーを20~100質量部含むことが好ましい。そして本発明のカバーテープは、全光線透過率が70%以上であり、曇価が30%以下、好ましくは15%以下の光学特性を有することが好ましい。
また本発明は、前記のカバーテープを、熱可塑性樹脂からなるキャリアテープの蓋材として用いた電子部品包装体を包含する。
本発明の中間層(B)としては、m-LLDPEを用いることが好ましい。また、メタロセン触媒を用いて重合した引張弾性率が200MPa以下の直鎖低密度ポリエチレンを用いることが更に好ましい。
試験片厚み:200μm (パート4)
周波数 :10Hz
振動モード:I
昇温速度 :12℃/min
そして前記の剥離層(C)の場合と同じ方法で測定した引張貯蔵弾性率が、23℃室温下において1×108以上で1×1010Pa以下であることが好ましい。このような樹脂を用いると、無機フィラーを添加することによって60~80℃の温度環境下での電子部品付着を生じにくくなり、またポリスチレンやポリカーボネートのキャリアテープに対するヒートシール性も優れたものが得られる。
添加する無機フィラーは、球状または破砕形状のタルク粒子、シリカ粒子、アルミナ粒子、マイカ粒子、炭酸カルシウム、炭酸マグネシウムなどの無機フィラーである。特にシリカ粒子は、本願が目標とする粒子径が得られやすく、分散性が良好であり、またヒートシール層(D)に添加した際の透明性の低下が少ないことから、より好適に用いることができる。特にシリカ微粒子を、プロピレンオキサイドで変性されたポリシロキサン、あるいはエチレンオキサイドで変性されたポリシロキサンからなる群から選ばれる少なくとも1種の脂肪族オキサイド変性ポリシロキサンで表面処理することがより好ましい。無機フィラーの表面をこれらのポリシロキサンで処理することによって、ヒートシール層(D)を構成する樹脂と無機フィラー間の密着性が強くなるので、ヒートシール層(D)の機械的強度を向上させることができ、キャリアテープからカバーテープを剥離する際に安定した剥離強度が得られやすい。
実施例および比較例において、中間層(B)、剥離層(C)およびヒートシール層(D)に、以下の樹脂原料を用いた。なお、剥離層(C)の樹脂、およびヒートシール層(D)の樹脂の引張貯蔵弾性率は、それぞれの樹脂について粘弾性測定装置(Rheometric Scientific社製、SOLIDS ANALYZER RSAII)を用い、JIS K 7244-1-1996の9.4に準拠した測定方法にて求めた貯蔵弾性率の値である。
(測定条件)
試験片厚み:200μm (パート4)
周波数 :10Hz
振動モード:I
昇温速度 :12℃/min
試験片は、後述する樹脂の[c-1]~[c-4]はシクロヘキサンに、[c-5]は水に、[d-1]~[d-3]はMEKに、それぞれ溶解もしくは希釈させた後、ポリテトラフルオロエチレンの板上に塗布し、温度60℃環境下、12時間投入して作製し、その後に取り出し、温度23℃、相対湿度50%の雰囲気下に24時間放置後測定を行った。
(a-1)m-LLDPE:ユメリット0520F(宇部丸善ポリエチレン社製)、厚み40μm、密度0.904×103kg/m3
(a-2)m-LLDPE:ハーモレックスNF464N(日本ポリエチレン社製)、厚み40μm、密度0.918×103kg/m3
(a-3)m-LLDPE:ユメリット2540F(宇部丸善ポリエチレン社製)、厚み40μm、密度0.923×103kg/m3
(a-4)m-LLDPE:エボリューSP3010(プライムポリマー社製)、厚み30μm、密度0.926×103kg/m3
(a-5)m-LLDPE:エクセレンFX CX1001(住友化学社製)、厚み40μm、密度0.898×103kg/m3
(c-1)樹脂:タフテックH1141(旭化成ケミカルズ社製)、SEBS、23℃における貯蔵弾性率;2×107Pa
(c-2)樹脂:セプトン2002(クラレ社製)、SEPS、23℃における貯蔵弾性率1×107Pa
(c-3)樹脂:タフテックP1500(旭化成ケミカルズ社製)、SBBS、23℃における貯蔵弾性率;1×107Pa
(c-4)樹脂:タフテックH1221(旭化成ケミカルズ社製)、SEBS、23℃における貯蔵弾性率;1×106Pa
(c-5)樹脂:エバフレックスVA-45X(三井・デュポンポリケミカル社製)、EVA、23℃における貯蔵弾性率8×106Pa
(c-6)樹脂:バイロナールMD-1245(東洋紡社製)、ポリエステル樹脂、23℃における貯蔵弾性率;1×109Pa
(c-7)樹脂:バイロン630(東洋紡社製)、ポリエステル樹脂、23℃における貯蔵弾性率;2×109Pa
(c-8)樹脂:ペスレジンA-645GH(高松油脂社製)、ポリエステル樹脂、23℃における貯蔵弾性率;8×108Pa
(c-9)樹脂:タフテックH1051(旭化成ケミカルズ社製)、SEBS、23℃における貯蔵弾性率;1×108Pa
(c-10)樹脂:タフテックP2000(旭化成ケミカルズ社製)、SBBS、23℃における貯蔵弾性率;6×108Pa
(c-11)樹脂:タフテックH1043(旭化成ケミカルズ社製)、SEBS、23℃における貯蔵弾性率;3×108Pa
(c-12)樹脂:セプトン8104(クラレ社製)、SEBS、23℃における貯蔵弾性率;5×108Pa
(剥離層(C)中に配合する導電材)
(c-13)導電材:SNS-10T(石原産業社製)、球状アンチモンドープ酸化錫、メジアン径(D50)100nm、トルエン分散タイプ
(c-14)導電材:FSS-10T(石原産業社製)、針状アンチモンドープ酸化錫、数平均長径2μm、トルエン分散タイプ
(c-15)導電材:FS-10D(石原産業社製)、針状アンチモンドープ酸化錫、数平均長径2μm、水分散タイプ
(d-1)アクリル樹脂1:ダイヤナールBR-116(三菱レイヨン社製)、ガラス転移温度50℃、23℃における貯蔵弾性率;2×109Pa
(d-2)アクリル樹脂2:ダイヤナールBR-113(三菱レイヨン社製)、ガラス転移温度75℃、23℃における貯蔵弾性率;1×1010Pa
(d-3)アクリル樹脂3:ダイヤナールBR-1122(三菱レイヨン社製)、ガラス転移温度27℃、23℃における貯蔵弾性率;2×108Pa
(ヒートシール層(D)の配合剤)
(ヒートシール層(D)に添加する導電材)
(d-4)導電材:CNF-T/アノン(三菱マテリアル社製)、カーボンナノファイバー、直径10~20nm、数平均長径0.1~10μm
(ヒートシール層(D)に添加する無機フィラー)
(e-1)無機フィラー1:MEK-ST-ZL(日産化学社製)、シリカフィラー、メジアン径(D50)100nm
原料樹脂としてメタロセン触媒にて重合された[(a-1)m-LLDPE]を用い、口径40mmの単軸押出機を用いて200℃で混練し、Tダイを通して毎分20mのライン速度で押出し、厚み40μmの中間層フィルムを得た。厚さ12μmの二軸延伸ポリエステルフィルムの表面に、グラビア法によってポリエステル系のアンカーコート剤を塗工した後、前記中間層フィルム[(a-1)m-LLDPE]を貼り付けることにより、二軸延伸ポリエステル層とm-LLDPE層からなる積層フィルムを得た。次にこのフィルムのm-LLDPE面にコロナ処理を施した後、シクロヘキサンにて溶解させた[(c-1)樹脂]を前記コロナ処理を施した面上に、グラビア法にて乾燥厚みが0.8μm厚みになるように塗工し剥離層とした。さらに、剥離層の塗工面上に、ヒートシール層として、メタクリル酸ブチルとメタクリル酸メチルのランダム共重合体[(d-1)アクリル樹脂]と、[(e-1)無機フィラー]との固形分質量比が(d-1):(e-1)=100:80となるように混合し、MEKに溶解した溶液を、グラビア法にて乾燥後の厚みが1.0μmになるように塗工することにより、帯電防止性能を有するキャリアテープ用カバーテープを得た。
剥離層に表1に記載したとおり(c-14)導電材を樹脂100質量部に対して400質量部配合し、表1に記載した配合比および構成とした以外は、実施例1と同様にしてカバーテープを作製した。
(実施例3~9、比較例2~10)
中間層、剥離層、およびヒートシール層を、表1および表2に記載した樹脂等の原料を用いて形成した以外は、実施例1と同様にしてカバーテープを作製した。
(比較例1)
中間層を設けず、厚さ50μmの基材層上に順次剥離層およびヒートシール層を形成した以外は、実施例1と同様にしてカバーテープを作製した。
(比較例11)
剥離層を設けず、中間層およびヒートシール層を、表2に記載した樹脂等の原料を用いて形成した以外は、表2に示した配合比および構成で実施例1と同様にしてカバーテープを作製した。
(比較例12)
ヒートシール層を設けず、中間層および剥離層を、表2に記載した樹脂等の原料を用いて形成した以外は、表2に示した配合比および構成実施例1と同様にしてカバーテープを作製した。
原料樹脂としてメタロセン触媒にて重合された[(a-1)m-LLDPE]を用い、口径40mmの単軸押出機を用いて200℃で混練し、Tダイを通して毎分20mのライン速度で押出し、厚み40μmの中間層フィルムを得た。厚さ12μmの二軸延伸ポリエステルフィルムの表面に、グラビア法によってポリエステル系のアンカーコート剤を塗工した後、前記中間層フィルム[(a-1)m-LLDPE]を貼り付けることにより、二軸延伸ポリエステル層とm-LLDPE層からなる積層フィルムを得た。次にこのフィルムのm-LLDPE面にコロナ処理を施した後、シクロヘキサンにて溶解させた[(c-1)樹脂]を前記コロナ処理を施した面上に、グラビア法にて乾燥厚みが1μm厚みになるように塗工し剥離層とした。さらに、剥離層の塗工面上に、ヒートシール層として、メタクリル酸ブチルとメタクリル酸メチルのランダム共重合体[(d-1)アクリル樹脂]、[(d-4)導電材]および[(e-1)無機フィラー]の固形分質量比が(d-1):(d-4):(e-1)=100:8:50となるように混合し、MEKに溶解した溶液を、グラビア法にて乾燥後の厚みが0.8μmになるように塗工することにより、帯電防止性能を有するキャリアテープ用カバーテープを得た。
中間層、剥離層、およびヒートシール層を、表3および表4に記載した樹脂等の原料を用いて形成した以外は、実施例10と同様にしてカバーテープを作製した。
(比較例13)
中間層を設けず、厚さ50μmの基材層上に順次剥離層およびヒートシール層を形成した以外は、実施例10と同様にしてカバーテープを作製した。
(比較例16)
ヒートシール層に導電材および無機フィラーを配合しないで、表4に記載した構成とした以外は、実施例10と同様にしてカバーテープを作製した。
(比較例24)
ヒートシール層を設けず、中間層および剥離層を、表4に記載した構成とした以外は、実施例10と同様にしてカバーテープを作製した。
各実施例及び各比較例で作製した電子部品のキャリアテープ用カバーテープについて下記に示す評価を行った。これらの結果を表1、表2、表3及び表4にまとめて示す。
(1)曇価
JIS K 7105:1998の測定法Aに準じて、積分球式測定装置を用いて曇価を測定した。フィルム製膜性が著しく悪くフィルムが得られなかったため、曇価を評価できなかったものについては、「未評価」と表記した。結果を表1、表2、表3及び表4の曇価の欄に示す。
(2)部品付着性
温度23℃、相対湿度50%の雰囲気下において、ポリスチレン製キャリアテープ(電気化学工業社製)に電子部品(SOD-882:1.0mm×0.6mm)を20個載せ、カバーテープのヒートシール層が部品に接するように被せ、500gの重りを用いて均等に(部品一つ当たり25g)荷重をかけた。1分後、カバーテープを持ち上げ、ヒートシール面に付着した部品の個数を数えた。カバーテープに付着した部品の数が0~5個の範囲にあるものを「優」とし、6~10個の範囲にあるものを「良」とし、10~20個のものを「不良」として表記した。結果を表1、表2、表3及び表4のシール性の欄に示す。
(3)ベーキング耐性
水平に張ったカバーテープのヒートシール層面上に電子部品(スタンレー社製LED:1.6mm×0.8mm)を50個載せ、80℃環境下に24時間投入した。80℃環境から取り出した後、温度23℃、相対湿度50%の雰囲気下に1時間放置し、同じく温度23℃、相対湿度50%の雰囲気下でカバーテープを逆さにし、電子部品がカバーテープに付着した個数を数えた。カバーテープに付着した部品の数が0~5個の範囲にあるものを「優」とし、6~10個の範囲にあるものを「良」とし、10個を超えるものを「不良」として表記した。結果を表1及び表2のベーキング耐性の欄に示す。尚、60℃環境下に72時間投入した条件でも同様の評価を行ったが、前記の80℃環境下に24時間投入した場合と同じ結果であった。
テーピング機(渋谷工業社、ETM-480)を使用し、シールヘッド幅0.5mm×2、シールヘッド長32mm、シール圧力0.1MPa、送り長4mm、シール時間0.1秒×8回にてシールコテ温度140℃から190℃まで10℃間隔で5.5mm幅のカバーテープを8mm幅のポリカーボネート製キャリアテープ(電気化学工業社製)、及びポリスチレン製キャリアテープ(電気化学工業社製)にヒートシールした。温度23℃、相対湿度50%の雰囲気下に24時間放置後、同じく温度23℃、相対湿度50%の雰囲気下にて毎分300mmの速度、剥離角度180°でカバーテープを剥離し、140℃および190℃のシールコテ温度でヒートシールした時の平均剥離強度が0.3~0.9Nの範囲にあるものを「優」とし、140℃あるいは190℃のいずれかのシールコテ温度でヒートシールした時の平均剥離強度が0.3~0.9Nの範囲にあるものを「良」とし、上記以外の平均剥離強度のものを「不良」として表記した。結果を表1、表2、表3及び表4のシール性の欄に示す。
(5)経時安定性
前記(4)シール性と同条件において、剥離強度を0.4Nとなるようにヒートシールを行った。温度60℃、相対湿度10%、及び温度60℃、相対湿度95%の環境下に7日間投入し、取り出し後温度23℃、相対湿度50%の雰囲気下に24時間放置後、同じく温度23℃、相対湿度50%の雰囲気下にて剥離強度の測定を行った。剥離強度の測定は前記(3)シール性と同条件にて実施した。平均剥離強度が0.4±0.1Nの範囲にあるものを「優」とし、0.4±0.2Nの範囲にあるものを「良」とし、上記以外の平均剥離強度のものを「不良」として表記した。結果を表1、表2、表3及び表4のシール性の欄に示す。
前記(4)シール性と同条件において、ポリスチレン製キャリアテープに対し、シールヘッド温度を調整することにより、平均剥離強度が0.5、1.0、1.5N以上となる様に、ヒートシールを行った。カバーテープをシールしたキャリアテープを550mmの長さで切り取り、両面粘着テープを貼った垂直な壁にキャリアテープのポケット底部を貼り付けた。貼り付けてあるキャリアテープの上部からカバーテープを50mm剥がし、カバーテープをクリップで挟み、このクリップに質量1000gの重りを取り付けた。その後、重りを自然落下させた時に、剥離強度1.5Nでもカバーテープが切れなかったものを「優」、剥離強度1.0Nでカバーフィルムが切れなかったものを「良」、剥離強度が1.0Nで切れが観察されたものを「不良」として表記した。また、190℃のシール温度においても剥離強度が1.0Nに満たなかったものについては、「未評価」と表記した。結果を表1、表2、表3及び表4の切れ性の欄に示す。
(7)表面抵抗率
三菱化学社のハイレスタUP MCP-HT450を使用しJIS K6911の方法にて、温度23℃、相対湿度50%RHの雰囲気下にて、印加電圧10Vでヒートシール層表面の表面抵抗率を測定した。結果を表1、表2、表3及び表4の表面抵抗率の欄に示す。
2 基材層(A)
3 アンカーコート層
4 中間層(B)
5 剥離層(C)
6 ヒートシール層(D)
Claims (5)
- 基材層(A)、中間層(B)、熱可塑性樹脂を主成分とする剥離層(C)、及びキャリアテープにヒートシール可能な熱可塑性樹脂を主成分とするヒートシール層(D)を少なくとも含んでなり、
剥離層(C)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(c)が1×106Pa以上で1×108Pa以下であり、
ヒートシール層(D)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(d)が1×108以上で1×1010Pa以下であり、
(c)と(d)の比が、1×104≧(d)/(c)≧1×10である、カバーテープ。 - 剥離層(C)を構成する熱可塑性樹脂が、アクリル系樹脂、ポリエステル系樹脂、エチレン-酢酸ビニル共重合樹脂、エチレン-アクリル酸共重合樹脂、エチレン-メタクリル酸共重合樹脂、スチレン-ブタジエン共重合樹脂およびその水素添加樹脂、スチレン-イソプレン共重合樹脂およびその水素添加樹脂のいずれか、またはこれら二種以上の組み合わせを含んでなる、請求項1に記載のカバーテープ。
- ヒートシール層(D)を構成する熱可塑性樹脂が、アクリル系樹脂、エステル系樹脂、スチレン系樹脂のいずれか、またはこれら二種以上の組み合わせを含んでなる、請求項1に記載のカバーテープ。
- 中間層(B)を構成する樹脂が、メタロセン系直鎖状低密度ポリエチレン樹脂を含んでなる、請求項1に記載のカバーテープ。
- 剥離層(C)、ヒートシール層(D)の少なくとも一層に、層を構成する熱可塑性樹脂100質量部に対して、カーボンナノ材料を2~15質量部添加されている、請求項1に記載のカバーテープ。
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- 2011-04-18 GB GB1221984.6A patent/GB2495862B/en active Active
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JP2015182342A (ja) * | 2014-03-25 | 2015-10-22 | 三井化学東セロ株式会社 | カバーテープ用シーラントフィルム及びカバーテープ |
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JPWO2019087999A1 (ja) * | 2017-10-31 | 2020-11-19 | デンカ株式会社 | カバーフィルム |
JP7138651B2 (ja) | 2017-10-31 | 2022-09-16 | デンカ株式会社 | カバーフィルム |
US11541645B2 (en) | 2017-10-31 | 2023-01-03 | Denka Company Limited | Cover film |
JP2019171792A (ja) * | 2018-03-29 | 2019-10-10 | ジェイフィルム株式会社 | シーラントフィルムおよび包装材 |
JP6993923B2 (ja) | 2018-03-29 | 2022-01-14 | ジェイフィルム株式会社 | シーラントフィルムおよび包装材 |
JP2021123419A (ja) * | 2020-01-31 | 2021-08-30 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ、電子部品包装体およびその製造方法 |
JP7308807B2 (ja) | 2020-01-31 | 2023-07-14 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ、電子部品包装体およびその製造方法 |
JP2021155098A (ja) * | 2020-03-30 | 2021-10-07 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
JP7289816B2 (ja) | 2020-03-30 | 2023-06-12 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
Also Published As
Publication number | Publication date |
---|---|
DE112011102024T5 (de) | 2013-06-06 |
SG186174A1 (en) | 2013-01-30 |
US20130089746A1 (en) | 2013-04-11 |
JP5695644B2 (ja) | 2015-04-08 |
TWI515115B (zh) | 2016-01-01 |
GB2495862B (en) | 2016-02-24 |
CN102971227A (zh) | 2013-03-13 |
GB2495862A (en) | 2013-04-24 |
KR101685749B1 (ko) | 2016-12-12 |
CN102971227B (zh) | 2014-07-30 |
TW201204560A (en) | 2012-02-01 |
US9662866B2 (en) | 2017-05-30 |
JPWO2011158550A1 (ja) | 2013-08-19 |
DE112011102024B4 (de) | 2022-02-03 |
KR20130112027A (ko) | 2013-10-11 |
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