KR100857481B1 - Tft 어레이 기판, 그 제조 방법 및 표시장치 - Google Patents
Tft 어레이 기판, 그 제조 방법 및 표시장치 Download PDFInfo
- Publication number
- KR100857481B1 KR100857481B1 KR1020070055454A KR20070055454A KR100857481B1 KR 100857481 B1 KR100857481 B1 KR 100857481B1 KR 1020070055454 A KR1020070055454 A KR 1020070055454A KR 20070055454 A KR20070055454 A KR 20070055454A KR 100857481 B1 KR100857481 B1 KR 100857481B1
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- Prior art keywords
- film
- transparent conductive
- conductive film
- electrode
- etching
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- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000010408 film Substances 0.000 claims description 319
- 229920002120 photoresistant polymer Polymers 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 55
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- 229910052731 fluorine Inorganic materials 0.000 claims description 12
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- 239000000956 alloy Substances 0.000 claims description 9
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- 238000003475 lamination Methods 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- 239000000460 chlorine Substances 0.000 claims 2
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- 239000002253 acid Substances 0.000 claims 1
- 238000000206 photolithography Methods 0.000 description 24
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 18
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
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- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- XGXDPENSUQBIDF-UHFFFAOYSA-O azanium;cerium;nitrate Chemical compound [NH4+].[Ce].[Ce].[O-][N+]([O-])=O XGXDPENSUQBIDF-UHFFFAOYSA-O 0.000 description 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
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- 238000007687 exposure technique Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00159306 | 2006-06-08 | ||
JP2006159306A JP5063936B2 (ja) | 2006-06-08 | 2006-06-08 | Tftアレイ基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070117485A KR20070117485A (ko) | 2007-12-12 |
KR100857481B1 true KR100857481B1 (ko) | 2008-09-08 |
Family
ID=38929565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070055454A KR100857481B1 (ko) | 2006-06-08 | 2007-06-07 | Tft 어레이 기판, 그 제조 방법 및 표시장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5063936B2 (zh) |
KR (1) | KR100857481B1 (zh) |
CN (1) | CN100539193C (zh) |
TW (1) | TW200802892A (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101685229B (zh) * | 2008-09-25 | 2012-02-29 | 北京京东方光电科技有限公司 | 液晶显示器阵列基板的制造方法 |
TWI474408B (zh) | 2008-12-26 | 2015-02-21 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
KR101600879B1 (ko) * | 2010-03-16 | 2016-03-09 | 삼성디스플레이 주식회사 | 박막트랜지스터, 그 제조방법 및 박막트랜지스터를 이용한 표시기판 |
US8664097B2 (en) | 2010-09-13 | 2014-03-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
JP5950638B2 (ja) | 2012-03-12 | 2016-07-13 | 三菱電機株式会社 | 配線構造及びそれを備える薄膜トランジスタアレイ基板並びに表示装置 |
CN103341692A (zh) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | 切割不规则图形基板的方法和显示装置 |
CN104716166A (zh) * | 2015-03-18 | 2015-06-17 | 上海天马微电子有限公司 | 一种有机发光显示装置及其制作方法 |
CN105895639A (zh) | 2016-06-29 | 2016-08-24 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示器件 |
CN107836039A (zh) * | 2016-11-23 | 2018-03-23 | 深圳市柔宇科技有限公司 | 阵列基板的制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980075975A (ko) * | 1997-04-03 | 1998-11-16 | 윤종용 | 박막 트랜지스터 기판의 제조 방법 |
JP2000101091A (ja) * | 1998-09-28 | 2000-04-07 | Sharp Corp | 薄膜トランジスタ |
KR20020028517A (ko) * | 2000-10-10 | 2002-04-17 | 윤종용 | 박막 트랜지스터 기판 및 그 제조 방법 |
KR20020057019A (ko) * | 2000-12-30 | 2002-07-11 | 주식회사 현대 디스플레이 테크놀로지 | 박막 트랜지스터 액정표시장치 제조방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2968252B2 (ja) * | 1998-04-06 | 1999-10-25 | 株式会社日立製作所 | 液晶表示装置 |
JP2005301255A (ja) * | 2000-01-26 | 2005-10-27 | Sharp Corp | 液晶表示装置、配線基板およびこれらの製造方法 |
JP4267242B2 (ja) * | 2001-03-06 | 2009-05-27 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
JP2004241774A (ja) * | 2003-02-03 | 2004-08-26 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板及びその製造方法とそのためのマスク |
JP2005302808A (ja) * | 2004-04-07 | 2005-10-27 | Sharp Corp | 薄膜トランジスタアレイ基板の製造方法 |
-
2006
- 2006-06-08 JP JP2006159306A patent/JP5063936B2/ja active Active
-
2007
- 2007-05-02 TW TW096115568A patent/TW200802892A/zh unknown
- 2007-06-07 KR KR1020070055454A patent/KR100857481B1/ko not_active IP Right Cessation
- 2007-06-08 CN CNB2007101102680A patent/CN100539193C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980075975A (ko) * | 1997-04-03 | 1998-11-16 | 윤종용 | 박막 트랜지스터 기판의 제조 방법 |
JP2000101091A (ja) * | 1998-09-28 | 2000-04-07 | Sharp Corp | 薄膜トランジスタ |
KR20020028517A (ko) * | 2000-10-10 | 2002-04-17 | 윤종용 | 박막 트랜지스터 기판 및 그 제조 방법 |
KR20020057019A (ko) * | 2000-12-30 | 2002-07-11 | 주식회사 현대 디스플레이 테크놀로지 | 박막 트랜지스터 액정표시장치 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP5063936B2 (ja) | 2012-10-31 |
CN101087004A (zh) | 2007-12-12 |
JP2007329298A (ja) | 2007-12-20 |
KR20070117485A (ko) | 2007-12-12 |
CN100539193C (zh) | 2009-09-09 |
TW200802892A (en) | 2008-01-01 |
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