KR100455097B1 - 기판 검사용 검사지그 및 그 검사지그를 구비한 기판검사장치 - Google Patents

기판 검사용 검사지그 및 그 검사지그를 구비한 기판검사장치 Download PDF

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Publication number
KR100455097B1
KR100455097B1 KR10-2001-0016405A KR20010016405A KR100455097B1 KR 100455097 B1 KR100455097 B1 KR 100455097B1 KR 20010016405 A KR20010016405 A KR 20010016405A KR 100455097 B1 KR100455097 B1 KR 100455097B1
Authority
KR
South Korea
Prior art keywords
plate
probe
inspection
substrate
hole
Prior art date
Application number
KR10-2001-0016405A
Other languages
English (en)
Korean (ko)
Other versions
KR20020020980A (ko
Inventor
히데오 니시카와
미노루 카토
시게아키 코이즈미
미쓰히코 이토
Original Assignee
니덱-리드 가부시키가이샤
가부시키가이샤 코요 테크노스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니덱-리드 가부시키가이샤, 가부시키가이샤 코요 테크노스 filed Critical 니덱-리드 가부시키가이샤
Publication of KR20020020980A publication Critical patent/KR20020020980A/ko
Application granted granted Critical
Publication of KR100455097B1 publication Critical patent/KR100455097B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Liquid Crystal (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
KR10-2001-0016405A 2000-09-13 2001-03-29 기판 검사용 검사지그 및 그 검사지그를 구비한 기판검사장치 KR100455097B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000277404A JP3505495B2 (ja) 2000-09-13 2000-09-13 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
JP2000-277404 2000-09-13

Publications (2)

Publication Number Publication Date
KR20020020980A KR20020020980A (ko) 2002-03-18
KR100455097B1 true KR100455097B1 (ko) 2004-11-08

Family

ID=18762738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0016405A KR100455097B1 (ko) 2000-09-13 2001-03-29 기판 검사용 검사지그 및 그 검사지그를 구비한 기판검사장치

Country Status (3)

Country Link
JP (1) JP3505495B2 (ja)
KR (1) KR100455097B1 (ja)
TW (1) TW505792B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101011360B1 (ko) 2007-07-31 2011-01-28 가부시키가이샤 코요 테크노스 검사 지그 및 그 검사 장치
KR101613810B1 (ko) 2015-01-11 2016-04-19 김일 검사접촉장치

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100535676C (zh) * 2005-04-21 2009-09-02 株式会社光阳科技 检查夹具及检查装置
JP2006317412A (ja) * 2005-05-16 2006-11-24 Totoku Electric Co Ltd 絶縁被膜付きプローブ針及びその製造方法
JP4611822B2 (ja) * 2005-07-06 2011-01-12 東京特殊電線株式会社 絶縁被膜付きプローブ針及びその製造方法
JP2007127488A (ja) * 2005-11-02 2007-05-24 Rika Denshi Co Ltd プローブカード
JP3849948B1 (ja) * 2005-11-16 2006-11-22 日本電産リード株式会社 基板検査用治具及び検査用プローブ
KR100701498B1 (ko) * 2006-02-20 2007-03-29 주식회사 새한마이크로텍 반도체 검사용 프로브핀 조립체 및 그 제조방법
JP2007322179A (ja) * 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
JP4842027B2 (ja) * 2006-06-20 2011-12-21 日本電子材料株式会社 プローブカードの接続パッド
JP4625480B2 (ja) * 2007-03-30 2011-02-02 日本電産リード株式会社 検査治具
JP5245279B2 (ja) * 2007-04-16 2013-07-24 日本電産リード株式会社 基板検査用治具及びこの治具における接続電極部の電極構造
KR100975808B1 (ko) * 2007-04-17 2010-08-13 니혼덴산리드가부시키가이샤 기판검사용 치구
JP2009008516A (ja) * 2007-06-28 2009-01-15 Nidec-Read Corp 基板検査治具及び基板検査方法
WO2009011244A1 (ja) * 2007-07-17 2009-01-22 Nhk Spring Co., Ltd. プローブユニット
KR101192209B1 (ko) * 2008-09-05 2012-10-17 니혼덴산리드가부시키가이샤 기판검사용 검사치구
JP5323741B2 (ja) * 2010-02-19 2013-10-23 日置電機株式会社 プローブユニットおよび回路基板検査装置
JP2013100994A (ja) * 2011-11-07 2013-05-23 Nidec-Read Corp 基板検査治具、治具ベースユニット及び基板検査装置
JP2013137281A (ja) * 2011-12-28 2013-07-11 Seiko Epson Corp プローブ装置
JP6184667B2 (ja) * 2012-07-26 2017-08-23 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP6112890B2 (ja) * 2013-02-07 2017-04-12 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット組立方法
JP6237441B2 (ja) * 2014-04-24 2017-11-29 日本電産リード株式会社 電極構造体、検査治具、及び電極構造体の製造方法
KR101457199B1 (ko) * 2014-08-22 2014-10-31 (주)청공정밀 영상표시기기 성능 검사장치 및 이에 이용되는 검사 지그
KR101457200B1 (ko) * 2014-08-22 2014-10-31 (주)청공정밀 영상표시기기 성능 검사장치 및 이에 이용되는 검사 지그
TWI570416B (zh) * 2015-12-01 2017-02-11 The probe base of the vertical probe device
JP2018189396A (ja) * 2017-04-28 2018-11-29 イビデン株式会社 プローブ及びその製造方法
TW201942581A (zh) 2018-03-30 2019-11-01 日商日本電產理德股份有限公司 檢查治具以及具備該治具的檢查裝置
KR102072451B1 (ko) * 2018-07-27 2020-02-04 주식회사 에스디에이 프로브카드 헤드블록
CN116298435B (zh) * 2023-03-17 2023-09-15 圆周率半导体(南通)有限公司 一种有效减小接触电阻的垂直探针组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129166U (ja) * 1985-01-31 1986-08-13
JPH09274054A (ja) * 1996-04-08 1997-10-21 Furukawa Electric Co Ltd:The プローバー
JPH09281139A (ja) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The プローバーの製造方法
JP2000035443A (ja) * 1998-07-15 2000-02-02 Japan Electronic Materials Corp プローブカード

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0656401B2 (ja) * 1986-12-19 1994-07-27 東京エレクトロン株式会社 検査装置
JP2519737B2 (ja) * 1987-07-31 1996-07-31 東京エレクトロン株式会社 プロ−ブカ−ド
JPH07248337A (ja) * 1994-03-11 1995-09-26 Okano Denki Kk コンタクトプローブ
DE19748823B4 (de) * 1997-11-05 2005-09-08 Feinmetall Gmbh Servicefreundliche Kontaktiervorrichtung
EP0943924A3 (en) * 1998-03-19 1999-12-01 Hewlett-Packard Company Loaded-board, guided-probe test fixture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129166U (ja) * 1985-01-31 1986-08-13
JPH09274054A (ja) * 1996-04-08 1997-10-21 Furukawa Electric Co Ltd:The プローバー
JPH09281139A (ja) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The プローバーの製造方法
JP2000035443A (ja) * 1998-07-15 2000-02-02 Japan Electronic Materials Corp プローブカード

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101011360B1 (ko) 2007-07-31 2011-01-28 가부시키가이샤 코요 테크노스 검사 지그 및 그 검사 장치
KR101613810B1 (ko) 2015-01-11 2016-04-19 김일 검사접촉장치

Also Published As

Publication number Publication date
KR20020020980A (ko) 2002-03-18
TW505792B (en) 2002-10-11
JP2002090410A (ja) 2002-03-27
JP3505495B2 (ja) 2004-03-08

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