JPWO2015064567A1 - 薄膜印刷用導電性組成物及び薄膜導電パターン形成方法 - Google Patents
薄膜印刷用導電性組成物及び薄膜導電パターン形成方法 Download PDFInfo
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- JPWO2015064567A1 JPWO2015064567A1 JP2015545001A JP2015545001A JPWO2015064567A1 JP WO2015064567 A1 JPWO2015064567 A1 JP WO2015064567A1 JP 2015545001 A JP2015545001 A JP 2015545001A JP 2015545001 A JP2015545001 A JP 2015545001A JP WO2015064567 A1 JPWO2015064567 A1 JP WO2015064567A1
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Images
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
Abstract
Description
<導電性組成物(インク)の作製>
扁平銀粒子としてAg Nano Flake N300(トクセン工業(株)製、Ag含有量84.5質量%のターピネオール分散ペースト)47.3g、40質量%ポリビニルピロリドン(PVP K30)のターピネオールC(日本テルペン化学(株)製)溶液3.00g、溶媒としてテルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)49.6gを加え、遊星型真空攪拌装置(ARV−310、シンキー社製)にて最大攪拌速度2000rpmで30分程度混合して、サンプルを調製した。
ブルックフィールド社製B型粘度計DV−II+Proを用いて溶媒及び導電性組成物(インク)の粘度を25℃にて測定した。なお、粘度が1.0×104mPa・sを超える場合はロータ番号52を、1.0×104mPa・s以下の場合はロータ番号40を、各々用いて測定した。
スクリーン版としてメッシュカウント640で線径15μmΦ カレンダー加工品のメッシュを用いて、乳剤IC−10000(ムラカミ社製)を用いて膜厚5μmで 硬膜処理して作製した2cm角のパターンを有するスクリーン版を用いて印刷した。なお、基材はテイジン テオネックス(登録商標) Q51(帝人デュポンフィルム社製PEN(ポリエチレンナフタレート)フィルム、100μm厚)を用いた。前記の通り調製した導電性組成物(インク)を前記スクリーン版を用いて2cm角のパターンを基材表面に印刷した後、予備乾燥をせずに、140℃で60分間加熱焼成処理して薄膜導電パターンを形成した。
日立ハイテク株式会社製 FE−SEM S−5200により測定した。
三菱化学株式会社製LORESTA(登録商標)−GP MCP−T610 4探針法表面抵抗率、体積抵抗率測定装置を使用して形成された導電パターンの体積抵抗率を測定した。
実施例1におけるインク作製例と同様にして、種々の金属(銀)粒子、バインダー樹脂、溶媒を用いて作製した実施例2〜15および比較例1〜5の導電性組成物(インク)の組成およびそれらを用いて作製した導電パターンの評価結果を実施例1の結果とともに表1〜表3にまとめて示した。表1、表2には、使用した銀粒子1(実施例1〜15、比較例1〜5では銀粒子2は使用しない)、バインダー溶液、溶媒1、溶媒2の内容を、表3には、各導電性組成物(インク)及びこれを用いて作製した各導電パターンの評価結果を示す。なお、各実施例、比較例で用いた原料の金属(銀)粒子の形状を表6にまとめて記載した。
扁平銀粒子としてAg Nano Flake N300(トクセン工業(株)製、Ag含有量84.5質量%のターピネオール分散ペースト)53.3g、パラトルエンスルホンアミドのエチレンオキサイド付加物PTSA−40X(明成化学工業(株)製)0.543g、ブロックイソシアネートBL4265SN(住化バイエルウレタン(株)製)0.812g、溶媒としてテルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)45.3gを加え、遊星型真空攪拌装置(ARV−310、シンキー社製)にて最大攪拌速度2000rpmで30分程度混合して、サンプルを調製した。
扁平銀粒子としてAg Nano Flake N300(トクセン工業(株)製、Ag含有量84.5質量%のターピネオール分散ペースト)53.4g、パラトルエンスルホンアミドのエチレンオキサイド付加物PTSA−40X(明成化学工業(株)製)0.592g、ブロックイソシアネート17B−60P(旭化成(株)製)0.766g、溶媒としてテルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)45.4gを加え、遊星型真空攪拌装置(ARV−310、シンキー社製)にて最大攪拌速度2000rpmで30分程度混合して、サンプルを調製した。
扁平銀粒子としてAg Nano Flake N300(トクセン工業(株)製、Ag含有量84.5質量%のターピネオール分散ペースト)53.3g、パラトルエンスルホンアミドのエチレンオキサイド付加物PTSA−40X(明成化学工業(株)製)0.641g、ブロックイソシアネートSBB−70P(旭化成(株)製)0.756g、溶媒としてテルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)45.6gを加え、遊星型真空攪拌装置(ARV−310、シンキー社製)にて最大攪拌速度2000rpmで30分程度混合して、サンプルを調製した。
500mlのセパラブルフラスコにジオール((株)クラレ製クラレポリオール、C−1015N(ポリカーボネートジオール、数平均分子量1000))30.25g、ジメチロールブタン酸13.08g、テトラヒドロフラン(THF)71.77gを入れ、オイルバスで80℃に加熱しながら十分に溶解させた。滴下ロートを用いてジイソシアネート(住化バイエルウレタン(株)製、デスモジュール(登録商標)W(ジシクロヘキシルメタン−4,4′−ジイソシアネート))28.74gをゆっくり滴下して、100℃で2時間、次いで110℃で1時間加熱撹拌し、合成バインダー(A)を得た。
1000mlのセパラブルフラスコにジオール(日油(株)製ポリプロピレングリコール、ユニオールD−1000(数平均分子量1000))38.21g、ジメチロールブタン酸30.03g、プロピレングリコールメチルエーテルアセテート(PGMEA)125.96gを入れ、オイルバスで80℃に加熱しながら十分に溶解させた。滴下ロートを用いてジイソシアネート(住化バイエルウレタン(株)製、デスモジュール(登録商標)W(ジシクロヘキシルメタン−4,4′−ジイソシアネート))57.86gをゆっくり滴下して、100℃で2時間、次いで110℃で1時間加熱撹拌し、合成バインダー(B)を得た。
実施例1におけるインク作製例と同様にして、種々の金属(銀)粒子、バインダー樹脂、溶媒を用いて作製した実施例16〜20の導電性組成物(インク)の組成を表4にまとめて示した。表4には、使用した銀粒子(銀粒子1、銀粒子2)、バインダー溶液、溶媒1、溶媒2の内容を示す。また、表5には、実施例16〜20の各導電性組成物(インク)及びこれを用いて作製した各導電パターンの評価結果を示す。なお、実施例16〜20で用いた原料の金属(銀)粒子の形状を表6にまとめて記載した。
光焼成
実施例1で作製した導電性組成物(インク)を用いて、テイジン テオネックス Q51(100μm厚)に同様に印刷して、NovaCentrix社製のキセノン照射装置Pulse Forge3300を使用し、一晩風乾後に、パルス光照射を行った。なお、パルス光の照射条件は、光源の駆動電圧400V、照射時間100μsecで4Hzの間隔で30回照射した。その結果照射後の厚みが0.75μmで体積抵抗率が8.2×10−6Ω・cmである低抵抗の薄膜導電パターンが得られた。
Claims (10)
- 金属粒子、バインダー樹脂及び溶媒を含み、前記溶媒中に橋かけ環骨格を有する炭化水素基と水酸基とを有する有機化合物を5〜98質量%含み、前記金属粒子含有率が15〜60質量%であり、かつ、前記金属粒子が扁平金属粒子を20質量%以上含み、前記金属粒子100質量部に対して前記バインダー樹脂を0.5〜10質量部含有し、25℃における粘度が1.0×103〜2×105mPa・sであることを特徴とする薄膜印刷用導電性組成物。
- 前記橋かけ環骨格を有する炭化水素基と水酸基とを有する有機化合物が、イソボルニルシクロヘキサノール、トリシクロデカンジメタノールまたはヒドロキシジシクロペンタジエンのいずれか、またはこれらの混合物である請求項1に記載の薄膜印刷用導電性組成物。
- 前記金属粒子が扁平金属粒子を40質量%以上含む、請求項1または2に記載の薄膜印刷用導電性組成物。
- 前記扁平金属粒子が銀の扁平粒子であり、そのアスペクト比(扁平金属粒子の幅/厚さ)が5〜200である、請求項1から3のいずれか一項に記載の薄膜印刷用導電性組成物。
- 前記金属粒子が、複数種類の金属粒子を混合したものである、請求項1から4のいずれか一項に記載の薄膜印刷用導電性組成物。
- 前記複数種類の金属粒子が、扁平粒子と球状ナノ粒子とを含む、請求項5に記載の薄膜印刷用導電性組成物。
- 前記バインダー樹脂が、ポリ−N−ビニルアミド、ポリアルキレングリコール、ポリウレタン、セルロース樹脂およびその誘導体、ポリエステル樹脂、塩素化ポリオレフィン樹脂、ポリアクリル樹脂、ポリビニルアセタール(ブチラール)樹脂、エポキシ樹脂、エポキシアクリレート樹脂、フェノール樹脂、メラミン樹脂、尿素樹脂のいずれかである、請求項1から6のいずれか一項に記載の薄膜印刷用導電性組成物。
- 前記ポリ−N−ビニルアミドがポリ−N−ビニルホルムアミド、ポリ−N−ビニルアセトアミド、ポリ−N−ビニルピロリドンおよびポリ−N−ビニルカプロラクタム、もしくはそれらのモノマーと他のビニル化合物との共重合体からなる群から選択される少なくとも一種であり、前記ポリアルキレングリコール化合物がポリエチレングリコール、ポリプロピレングリコール、エチレングリコールとプロピレングリコールの共重合体(エチレンオキサイドユニットとプロピレンオキサイドユニットを有する共重合体)、ポリTHF(ポリブチレングリコール)からなる群から選択される少なくとも一種であり、前記セルロース樹脂がメチルセルロース、エチルセルロース、ヒドロキシセルロース、メチルヒドロキシセルロース、セルロースアセテートからなる群から選択される少なくとも一種であり、前記エポキシ樹脂がビスフェノール−A−型エポキシ樹脂、ビスフェノール−F−型エポキシ樹脂、ノボラック型エポキシ樹脂、脂肪族多価エポキシ樹脂、脂環族グリシジル型多価エポキシ樹脂等からなる群から選択される少なくとも一種である、請求項7に記載の薄膜印刷用導電性組成物。
- 前記ポリウレタンがポリエーテルポリオール、ポリカーボネートポリオール、ポリエステルポリオールから選択される少なくとも一種のポリオール、あるいはペンタエリスリトール、ジペンタエリスリトール、トリメチロールプロパン、ジトリメチロールプロパン、グリセリンから選択される少なくとも一種のポリオールまたはパラトルエンスルホン酸の、エチレンオキサイド及び/またはプロピレンオキサイド付加物から選択される少なくとも一種の水酸基含有化合物と、ジシクロヘキシルメタン−4,4′−ジイソシアネート、イソホロンジイソシアネート、ヘキサメチレン−1,6−ジイソシアネート、トリレンジイソシアネートから選択される少なくとも一種のイソシアネート基含有化合物との反応物である、請求項7に記載の薄膜印刷用導電性組成物。
- 請求項1から請求項9のいずれか一項に記載の薄膜印刷用導電性組成物により、基板上に任意の形状の薄膜パターンをスクリーン印刷する工程と、
前記薄膜パターンに300℃以下の加熱焼成及び/または薄膜パターンにパルス光を照射する工程と、
を有することを特徴とする薄膜導電パターン形成方法。
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Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
US10246599B2 (en) * | 2014-03-17 | 2019-04-02 | Xerox Corporation | Ink composition and method of determining a degree of curing of the ink composition |
US10703924B2 (en) * | 2014-05-30 | 2020-07-07 | Electroninks Writeables, Inc. | Conductive ink for a rollerball pen and conductive trace formed on a substrate |
TWI593728B (zh) * | 2015-10-20 | 2017-08-01 | Atomic Energy Council- Inst Of Nuclear Energy Res | 抗氧化導電銅膠及其製備方法 |
WO2017163615A1 (ja) | 2016-03-23 | 2017-09-28 | 昭和電工株式会社 | 導電性組成物用バインダー樹脂、これを含む導電パターン形成用組成物及びポリウレタン |
US20170283629A1 (en) * | 2016-03-29 | 2017-10-05 | University Of North Texas | Metal-based ink for additive manufacturing process |
US20180071819A1 (en) | 2016-09-15 | 2018-03-15 | NanoCore Technologies, Inc. | System and method for additive metal manufacturing |
MY190562A (en) | 2016-12-20 | 2022-04-27 | Zhejiang Kaiying New Mat Co Ltd | Interdigitated back contact metal-insulator-semiconductor solar cell with printed oxide tunnel junctions |
MY189222A (en) * | 2016-12-20 | 2022-01-31 | Zhejiang Kaiying New Mat Co Ltd | Siloxane-containing solar cell metallization pastes |
KR102030035B1 (ko) * | 2018-04-03 | 2019-10-08 | (주)글로셈 | 전극용 페이스트 조성물, 면상발열히터, 및 히팅파이프 |
JP7341984B2 (ja) * | 2018-04-13 | 2023-09-11 | 東京応化工業株式会社 | クラッディング用組成物、及び金属/樹脂接合部材の製造方法 |
JP6458894B1 (ja) * | 2018-04-26 | 2019-01-30 | 千住金属工業株式会社 | フラックス及びソルダペースト |
EP3797026A4 (en) | 2018-05-22 | 2022-03-02 | Mantle Inc. | METHOD AND SYSTEM FOR AUTOMATIC TOOLWAY GENERATION |
CN109385145A (zh) * | 2018-10-30 | 2019-02-26 | 宁波石墨烯创新中心有限公司 | 一种有机系导电油墨、其制备方法及柔性器件 |
TWI698507B (zh) | 2018-12-06 | 2020-07-11 | 財團法人工業技術研究院 | 改質的金屬奈米片及包括其之導電漿料 |
US10622502B1 (en) | 2019-05-23 | 2020-04-14 | Zhejiang Kaiying New Materials Co., Ltd. | Solar cell edge interconnects |
US10749045B1 (en) | 2019-05-23 | 2020-08-18 | Zhejiang Kaiying New Materials Co., Ltd. | Solar cell side surface interconnects |
CN113122063A (zh) * | 2019-12-30 | 2021-07-16 | Tcl集团股份有限公司 | 量子点墨水、量子点薄膜的制备方法 |
JP6901227B1 (ja) * | 2020-03-25 | 2021-07-14 | 石原ケミカル株式会社 | 銅インク及び導電膜形成方法 |
CN112605380A (zh) * | 2020-11-30 | 2021-04-06 | 哈尔滨工业大学 | 一种银纳米线的过滤提纯方法 |
WO2022163045A1 (ja) * | 2021-01-27 | 2022-08-04 | サカタインクス株式会社 | 導電性樹脂組成物 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04359069A (ja) * | 1991-06-05 | 1992-12-11 | Fukuda Metal Foil & Powder Co Ltd | 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料 |
WO2006095611A1 (ja) * | 2005-03-11 | 2006-09-14 | Toyo Ink Mfg. Co., Ltd. | 導電性インキ、導電回路、及び非接触型メディア |
JP2007066824A (ja) * | 2005-09-02 | 2007-03-15 | Sumitomo Electric Ind Ltd | 導電性ペーストおよびそれを用いた配線基板 |
JP2007107057A (ja) * | 2005-10-14 | 2007-04-26 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性パターン。 |
JP2007173450A (ja) * | 2005-12-21 | 2007-07-05 | Daiken Kagaku Kogyo Kk | 積層セラミックコンデンサ電極用ニッケル粉末、電極形成用ペースト及び積層セラミックコンデンサ |
JP2012256500A (ja) * | 2011-06-08 | 2012-12-27 | Taiyo Holdings Co Ltd | 導電性ペースト |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593346B1 (fr) * | 1986-01-17 | 1990-05-25 | Nec Corp | Substrat de cablage utilisant une ceramique comme isolant |
JP4540945B2 (ja) * | 2003-06-26 | 2010-09-08 | 住友大阪セメント株式会社 | 金属薄膜形成用塗料と金属薄膜及びその製造方法 |
KR20070048257A (ko) | 2004-09-29 | 2007-05-08 | 니폰 킨-에키 컴패니 리미티드 | 은 페이스트 조성물 |
WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
KR101328908B1 (ko) | 2005-10-14 | 2013-11-28 | 토요잉크Sc홀딩스주식회사 | 금속 미립자 분산체의 제조 방법, 상기 방법으로 제조된금속 미립자 분산체를 이용한 도전성 잉크, 및 도전성 피막 |
CN101535422B (zh) * | 2006-11-02 | 2013-08-28 | 东洋油墨制造株式会社 | 导电性油墨、导电电路及非接触型介质 |
WO2008111757A1 (en) | 2007-03-09 | 2008-09-18 | Dongjin Semichem Co., Ltd | Black paste composition having conductivity property, filter for shielding electromagnetic interference and display device comprising the same} |
DE102008039828A1 (de) * | 2008-08-27 | 2010-03-04 | W.C. Heraeus Gmbh | Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess |
JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
JP2011060752A (ja) * | 2009-08-12 | 2011-03-24 | Nippon Kineki Kk | 導電性ペースト組成物 |
US8419981B2 (en) | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
JP5527901B2 (ja) | 2011-01-19 | 2014-06-25 | 横浜ゴム株式会社 | 太陽電池集電電極形成用導電性組成物および太陽電池セル |
TW201245364A (en) * | 2011-01-28 | 2012-11-16 | Hitachi Chemical Co Ltd | Adhesive composition and semiconductor device using same |
TWI481326B (zh) | 2011-11-24 | 2015-04-11 | Showa Denko Kk | A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating |
TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
KR20140140085A (ko) * | 2012-04-26 | 2014-12-08 | 고꾸리쯔 다이가꾸 호우징 오사까 다이가꾸 | 투명 도전 기판의 제조 방법, 투명 도전 기판 및 정전 용량식 터치패널 |
WO2013161996A2 (ja) * | 2012-04-26 | 2013-10-31 | 国立大学法人大阪大学 | 透明導電性インク及び透明導電パターン形成方法 |
JP5880300B2 (ja) * | 2012-06-14 | 2016-03-08 | 日立化成株式会社 | 接着剤組成物及びそれを用いた半導体装置 |
US10201879B2 (en) * | 2012-09-05 | 2019-02-12 | Hitachi Chemical Company, Ltd. | Silver paste composition and semiconductor device using same |
US20160041649A1 (en) * | 2013-03-29 | 2016-02-11 | Showa Denko K.K. | Transparent conductive substrate production method and transparent conductive substrate |
-
2014
- 2014-10-28 EP EP14857914.7A patent/EP3064556B1/en active Active
- 2014-10-28 JP JP2015545001A patent/JP6592363B2/ja active Active
- 2014-10-28 WO PCT/JP2014/078617 patent/WO2015064567A1/ja active Application Filing
- 2014-10-28 KR KR1020167008934A patent/KR101935272B1/ko active IP Right Grant
- 2014-10-28 US US15/032,388 patent/US9845404B2/en active Active
- 2014-10-28 CN CN201480058103.1A patent/CN105658745B/zh active Active
- 2014-10-30 TW TW103137613A patent/TWI638013B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04359069A (ja) * | 1991-06-05 | 1992-12-11 | Fukuda Metal Foil & Powder Co Ltd | 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料 |
WO2006095611A1 (ja) * | 2005-03-11 | 2006-09-14 | Toyo Ink Mfg. Co., Ltd. | 導電性インキ、導電回路、及び非接触型メディア |
JP2007066824A (ja) * | 2005-09-02 | 2007-03-15 | Sumitomo Electric Ind Ltd | 導電性ペーストおよびそれを用いた配線基板 |
JP2007107057A (ja) * | 2005-10-14 | 2007-04-26 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性パターン。 |
JP2007173450A (ja) * | 2005-12-21 | 2007-07-05 | Daiken Kagaku Kogyo Kk | 積層セラミックコンデンサ電極用ニッケル粉末、電極形成用ペースト及び積層セラミックコンデンサ |
JP2012256500A (ja) * | 2011-06-08 | 2012-12-27 | Taiyo Holdings Co Ltd | 導電性ペースト |
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