JP6807995B2 - 透明電極及び透明電極形成用透明導電性インク - Google Patents
透明電極及び透明電極形成用透明導電性インク Download PDFInfo
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- JP6807995B2 JP6807995B2 JP2019137239A JP2019137239A JP6807995B2 JP 6807995 B2 JP6807995 B2 JP 6807995B2 JP 2019137239 A JP2019137239 A JP 2019137239A JP 2019137239 A JP2019137239 A JP 2019137239A JP 6807995 B2 JP6807995 B2 JP 6807995B2
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
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- H—ELECTRICITY
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
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- Inks, Pencil-Leads, Or Crayons (AREA)
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Description
FeCl3(和光純薬工業株式会社製、塩化鉄(III))0.9732g(0.006mol)を100mlのメスフラスコで秤量し、エチレングリコールを標線の9割程度まで入れて、完全に溶解した後、標線までエチレングリコールで希釈した。ホールピペットを用いて作製した溶液1mlを量りとり、100mlメスフラスコに入れて、エチレングリコールにて標線まで希釈した。
反応フラスコ(容量150ml、外径60mm)とビーカー(容量100ml)にエチレングリコール(和光純薬工業株式会社製、エチレングリコール)を25gずつ量り取った。ポリビニルピロリドンK−90(和光純薬工業株式会社製)0.2g(1.8mmol)、AgNO3(和光純薬工業株式会社製、硝酸銀)0.25g(1.5mmol)を秤量し、反応フラスコとビーカー中へそれぞれ撹拌しながら静かに投入した。完全に溶解した後、ビーカー中の溶液を反応フラスコへ移し、上で調製したFeCl3エチレングリコール溶液(600μモル/リットル溶液)3.413g(0.0018mmol)を加え、マグネティックスターラーを用いて溶液を5分間撹拌した。その後、150℃で温度が安定している有機合成装置(EYELA東京理化器械株式会社製、ケミステーション PPV−CTRL1)に反応フラスコを装着し1.5時間加熱反応させた。加熱反応中、撹拌は行わなかった。
1.5時間経過後、反応フラスコの加熱を止め、室温程度になるまで反応溶液を冷却した。反応容器に反応溶液の約4倍容積のアセトンを加えて撹拌した後静置し、反応フラスコの底にワイヤを沈殿させた。
実施例1
透明導電性インクの調製には、市販の銀ナノワイヤ分散液SLV−NW−35(bluenano社製 イソプロパノール分散液、濃度10mg/mL、銀ナノワイヤの径35nm、長さ約15μm(カタログ値))を原料として使用した。この銀ナノワイヤ分散液25mLに対して、予めポリビニルピロリドン((株)日本触媒製)0.75gをジプロピレングリコールモノメチルエーテル(関東化学(株)より試薬で購入)4.8gに室温にて溶解させておいた溶液を加え、混合させた後、イソプロパノールを留去し溶媒置換を行った。その後テルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)を19.2g加え、(株)シンキー社製自転・公転真空ミキサーあわとり練太郎ARV−310を用いて回転数1200rpmで3分間撹拌し、銀ナノワイヤの濃度が1質量%、ポリビニルピロリドンの濃度が3質量%である透明導電性インクを得た。
SLV−NW−35の25mLに対して添加するポリビニルピロリドンのジプロピレングリコールモノメチルエーテル溶液の濃度およびテルソルブ MTPHの量を変更する以外は実施例1同様の操作で各々調製した。
上記合成で得られた銀ナノワイヤのエタノール分散液を原料として用いた。分散溶媒がエタノールであり、濃度が0.2質量%である点以外はSLV−NW−35を用いた実施例1の場合と同様の操作により透明導電性インクを調製した。
バインダー樹脂を含まないインクも同様の操作により作製した。
Claims (10)
- 金属ナノワイヤ及び/または金属ナノチューブと、バインダー樹脂とを含み、前記バインダー樹脂が、5〜40℃の範囲で流動性を有さない、アクリル樹脂、エポキシ樹脂、エポキシアクリレート樹脂、ウレタンアクリレート樹脂、不飽和ポリエステル樹脂、アリルエステル樹脂、ジアリルフタレート(DAP)樹脂、ウレタン樹脂、シリコーン樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ポリアミド樹脂(ナイロン)、アモルファスポリオレフィン樹脂、ポリスチレン、ポリ酢酸ビニル、ポリN−ビニルアミド、ポリ−4−メチルペンテン−1からなる群から選択される少なくとも1種であり、前記金属ナノワイヤ及び/または金属ナノチューブ100質量部に対して前記バインダー樹脂100〜200質量部を含み、表面抵抗が0.1〜500Ω/□であり、表面の算術平均粗さRa≦5nmであり、単一の導電層より構成されていることを特徴とする透明電極。
- 前記表面の算術平均粗さRa≦4nmである請求項1に記載の透明電極。
- 前記透明電極中の金属ナノワイヤ及び/または金属ナノチューブの含有量が、33.3〜50質量%である請求項1または2に記載の透明電極。
- 前記金属ナノワイヤ及び/または金属ナノチューブの金属が銀を含む請求項1〜3のいずれかに記載の透明電極。
- 前記バインダー樹脂がポリN−ビニルピロリドン、ポリN−ビニルカプロラクタム、ポリN−ビニルアセトアミド、ポリN−ビニルホルムアミドからなる群から選択される少なくとも1種である請求項1〜4のいずれかに記載の透明電極。
- 請求項1に記載の透明電極を形成するための透明電極形成用透明導電性インクであって、金属ナノワイヤ及び/または金属ナノチューブと、溶媒と、溶媒に溶解するバインダー樹脂とを含み、前記バインダー樹脂が、5〜40℃の範囲で流動性を有さない、アクリル樹脂、エポキシ樹脂、エポキシアクリレート樹脂、ウレタンアクリレート樹脂、不飽和ポリエステル樹脂、アリルエステル樹脂、ジアリルフタレート(DAP)樹脂、ウレタン樹脂、シリコーン樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ポリアミド樹脂(ナイロン)、アモルファスポリオレフィン樹脂、ポリスチレン、ポリ酢酸ビニル、ポリN−ビニルアミド、ポリ−4−メチルペンテン−1からなる群から選択される少なくとも1種であり、前記金属ナノワイヤ及び/または金属ナノチューブ100質量部に対して前記バインダー樹脂100〜200質量部を含むことを特徴とする透明電極形成用透明導電性インク。
- 前記金属ナノワイヤ及び/または金属ナノチューブの含有量が、0.01〜10質量部である請求項6に記載の透明電極形成用透明導電性インク。
- 前記金属ナノワイヤ及び/または金属ナノチューブの含有量が、0.05〜2質量部である請求項7に記載の透明電極形成用透明導電性インク。
- 前記金属ナノワイヤ及び/または金属ナノチューブ100質量部に対して前記バインダー樹脂150〜200質量部を含むことを特徴とする請求項1に記載の透明電極。
- 前記導電層が、基板上に直接形成されていることを特徴とする請求項1に記載の透明電極。
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JP5761110B2 (ja) * | 2012-04-11 | 2015-08-12 | 株式会社デンソー | 燃料電池システム |
JPWO2013161997A1 (ja) * | 2012-04-26 | 2015-12-24 | 国立大学法人大阪大学 | 透明導電基板の製造方法、透明導電基板及び静電容量式タッチパネル |
CN103106950A (zh) * | 2013-01-10 | 2013-05-15 | 中国航空工业集团公司北京航空材料研究院 | 一种导电泡沫及其制备方法 |
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