JP5880300B2 - 接着剤組成物及びそれを用いた半導体装置 - Google Patents
接着剤組成物及びそれを用いた半導体装置 Download PDFInfo
- Publication number
- JP5880300B2 JP5880300B2 JP2012135231A JP2012135231A JP5880300B2 JP 5880300 B2 JP5880300 B2 JP 5880300B2 JP 2012135231 A JP2012135231 A JP 2012135231A JP 2012135231 A JP2012135231 A JP 2012135231A JP 5880300 B2 JP5880300 B2 JP 5880300B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- silver
- zinc
- particles
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims description 164
- 230000001070 adhesive effect Effects 0.000 title claims description 163
- 239000000203 mixture Substances 0.000 title claims description 163
- 239000004065 semiconductor Substances 0.000 title claims description 52
- 239000002245 particle Substances 0.000 claims description 98
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 56
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 50
- 229910052725 zinc Inorganic materials 0.000 claims description 48
- 229910052709 silver Inorganic materials 0.000 claims description 42
- 239000011701 zinc Substances 0.000 claims description 42
- 239000004332 silver Substances 0.000 claims description 37
- 239000002612 dispersion medium Substances 0.000 claims description 17
- 238000009835 boiling Methods 0.000 claims description 12
- 239000011164 primary particle Substances 0.000 claims description 11
- 150000003624 transition metals Chemical group 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 8
- 150000001298 alcohols Chemical class 0.000 claims description 7
- 150000001735 carboxylic acids Chemical class 0.000 claims description 5
- 150000003378 silver Chemical group 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 description 33
- 239000000523 sample Substances 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
- 238000005259 measurement Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 12
- 239000010949 copper Substances 0.000 description 10
- 238000009826 distribution Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- -1 Aromatic carboxylic acids Chemical class 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- BWVZAZPLUTUBKD-UHFFFAOYSA-N 3-(5,6,6-Trimethylbicyclo[2.2.1]hept-1-yl)cyclohexanol Chemical compound CC1(C)C(C)C2CC1CC2C1CCCC(O)C1 BWVZAZPLUTUBKD-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000004445 quantitative analysis Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- 238000002389 environmental scanning electron microscopy Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- MMKRHZKQPFCLLS-UHFFFAOYSA-N ethyl myristate Chemical compound CCCCCCCCCCCCCC(=O)OCC MMKRHZKQPFCLLS-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004093 laser heating Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000001132 ultrasonic dispersion Methods 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 239000001149 (9Z,12Z)-octadeca-9,12-dienoate Substances 0.000 description 1
- WTTJVINHCBCLGX-UHFFFAOYSA-N (9trans,12cis)-methyl linoleate Natural products CCCCCC=CCC=CCCCCCCCC(=O)OC WTTJVINHCBCLGX-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- SNAQINZKMQFYFV-UHFFFAOYSA-N 1-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOC SNAQINZKMQFYFV-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- RERATEUBWLKDFE-UHFFFAOYSA-N 1-methoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OC RERATEUBWLKDFE-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical class CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- MTVLEKBQSDTQGO-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propan-1-ol Chemical compound CCOC(C)COC(C)CO MTVLEKBQSDTQGO-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical class COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- RJBIZCOYFBKBIM-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound COCCOCCOC(C)C RJBIZCOYFBKBIM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- YJTIFIMHZHDNQZ-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]ethanol Chemical compound CC(C)COCCOCCO YJTIFIMHZHDNQZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- PKRSYEPBQPFNRB-UHFFFAOYSA-N 2-phenoxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1OC1=CC=CC=C1 PKRSYEPBQPFNRB-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- LNJCGNRKWOHFFV-UHFFFAOYSA-N 3-(2-hydroxyethylsulfanyl)propanenitrile Chemical compound OCCSCCC#N LNJCGNRKWOHFFV-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- VPOACHRDUYOSCS-UHFFFAOYSA-N C1(CCCCC1)C1(CCCCCC1)S Chemical compound C1(CCCCC1)C1(CCCCCC1)S VPOACHRDUYOSCS-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- PKIXXJPMNDDDOS-UHFFFAOYSA-N Methyl linoleate Natural products CCCCC=CCCC=CCCCCCCCC(=O)OC PKIXXJPMNDDDOS-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002334 Spandex Polymers 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910001410 inorganic ion Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000004759 spandex Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0893—Zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29317—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/29318—Zinc [Zn] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29339—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
また、これらの組成物よりも熱伝導率及び高温下での接続信頼性に優れるものとして、特殊な表面処理を施したマイクロサイズの銀粒子を用いることで、100℃以上400℃以下での加熱により銀粒子同士が焼結されるような接着剤組成物(特許文献6)が提案されている。特許文献6で提案されている銀粒子同士が焼結されるような接着剤組成物では、銀粒子が金属結合を形成するため、他の手法よりも熱伝導率及び高温下での接続信頼性が優れるものと考えられる。
また本明細書において「〜」を用いて示された数値範囲は、「〜」の前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。
さらに本明細書において組成物中の各成分の量について言及する場合、組成物中に各成分に該当する物質が複数存在する場合には、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。
本実施形態の接着剤組成物は、銀粒子及び亜鉛粒子を含む。本実施形態の接着剤組成物は、分散媒をさらに含んでいてもよい。
亜鉛原子の含有量を上記範囲とすると、後述する接着界面近傍におけるボイドの偏在が抑制されるとともに、過剰な亜鉛粒子が焼結後にそのまま残存することによる接着力の低下が抑制され、接着力の低下を防止することができる。
まず、接着剤組成物をシャーレに厚さ1mm以下になるように伸ばし、減圧乾燥機にて70℃、100Pa以下、40時間以上乾燥させて乾燥接着剤組成物を得る。乾燥接着剤組成物をSEM試料台上に2μm以上の厚みで平らになるように成型してSEM用サンプルとする。このSEM用サンプルを後述するSEM−EDXによる定量方法の例に従って定量分析することで、接着剤組成物中の各遷移金属原子の割合が得られる。
銀粒子は銀原子を含有する粒子であり、より好ましくは銀原子を主成分(例えば、固形分中の銀含有量が90質量%以上、以下同様)として含有する粒子である。銀原子を主成分とする組成としては、金属銀、酸化銀が挙げられ、金属銀が好ましい。
銀粒子0.01gとドデシルベンゼンスルホン酸ナトリウム(和光純薬工業製)0.1g、蒸留水(和光純薬工業製)99.9gとを混合し、超音波洗浄機で5分間処理して水分散液を得る。超音波分散ユニットを有するユニバーサルリキッドモジュールを装着したレーザー散乱法粒度分布測定装置LS13 320(ベックマンコールタ製)を用い、光源の安定のため本体電源を入れて30分間放置する。次に、リキッドモジュールに蒸留水を測定プログラムにおいてRinseコマンドによって導入し、測定プログラムにおいてDe-bubble,Measure Offset,Align,Measure Backgroundを行う。続いて、測定プログラムにおいてMeasure Loadingを行い、この水分散液を振り混ぜて均一になったところでスポイトを用いてリキッドモジュールに測定プログラムにおいてサンプル量LowからOKになるまで添加する。その後、測定プログラムにおいてMeasureを行い、粒度分布を得る。レーザー散乱法粒度分布測定装置の設定として、PumpSpeed:70%、Include PIDS data: ON、Run Length: 90 seconds、分散媒屈折率:1.332、分散質屈折率:0.23を用いる。
この測定により、通常、一次粒子以外に凝集体のピークを含む複数のピークをもつ粒度分布が得られるが、最も低粒径のピーク一つを処理範囲として一次粒子の平均粒径を得る。
なお、後述する亜鉛粒子の一次粒子の平均粒径も同様の方法により、測定することができる。
亜鉛粒子は、金属亜鉛を含有する粒子であり、金属亜鉛を主成分として含有する粒子であることが好ましい。例えば、金属亜鉛粒子、粒子核が金属亜鉛であり表面に酸化亜鉛層を有する亜鉛粒子、粒子核が金属亜鉛であり有機保護被膜を有する亜鉛粒子、粒子核が金属亜鉛であり表面に金属銀層を有する亜鉛粒子を用いることができる。
一方、亜鉛は酸化を受けやすく、酸化亜鉛では上述の効果を得ることができない。そこで、亜鉛粒子の一次粒子の平均粒径は、酸化を防止する観点から、50nm以上であることが好ましい。
分散媒は有機、無機いずれでもかまわないが、塗布工程での乾燥を防ぐ観点から、200℃以上の沸点を有していることが好ましく、300℃以上の沸点を有していることがより好ましい。また、焼結後に分散媒が残留しないように400℃以下の沸点を有していることが好ましい。
得られたせん断速度とせん断応力から、公知の文献(技術情報協会:レオロジーの測定とコントロール一問一答集 −レオロジーを測って、物性を丸裸にする−, 東京, 技術情報協会, 2010, p39-46)に記載の手法で、Casson粘度を算出する。具体的には、得られたそれぞれの、せん断速度及びせん断応力の平方根を計算し、(せん断速度)^(1/2)に対する(せん断応力)^(1/2)から最小二乗法により近似される直線の傾きを算出する。この傾きを二乗したものをCasson粘度とした。
厚さが3μm以上の接着剤組成物硬化物の層を有するサンプルをエポキシ注形樹脂で周囲を固める。研磨装置を用いて、接着剤組成物硬化物の層に直交する断面を削り出し、この断面を平滑に仕上げる。断面にスパッタ装置あるいは蒸着装置を用いた厚み10nm程度の貴金属により帯電防止層を形成してSEM用のサンプルを作製する。
このSEM用サンプルをSEM−EDX(例えば、ESEM XL、Philips製)装置にセットし、5,000〜10,000倍程度の倍率で観察する。接着剤組成物硬化物の中央あたりでEDX点分析を試料傾斜角度:0°、加速電圧25kV、Ev/Chan: 10、Amp. Time:50μS、Choose Preset:LiveTime 300 secsの条件で積算し、分析条件をMatrix: ZAF、SEC (Standardless Element Coefficient):EDAX、定量法: Noneの条件で定量分析して、硬化した接着剤組成物中の各遷移金属原子の割合が得られる。
(半導体素子と半導体素子搭載用支持部材)
本発明に係る半導体素子と半導体素子搭載用支持部材としては、被着体表面が金属である。本発明に適用できる被着体表面の金属としては、金、銀、銅、ニッケル等が挙げられる。また、上記のうち複数の材料が基材上にパターニングされていてもよい。
(A)接着剤組成物を半導体素子あるいは半導体素子搭載用支持部材に付与し、半導体素子と半導体素子搭載用支持部材を張り合わせる工程(以下、「工程(A)という。」)、
(B)接着剤組成物を硬化し、半導体素子と半導体素子搭載用支持部材を接合する工程(以下、「工程(B)という。」)。
〔接着剤組成物の調製〕
接着剤組成物は、上述の銀粒子、亜鉛粒子及び任意の成分を分散媒に混合して調製できる。混合後に、撹拌処理を行ってもよい。また、ろ過により分散液の最大粒径を調整してもよい。
接着剤組成物を基板または半導体素子上に付与することで接着剤組成物層を形成する。付与方法としては、塗布又は印刷が挙げられる。
接着剤組成物を印刷する印刷方法としては、例えば、ディスペンサー、ステンシル印刷、凹版印刷、スクリーン印刷、ニードルディスペンサ、ジェットディスペンサ法を用いることができる。
乾燥のための温度及び時間は、使用した分散媒の種類及び量に合わせて適宜調整することが好ましく、例えば、50〜180℃で、1〜120分間乾燥させることが好ましい。
次いで、接着剤組成物層に対して硬化処理を行う。硬化処理は加熱処理で行ってもよいし、加熱加圧処理で行ってもよい。加熱処理には、ホットプレート、温風乾燥機、温風加熱炉、窒素乾燥機、赤外線乾燥機、赤外線加熱炉、遠赤外線加熱炉、マイクロ波加熱装置、レーザー加熱装置、電磁加熱装置、ヒーター加熱装置、蒸気加熱炉等を用いることができる。また、加熱加圧処理には、熱板プレス装置等を用いてもよいし、重りを乗せて加圧しながら上述の加熱処理を行ってもよい。
半導体装置は、ダイオード、整流器、サイリスタ、MOSゲートドライバ、パワースイッチ、パワーMOSFET、IGBT、ショットキーダイオード、ファーストリカバリダイオード等からなるパワーモジュール、発信機、増幅器、LEDモジュール等に用いることができる。得られるパワーモジュール、発信機、増幅器、LEDモジュールは、半導体素子と半導体素子搭載用支持部材の間に高接着性、高熱伝導性、高導電性かつ高耐熱性を有する。
亜鉛粒子0.1gとドデシルベンゼンスルホン酸ナトリウム(和光純薬工業製)0.01g、蒸留水(和光純薬工業製)9.99gとを混合し、超音波洗浄機で5分間処理して水分散液を得た。超音波分散ユニットを有するユニバーサルリキッドモジュールを装着したレーザー散乱法粒度分布測定装置LS13 320(ベックマンコールタ製)を用い、光源の安定のため本体電源を入れて30分間放置した後、リキッドモジュールに蒸留水を測定プログラムにおいてRinseコマンドによって導入し、測定プログラムにおいてDe-bubble,Measure Offset,Align,Measure Backgroundを行った。続いて、測定プログラムにおいてMeasureLoadingを行い、この水分散液を振り混ぜて均一になったところでスポイトを用いてリキッドモジュールに測定プログラムにおいてサンプル量LowからOKになるまで添加した。その後、測定プログラムにおいて測定を行い、粒度分布を得た。レーザー散乱法粒度分布測定装置の設定として、Pump Speed:70%、Include PIDS data: ON、Run Length: 90 seconds、分散媒屈折率:1.332、分散質屈折率:0.23を用いた。
接着剤組成物を、銀めっきしたPPF−Cuリードフレーム(ランド部:10×5mm)上に先のとがったピンセットを用い、精密天秤により0.1mgとなるように塗布した。塗布した接着剤組成物上に、チタン、ニッケル及び金がこの順でめっきされ、1×1mm2の被着面が金めっきであるシリコンチップ(金めっきの厚み0.1μm、チップ厚:400μm)を載せ、ピンセットで軽く押さえた。これをステンレスバットに並べ、200℃に設定したクリーンオーブン(PVHC−210、TABAIESPEC CORP.製)で1時間処理してリードフレームとシリコンチップを接着剤組成物で接着した。
接着剤組成物硬化物の接着強度は、ダイシェア強度により評価した。50Nのロードセルを装着した万能型ボンドテスタ(4000シリーズ、DAGE社製)を用い、測定スピード500μm/s、測定高さ100μmで被着面が金めっきであるシリコンチップを水平方向に押し、接着剤組成物硬化物のダイシェア強度を測定した。12測定の平均をダイシェア強度とした。
接着剤組成物を、クリーンオーブン(PVHC−210、TABAIESPEC CORP.製)を用いて200℃で1時間加熱処理し、10mm×10mm×1mmの接着剤組成物硬化物を得た。この接着剤組成物硬化物の熱拡散率をレーザーフラッシュ法(ネッチ社製 LFA 447、25℃)で測定した。さらにこの熱拡散率と、示差走査熱量測定装置(Pyris1、パーキンエルマー社製)で得られた比熱容量とアルキメデス法で得られた比重の積より、25℃における接着剤組成物硬化物の熱伝導率(W/m・K)を算出した。
ガラス板上に長さ50mmのマイラテープ(日東電工製)を約1mmの間隔を設けて2本貼り、マイラテープ間の間隙にスキージを用いて接着剤組成物を塗布した。
接着剤組成物を、クリーンオーブン(PVHC−210、TABAIESPEC CORP.製)を用いて200℃で1時間加熱処理し、ガラス板上に1×50×0.03mmの接着剤組成物硬化物を得た。この接着剤組成物硬化物の両端に定電流電源(Model5964、メトロニクス製)を用いて1mAの電流をかけ、マルチメータ(R687E DIGTAL MULTIMETER、アドバンテスト製)に接続したニードルプローブを10mmの間隔で接着剤組成物硬化物に当てて電圧を測定した。接着剤組成物硬化物の膜厚をデジタルリニアゲージ(DG−525H、小野測器製)を用い、ガラス基板厚みと、ガラス基板及び接着剤組成物硬化物の合計の厚みとの差として測定し、4点の平均を接着剤組成物硬化物の厚みとした。接着剤組成物硬化物の幅は光学顕微鏡測長装置(Measurescope UM-2、日本光学製)を用いて測定し、4点の平均を接着剤組成物硬化物の幅とした。上記、接着剤組成物硬化物の電圧、電流(1mA)、電圧測定間隔(10mm)、膜厚及び幅を四端子法の下記式(1)に代入して体積抵抗率を求めた。この測定を接着剤組成物硬化物の異なる場所4箇所に対して行い平均値を接着剤組成物硬化物の体積抵抗率とした。
チップと基板を接着剤組成物で接着したサンプルをカップ内にサンプルクリップ(Samplklip I、Buehler製)で固定し周囲にエポキシ注型樹脂(エポマウント、リファインテック製)をサンプル全体が埋まるまで流し込み、真空デシケータ内に静置して1分間減圧して脱泡した。その後、60℃の恒温機で2時間エポキシ注型樹脂を硬化した。
耐水研磨紙(カーボマックペーパー、リファインテック製)をつけた研磨装置(RefinePolisher HV、リファインテック製)で接着部まで削り断面を出した。その後、バフ研磨剤を染み込ませたバフ研磨布をセットした研磨装置で断面を平滑に仕上げた。断面にスパッタ装置(ION SPUTTER、日立ハイテク製)を用いてPtを10nmの厚みでスパッタしてSEM用のサンプルとした。このSEM用サンプルをSEM装置(ESEM XL30、Philips製)により、接着剤組成物硬化物の断面を印過電圧10kV、1000倍で観察した。
(接着剤組成物の調製)
分散媒としてイソボルニルシクロヘキサノール(テルソルブMTPH、日本テルペン製)とジプロピレングリコールメチルエーテルアセテート(DPMA、ダイセル化学製)及び粒子表面処理剤としてステアリン酸(新日本理化)をポリ瓶に混合、密栓し50℃の水浴で温め、時々振り混ぜながら透明均一な溶液とした。この溶液に亜鉛粒子として鱗片状亜鉛粒子(製品番号13789、Alfa Aesar, A Johnson Matthey Company製)、銀粒子として鱗片状銀粒子(AGC239、福田金属箔粉工業製)及び球状銀粒子(K-0082P、METALOR製)を添加し、スパチュラで乾燥粉がなくなるまでかき混ぜた。さらに、密栓をして自転公転型攪拌装置(Planetary Vacuum Mixer ARV-310、シンキー製)を用いて、2000rpmで1分間撹拌して接着剤組成物を得た。この際、各成分の添加量は表1のとおりとした。
なお、鱗片状亜鉛粒子の平均粒径は、23μm、鱗片状銀粒子の平均粒径は、5.42μm、球状銀粒子の平均粒径は1.64μmであった。
図1〜3中の符号はそれぞれ、1:シリコンチップ、2:めっき層、3:金めっき層と接着剤組成物硬化物の界面近傍に発生したボイド、4:接着剤組成物硬化物、5:銀めっきしたPPF−Cuリードフレームの銀めっき層、6:銀めっきしたPPF−Cuリードフレームの銅層、7:亜鉛粒子をそれぞれ示す。なお、これらの符号は、図4〜7についても同様である。
図1から明らかであるように、実施例2の接着剤組成物を用いた場合には、接着剤組成物硬化物4中に焼結によるボイドが均一に存在し、ボイドの偏り等は見られなかった。一方、図2及び3から明らかであるように、比較例3の接着剤組成物を用いた場合には、金めっき層との接続界面近傍に多くのボイドが偏在しており、これが接着力低下の原因となっているものと考えられる。
図4から明らかであるように、実施例2の接着剤組成物を用いた場合には、網目状に焼結した金属のみが観察され、添加した鱗片状の亜鉛粒子は観察されなかった。これは、亜鉛粒子が接着剤組成物硬化物4に溶け込んだものと推察される。
一方、図5から明らかであるように、比較例の接着剤組成物を用いた場合には、焼結した金属中に鱗片状の亜鉛粒子7が観察された。
この鱗片状の亜鉛粒子7は、添加した亜鉛粒子の一部が接着剤組成物硬化物4に溶け込まずに残ったものであり、周囲の金属とは結合していないように見える。このような粒子が混入することで接着力が低下するものと推察される。
(接着剤組成物の調製)
イソボルニルシクロヘキサノール1.112gとジプロピレングリコールメチルエーテルアセテート1.112g及びステアリン酸0.132gをポリ瓶に混合、密栓し50℃の水浴で暖め、時々振り混ぜながら透明均一な溶液とした。この溶液に亜鉛粒子0.0176g(固形分中の全遷移金属元素に対し0.1質量%)、鱗片状銀粒子8.791g及び球状銀粒子8.791gを添加し、スパチュラで乾燥粉がなくなるまでかき混ぜ、密栓をして自転公転型攪拌装置により、2000rpmで1分間撹拌して接着剤組成物を得た。なお、亜鉛粒子としては、表2に記載のものを用い、それ以外の原料については、実施例1等と同じものを用いた。
亜鉛粒子に代えて、表3に記載の添加粒子を用いた他は、実施例5、6と同様にして、接着剤組成物を得た。
(接着剤組成物の調製)
実施例2と同様にして接着剤組成物を調製した。
(チップと基板の熱圧着)
アルミナ基板の銅電極表面に銀めっきを施した銅板つきアルミナ基板上に接着剤組成物を10mm×10mmの正方形の開口を有するステンレス板を用いてステンシル印刷した。印刷した接着剤組成物上に、チタン、ニッケル及び金がこの順でめっきされ、1×1mm2の被着面が金めっきであるシリコンチップ(金めっきの厚み0.1μm、チップ厚:400μm)を載せ、90℃に設定したクリーンオーブンで30分間処理した後、熱圧着試験装置(テスター産業製)で300℃、10MPa、10分間熱圧着して、基板とチップを接着剤組成物で接着した。
得られたサンプルについて、「(5)断面モルフォロジー観察」に記載の方法で断面モルフォロジー観察を行った。図6は、実施例7の接着剤組成物硬化物の断面モルフォロジー観察結果の倍率1000倍のSEM写真である。図6から明らかであるように、実施例7の接着剤組成物硬化物については、接着剤組成物硬化物4中に焼結によるボイドが均一に存在し、ボイドの偏り等は見られなかった。
(接着剤組成物の調製)
イソボルニルシクロヘキサノール1.370gとジプロピレングリコールメチルエーテルアセテート1.370g及びステアリン酸0.270gをポリ瓶に混合、密栓し50℃の水浴で温め、時々振り混ぜながら透明均一な溶液とした。この溶液に鱗片状銀粒子27gを添加し、スパチュラで乾燥粉がなくなるまでかき混ぜ、密栓をして自転公転型攪拌装置により、2000rpm、1分間撹拌して接着剤組成物を得た。
(チップと基板の熱圧着)
得られた接着剤組成物について、実施例7と同様にしてチップと基板の熱圧着を行い、得られたサンプルについて、「(5)断面モルフォロジー観察」に記載の方法で断面モルフォロジー観察を行った。図7は、比較例10の接着剤組成物硬化物の断面モルフォロジー観察結果の倍率1000倍のSEM写真である。図7から明らかであるように、比較例10の接着剤組成物硬化物については、金めっき層との接続界面近傍に、他の部分より多くのボイド3が偏在している。
実施例1と同様にして接着剤組成物を調製し、ダイシェア強度用のサンプルを1組12サンプルずつ3組作製した。これら3組のダイシェア強度用のサンプルを200℃に加熱したホットプレート上で、それぞれ2、5、10時間保持して熱処理した。室温に戻した熱処理したダイシェア強度用のサンプルのダイシェア強度を測定した。結果を図8に示した。
比較例1と同様にして調製した接着剤組成物を用いた他は、実施例8と同様の方法で、ダイシェア強度用のサンプルを作製し、ダイシェア強度を測定した。結果を図8に示した。
図8から明らかであるように、実施例8では比較例11と比べて200℃で保持した場合のダイシェア強度の低下率が小さく、高温での接着性が保持できた。
Claims (9)
- 銀原子を含有する銀粒子と、金属亜鉛を含有する亜鉛粒子を含む接着剤組成物であって、
該接着剤組成物における固形分中の全遷移金属原子に対して、銀原子の含有量が90質量%以上であり、亜鉛原子の含有量が0.01質量%以上0.6質量%以下である接着剤組成物。 - 分散媒をさらに含む、請求項1に記載の接着剤組成物。
- Casson粘度が0.05Pa・s以上2.0Pa・s以下である、請求項1又は2に記載の接着剤組成物。
- 前記亜鉛粒子の一次粒子の平均粒径が50nm以上150000nm以下である、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 前記亜鉛粒子が片状である、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 前記銀粒子の一次粒子の平均粒径が0.1μm以上50μm以下である、請求項1〜5のいずれか一項に記載の接着剤組成物。
- 前記分散媒が300℃以上の沸点を有するアルコール、カルボン酸及びエステルから選ばれる少なくとも1種以上を含む、請求項2〜6のいずれか一項に記載の接着剤組成物。
- 前記接着剤組成物を熱硬化してなる硬化物の体積抵抗率及び熱伝導率が、それぞれ1×10−4Ω・cm以下、30W/m・K以上である、請求項1〜7のいずれか一項に記載の接着剤組成物。
- 請求項1〜8のいずれか一項に記載の接着剤組成物を介して、半導体素子と半導体素子搭載用支持部材が接着された構造を有する半導体装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012135231A JP5880300B2 (ja) | 2012-06-14 | 2012-06-14 | 接着剤組成物及びそれを用いた半導体装置 |
CN201380031406.XA CN104379689B (zh) | 2012-06-14 | 2013-06-14 | 粘接剂组合物及使用其的半导体装置 |
KR1020147034372A KR101940363B1 (ko) | 2012-06-14 | 2013-06-14 | 접착제 조성물 및 그것을 사용한 반도체 장치 |
MYPI2014703701A MY168936A (en) | 2012-06-14 | 2013-06-14 | Adhesive composition and semiconductor device using same |
KR1020177011362A KR20170048614A (ko) | 2012-06-14 | 2013-06-14 | 접착제 조성물 및 그것을 사용한 반도체 장치 |
EP13803841.9A EP2862910B1 (en) | 2012-06-14 | 2013-06-14 | Adhesive composition and semiconductor device using same |
PCT/JP2013/066516 WO2013187518A1 (ja) | 2012-06-14 | 2013-06-14 | 接着剤組成物及びそれを用いた半導体装置 |
TW102121273A TWI592454B (zh) | 2012-06-14 | 2013-06-14 | An adhesive composition, and a semiconductor device using the adhesive composition |
US14/407,579 US10174226B2 (en) | 2012-06-14 | 2013-06-14 | Adhesive composition and semiconductor device using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012135231A JP5880300B2 (ja) | 2012-06-14 | 2012-06-14 | 接着剤組成物及びそれを用いた半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013258122A JP2013258122A (ja) | 2013-12-26 |
JP5880300B2 true JP5880300B2 (ja) | 2016-03-08 |
Family
ID=49758336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012135231A Active JP5880300B2 (ja) | 2012-06-14 | 2012-06-14 | 接着剤組成物及びそれを用いた半導体装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10174226B2 (ja) |
EP (1) | EP2862910B1 (ja) |
JP (1) | JP5880300B2 (ja) |
KR (2) | KR20170048614A (ja) |
CN (1) | CN104379689B (ja) |
MY (1) | MY168936A (ja) |
TW (1) | TWI592454B (ja) |
WO (1) | WO2013187518A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3064556B1 (en) * | 2013-10-31 | 2019-10-02 | Showa Denko K.K. | Electrically conductive composition for thin film printing, and method for forming thin film conductive pattern |
JP2017031227A (ja) * | 2013-12-13 | 2017-02-09 | 日立化成株式会社 | 接着剤組成物及びそれを用いた半導体装置 |
JP6029720B2 (ja) * | 2014-07-31 | 2016-11-24 | Dowaエレクトロニクス株式会社 | 銀粉及びその製造方法、並びに導電性ペースト |
JP6029719B2 (ja) * | 2014-07-31 | 2016-11-24 | Dowaエレクトロニクス株式会社 | 銀粉及びその製造方法、並びに導電性ペースト |
CN104701353A (zh) * | 2015-03-27 | 2015-06-10 | 京东方科技集团股份有限公司 | 有机发光显示面板和显示装置 |
DE102015016702A1 (de) * | 2015-12-22 | 2017-06-22 | Man Truck & Bus Ag | Partikelteilchen aufweisendes Klebemittel zur Verbindung zweier Fahrzeugteile |
EP3288072A4 (en) * | 2016-07-15 | 2018-05-23 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition module and preparation method therefor |
KR102499022B1 (ko) * | 2017-03-15 | 2023-02-13 | 쇼와덴코머티리얼즈가부시끼가이샤 | 접합용 금속 페이스트, 접합체 및 그 제조 방법, 그리고 반도체 장치 및 그 제조 방법 |
US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
JP2020043126A (ja) * | 2018-09-06 | 2020-03-19 | 住友電気工業株式会社 | 炭化珪素半導体装置および炭化珪素半導体モジュール |
JP6744020B1 (ja) * | 2019-03-22 | 2020-08-19 | 大口マテリアル株式会社 | リードフレーム |
JP6736719B1 (ja) * | 2019-03-28 | 2020-08-05 | 大口マテリアル株式会社 | 半導体素子搭載用部品、リードフレーム及び半導体素子搭載用基板 |
JP2023524011A (ja) * | 2020-04-28 | 2023-06-08 | アモセンス・カンパニー・リミテッド | 接着剤転写フィルムおよびこれを用いたパワーモジュール用基板の製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0581923A (ja) * | 1991-01-31 | 1993-04-02 | Fukuda Metal Foil & Powder Co Ltd | 導電性接着剤 |
JPH06329960A (ja) * | 1993-05-21 | 1994-11-29 | Hitachi Chem Co Ltd | 導電ペースト |
JPH06336562A (ja) * | 1993-05-28 | 1994-12-06 | Hitachi Chem Co Ltd | 導電ペースト |
JP3837858B2 (ja) | 1997-08-22 | 2006-10-25 | 住友金属鉱山株式会社 | 導電性接着剤およびその使用方法 |
JP3450839B2 (ja) * | 2000-08-31 | 2003-09-29 | 松下電器産業株式会社 | 導電性接着剤を用いた実装構造体 |
US6524721B2 (en) | 2000-08-31 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Conductive adhesive and packaging structure using the same |
JP2004111254A (ja) * | 2002-09-19 | 2004-04-08 | Asahi Glass Co Ltd | 電子デバイスの電気的接続用金属含有組成物 |
JP2004111253A (ja) * | 2002-09-19 | 2004-04-08 | Noda Screen:Kk | 電子デバイスの電気的接続用導電性組成物および電子デバイス |
US20050056365A1 (en) | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
JP4828178B2 (ja) | 2004-08-18 | 2011-11-30 | ハリマ化成株式会社 | 導電性接着剤および該導電性接着剤を利用する物品の製造方法 |
JP2006073811A (ja) | 2004-09-02 | 2006-03-16 | Kyocera Chemical Corp | ダイボンディングペースト |
TW200633810A (en) * | 2004-12-28 | 2006-10-01 | Arakawa Chem Ind | Lead-free solder flux and solder paste |
JP2006302834A (ja) | 2005-04-25 | 2006-11-02 | Kyocera Chemical Corp | ダイボンディングペースト |
EP1923406A4 (en) * | 2005-08-11 | 2009-06-24 | Kyowa Hakko Chemical Co Ltd | RESIN COMPOSITION |
EP1950767B1 (en) | 2005-09-21 | 2012-08-22 | Nihon Handa Co., Ltd. | Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
CN101379163B (zh) * | 2006-02-02 | 2013-01-02 | 三菱化学株式会社 | 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物 |
WO2011035015A1 (en) | 2009-09-17 | 2011-03-24 | E. I. Du Pont De Nemours And Company | Thick-film conductive compositions with nano-sized zinc additive |
US8349658B2 (en) * | 2010-05-26 | 2013-01-08 | Stats Chippac, Ltd. | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe |
JP5827461B2 (ja) * | 2010-09-21 | 2015-12-02 | 株式会社東芝 | 導電性接合材とそれを用いた接合体、及びその接合体の製造方法 |
JP2015042696A (ja) * | 2011-12-22 | 2015-03-05 | 味の素株式会社 | 導電性接着剤 |
-
2012
- 2012-06-14 JP JP2012135231A patent/JP5880300B2/ja active Active
-
2013
- 2013-06-14 CN CN201380031406.XA patent/CN104379689B/zh active Active
- 2013-06-14 WO PCT/JP2013/066516 patent/WO2013187518A1/ja active Application Filing
- 2013-06-14 KR KR1020177011362A patent/KR20170048614A/ko not_active Application Discontinuation
- 2013-06-14 US US14/407,579 patent/US10174226B2/en active Active
- 2013-06-14 KR KR1020147034372A patent/KR101940363B1/ko active IP Right Grant
- 2013-06-14 TW TW102121273A patent/TWI592454B/zh active
- 2013-06-14 EP EP13803841.9A patent/EP2862910B1/en active Active
- 2013-06-14 MY MYPI2014703701A patent/MY168936A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201402738A (zh) | 2014-01-16 |
EP2862910B1 (en) | 2017-03-15 |
US20150137347A1 (en) | 2015-05-21 |
CN104379689B (zh) | 2017-12-19 |
KR20170048614A (ko) | 2017-05-08 |
EP2862910A4 (en) | 2016-01-27 |
US10174226B2 (en) | 2019-01-08 |
CN104379689A (zh) | 2015-02-25 |
JP2013258122A (ja) | 2013-12-26 |
EP2862910A1 (en) | 2015-04-22 |
KR20150013717A (ko) | 2015-02-05 |
KR101940363B1 (ko) | 2019-01-18 |
TWI592454B (zh) | 2017-07-21 |
WO2013187518A1 (ja) | 2013-12-19 |
MY168936A (en) | 2019-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5880300B2 (ja) | 接着剤組成物及びそれを用いた半導体装置 | |
JP7359267B2 (ja) | 接合用銅ペースト、接合体の製造方法及び半導体装置の製造方法 | |
JP6477486B2 (ja) | ダイボンドシート及び半導体装置の製造方法 | |
JP7396398B2 (ja) | 接合用銅ペースト、接合体の製造方法及び半導体装置の製造方法 | |
TWI743112B (zh) | 接合用銅糊、接合體、半導體裝置及其製造方法 | |
JP7056724B2 (ja) | 接合体及び半導体装置 | |
TWI669361B (zh) | Adhesive composition and semiconductor device using the same | |
JP6848549B2 (ja) | 接合用銅ペースト及び半導体装置 | |
JP2015109434A (ja) | ダイボンド層付き半導体素子搭載用支持部材、ダイボンド層付き半導体素子及びダイボンド層付き接合板 | |
JPWO2015060173A1 (ja) | 銀ペースト及びそれを用いた半導体装置 | |
JP2016169411A (ja) | 多孔質銀製シート及び多孔質銀製シートを用いた金属製部材接合体 | |
JP2018156736A (ja) | 接合用銅ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法 | |
JP2018152403A (ja) | ダイボンドシート及び半導体装置 | |
JP7210842B2 (ja) | 接合体の製造方法、焼結銅ピラー形成用銅ペースト、及び接合用ピラー付部材 | |
JP2015224263A (ja) | 接着剤組成物、並びにそれを用いた半導体装置及び半導体装置の製造方法 | |
JP2016054252A (ja) | ダイボンド用多孔質層付き半導体素子及びそれを用いた半導体装置の製造方法、半導体装置 | |
TWI789698B (zh) | 氧化銅糊料及電子零件之製造方法 | |
JP2016056288A (ja) | 接着剤組成物及びそれを用いた半導体装置 | |
JP2024010136A (ja) | 接合体及び半導体装置の製造方法、並びに接合用銅ペースト |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150415 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160105 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160118 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5880300 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |