JPS63317554A - 液状ポリイミド樹脂組成物 - Google Patents
液状ポリイミド樹脂組成物Info
- Publication number
- JPS63317554A JPS63317554A JP62152531A JP15253187A JPS63317554A JP S63317554 A JPS63317554 A JP S63317554A JP 62152531 A JP62152531 A JP 62152531A JP 15253187 A JP15253187 A JP 15253187A JP S63317554 A JPS63317554 A JP S63317554A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide resin
- polyimide
- dioxane
- organic group
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 title claims abstract description 23
- 239000007788 liquid Substances 0.000 title claims description 19
- 239000004642 Polyimide Substances 0.000 title abstract description 17
- 229920000642 polymer Polymers 0.000 title abstract description 3
- 239000009719 polyimide resin Substances 0.000 claims abstract description 35
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000000962 organic group Chemical group 0.000 claims abstract description 9
- 125000003118 aryl group Chemical group 0.000 claims abstract description 6
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims abstract description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical group C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 229920005575 poly(amic acid) Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000018044 dehydration Effects 0.000 description 6
- 238000006297 dehydration reaction Methods 0.000 description 6
- -1 diaminosiloxane Chemical class 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000009835 boiling Methods 0.000 description 5
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 5
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000862 absorption spectrum Methods 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 125000005462 imide group Chemical group 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000001226 reprecipitation Methods 0.000 description 2
- 238000006798 ring closing metathesis reaction Methods 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JHUUPUMBZGWODW-UHFFFAOYSA-N 3,6-dihydro-1,2-dioxine Chemical compound C1OOCC=C1 JHUUPUMBZGWODW-UHFFFAOYSA-N 0.000 description 1
- JFEXPVDGVLNUSC-UHFFFAOYSA-N 3-(3-aminophenyl)sulfanylaniline Chemical compound NC1=CC=CC(SC=2C=C(N)C=CC=2)=C1 JFEXPVDGVLNUSC-UHFFFAOYSA-N 0.000 description 1
- RNDWVSUBNRMXMN-UHFFFAOYSA-N 3-(benzenesulfonyl)aniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=CC=CC=2)=C1 RNDWVSUBNRMXMN-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- GJCJZNPUDLWINR-UHFFFAOYSA-N 4-[4-[[4-(4-aminophenoxy)-3-methylphenyl]methyl]-2-methylphenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C(C)=CC=1CC(C=C1C)=CC=C1OC1=CC=C(N)C=C1 GJCJZNPUDLWINR-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 208000009043 Chemical Burns Diseases 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- DMSZORWOGDLWGN-UHFFFAOYSA-N ctk1a3526 Chemical compound NP(N)(N)=O DMSZORWOGDLWGN-UHFFFAOYSA-N 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62152531A JPS63317554A (ja) | 1987-06-19 | 1987-06-19 | 液状ポリイミド樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62152531A JPS63317554A (ja) | 1987-06-19 | 1987-06-19 | 液状ポリイミド樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63317554A true JPS63317554A (ja) | 1988-12-26 |
JPH0377228B2 JPH0377228B2 (zh) | 1991-12-09 |
Family
ID=15542476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62152531A Granted JPS63317554A (ja) | 1987-06-19 | 1987-06-19 | 液状ポリイミド樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63317554A (zh) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0211631A (ja) * | 1988-06-30 | 1990-01-16 | Nippon Steel Chem Co Ltd | 半導体保護用樹脂及び半導体 |
JPH03195730A (ja) * | 1989-12-25 | 1991-08-27 | Hitachi Chem Co Ltd | シロキサン変性ポリイミド及びその前駆体 |
JPH0423833A (ja) * | 1990-05-18 | 1992-01-28 | Ube Ind Ltd | 塗膜形成用のポリイミドシロキサン組成物および膜 |
JPH0436321A (ja) * | 1990-06-01 | 1992-02-06 | Ube Ind Ltd | ポリイミドシロキサン組成物および固化膜 |
JPH0598233A (ja) * | 1991-10-14 | 1993-04-20 | Sumitomo Bakelite Co Ltd | 熱圧着可能なフイルム状接着剤 |
JPH05117621A (ja) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | 熱圧着可能な高熱伝導性フイルム状接着剤 |
JPH05331445A (ja) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | フィルム接着剤の製造方法 |
JP2010238562A (ja) * | 2009-03-31 | 2010-10-21 | Shin-Etsu Chemical Co Ltd | リチウム二次電池、そのリチウム二次電池の製造方法及びそれに用いられるリチウム二次電池用バインダー前駆体溶液 |
JP2011086480A (ja) * | 2009-10-15 | 2011-04-28 | Toray Ind Inc | リチウムイオン電池電極用バインダー、それを用いたリチウムイオン電池電極用ペーストおよびリチウムイオン電池電極の製造方法 |
WO2018030410A1 (ja) * | 2016-08-10 | 2018-02-15 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JP2018028073A (ja) * | 2016-08-10 | 2018-02-22 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
WO2018062190A1 (ja) * | 2016-09-30 | 2018-04-05 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JP2018059075A (ja) * | 2016-09-30 | 2018-04-12 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
WO2018186262A1 (ja) * | 2017-04-06 | 2018-10-11 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JPWO2018230495A1 (ja) * | 2017-06-16 | 2020-04-16 | 大日本印刷株式会社 | 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5450452A (en) * | 1977-09-29 | 1979-04-20 | Ishihara Chemical Co Ltd | Lubricant for plasticising process of metal |
JPS57143327A (en) * | 1981-02-27 | 1982-09-04 | Nitto Electric Ind Co Ltd | Production of siloxane-modified polyimide precursor |
JPS59108068A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | ペ−スト組成物 |
JPS59113035A (ja) * | 1983-12-05 | 1984-06-29 | Nitto Electric Ind Co Ltd | 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61195832A (ja) * | 1985-02-27 | 1986-08-30 | 日東電工株式会社 | ポリイミド−金属箔複合フイルム |
-
1987
- 1987-06-19 JP JP62152531A patent/JPS63317554A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5450452A (en) * | 1977-09-29 | 1979-04-20 | Ishihara Chemical Co Ltd | Lubricant for plasticising process of metal |
JPS57143327A (en) * | 1981-02-27 | 1982-09-04 | Nitto Electric Ind Co Ltd | Production of siloxane-modified polyimide precursor |
JPS59108068A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | ペ−スト組成物 |
JPS59113035A (ja) * | 1983-12-05 | 1984-06-29 | Nitto Electric Ind Co Ltd | 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0211631A (ja) * | 1988-06-30 | 1990-01-16 | Nippon Steel Chem Co Ltd | 半導体保護用樹脂及び半導体 |
JPH03195730A (ja) * | 1989-12-25 | 1991-08-27 | Hitachi Chem Co Ltd | シロキサン変性ポリイミド及びその前駆体 |
JPH0423833A (ja) * | 1990-05-18 | 1992-01-28 | Ube Ind Ltd | 塗膜形成用のポリイミドシロキサン組成物および膜 |
JPH0436321A (ja) * | 1990-06-01 | 1992-02-06 | Ube Ind Ltd | ポリイミドシロキサン組成物および固化膜 |
JPH0598233A (ja) * | 1991-10-14 | 1993-04-20 | Sumitomo Bakelite Co Ltd | 熱圧着可能なフイルム状接着剤 |
JPH05117621A (ja) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | 熱圧着可能な高熱伝導性フイルム状接着剤 |
JPH05331445A (ja) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | フィルム接着剤の製造方法 |
JP2010238562A (ja) * | 2009-03-31 | 2010-10-21 | Shin-Etsu Chemical Co Ltd | リチウム二次電池、そのリチウム二次電池の製造方法及びそれに用いられるリチウム二次電池用バインダー前駆体溶液 |
JP2011086480A (ja) * | 2009-10-15 | 2011-04-28 | Toray Ind Inc | リチウムイオン電池電極用バインダー、それを用いたリチウムイオン電池電極用ペーストおよびリチウムイオン電池電極の製造方法 |
WO2018030410A1 (ja) * | 2016-08-10 | 2018-02-15 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JP2018028073A (ja) * | 2016-08-10 | 2018-02-22 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
TWI778970B (zh) * | 2016-08-10 | 2022-10-01 | 日商大日本印刷股份有限公司 | 聚醯亞胺膜、積層體、及顯示器用表面材料 |
US11566108B2 (en) | 2016-08-10 | 2023-01-31 | Dai Nippon Printing Co., Ltd. | Polyimide film, laminate and surface material for display |
WO2018062190A1 (ja) * | 2016-09-30 | 2018-04-05 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JP2018059075A (ja) * | 2016-09-30 | 2018-04-12 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
WO2018186262A1 (ja) * | 2017-04-06 | 2018-10-11 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JPWO2018186262A1 (ja) * | 2017-04-06 | 2020-02-13 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
JPWO2018230495A1 (ja) * | 2017-06-16 | 2020-04-16 | 大日本印刷株式会社 | 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0377228B2 (zh) | 1991-12-09 |
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