JPS58168135U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58168135U
JPS58168135U JP1982065873U JP6587382U JPS58168135U JP S58168135 U JPS58168135 U JP S58168135U JP 1982065873 U JP1982065873 U JP 1982065873U JP 6587382 U JP6587382 U JP 6587382U JP S58168135 U JPS58168135 U JP S58168135U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor
abstract
heat sink
metal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982065873U
Other languages
English (en)
Inventor
小林　経広
真一 小林
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP1982065873U priority Critical patent/JPS58168135U/ja
Publication of JPS58168135U publication Critical patent/JPS58168135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のチップ絶縁形半導体装置の一例の断面図
、第２図は本考案の一実施例の断面図である。 １・・・半導体チップ、２・・・モリブデン板、３・・
・金属基板、４・・・セラミック板、５・・・ヒートシ
ンク（本体）、６・・・軟ろう層、７・・・鉄板、８・
・・硬ろう層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チップと金属基板上に固着されたセラミック板と
    の間にそう人され、それぞれと軟ろう付けされるヒート
    シンクが、熱良導性本体の前記チップ側にモリブデンま
    たはダンゲステンの層を、前記セラミック板側には鉄ま
    たはその合金の層を備えたことを特徴とする半導体装置
    。
JP1982065873U 1982-05-06 1982-05-06 半導体装置 Pending JPS58168135U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982065873U JPS58168135U (ja) 1982-05-06 1982-05-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982065873U JPS58168135U (ja) 1982-05-06 1982-05-06 半導体装置

Publications (1)

Publication Number Publication Date
JPS58168135U true JPS58168135U (ja) 1983-11-09

Family

ID=30075797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982065873U Pending JPS58168135U (ja) 1982-05-06 1982-05-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS58168135U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207038U (ja) * 1985-06-14 1986-12-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207038U (ja) * 1985-06-14 1986-12-27

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