JPS6142861U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6142861U
JPS6142861U JP1984126031U JP12603184U JPS6142861U JP S6142861 U JPS6142861 U JP S6142861U JP 1984126031 U JP1984126031 U JP 1984126031U JP 12603184 U JP12603184 U JP 12603184U JP S6142861 U JPS6142861 U JP S6142861U
Authority
JP
Japan
Prior art keywords
metal electrode
semiconductor equipment
oxide film
semiconductor device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984126031U
Other languages
English (en)
Inventor
忠彦 田中
敏雄 若林
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984126031U priority Critical patent/JPS6142861U/ja
Publication of JPS6142861U publication Critical patent/JPS6142861U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案を説明する断面図で、第２図は従来例を
説明する横面図である。 主な図番の説明、１は半導体チップ、３は金属電極、６
はチップ部品である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板と該半導体基板に形成した回路素子と前記基
    板表面を被覆する酸化膜と該酸化膜の一部に付着した金
    属電極と該金属電極と前記回路束子とを接続する導体パ
    ターンと前記金属電極に固着したチップ部品とを具備す
    ることを特徴とす８半導体装置。
JP1984126031U 1984-08-20 1984-08-20 半導体装置 Pending JPS6142861U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984126031U JPS6142861U (ja) 1984-08-20 1984-08-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984126031U JPS6142861U (ja) 1984-08-20 1984-08-20 半導体装置

Publications (1)

Publication Number Publication Date
JPS6142861U true JPS6142861U (ja) 1986-03-19

Family

ID=30684717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984126031U Pending JPS6142861U (ja) 1984-08-20 1984-08-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS6142861U (ja)

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