JPS61207038U - - Google Patents

Info

Publication number
JPS61207038U
JPS61207038U JP1985090600U JP9060085U JPS61207038U JP S61207038 U JPS61207038 U JP S61207038U JP 1985090600 U JP1985090600 U JP 1985090600U JP 9060085 U JP9060085 U JP 9060085U JP S61207038 U JPS61207038 U JP S61207038U
Authority
JP
Japan
Prior art keywords
heat sink
mounting structure
soldered
metal plate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985090600U
Other languages
English (en)
Other versions
JPH0739233Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985090600U priority Critical patent/JPH0739233Y2/ja
Publication of JPS61207038U publication Critical patent/JPS61207038U/ja
Application granted granted Critical
Publication of JPH0739233Y2 publication Critical patent/JPH0739233Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案になる半導体装置の取付構造の
一実施例の構成を示す要部縦断面図、第２図は従
来の構造を示す要部縦断面図、第３図は第２図図
示の従来構造における欠点を示す要部縦断面図で
ある。 １…パワー素子、２…ヒートシンク、３…絶縁
板、４…接合材（はんだ）、５…放熱体、６…金
属板、７…堀り込み部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱体に２段以上の堀り込み部を設け、前記放
    熱体と、半導体素子が搭載された絶縁板との間に
    はんだ付け可能な金属板を挿入してはんだ付けし
    てなることを特徴とする半導体装置の取付構造。
JP1985090600U 1985-06-14 1985-06-14 半導体装置の取付構造 Expired - Lifetime JPH0739233Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985090600U JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985090600U JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Publications (2)

Publication Number Publication Date
JPS61207038U true JPS61207038U (ja) 1986-12-27
JPH0739233Y2 JPH0739233Y2 (ja) 1995-09-06

Family

ID=30645738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985090600U Expired - Lifetime JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Country Status (1)

Country Link
JP (1) JPH0739233Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005328087A (ja) * 1999-03-24 2005-11-24 Mitsubishi Materials Corp パワーモジュール用基板
JP2008277654A (ja) * 2007-05-02 2008-11-13 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板及びパワーモジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168135U (ja) * 1982-05-06 1983-11-09 富士電機株式会社 半導体装置
JPS59175131A (ja) * 1983-03-24 1984-10-03 Fuji Electric Co Ltd 混成集積回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168135U (ja) * 1982-05-06 1983-11-09 富士電機株式会社 半導体装置
JPS59175131A (ja) * 1983-03-24 1984-10-03 Fuji Electric Co Ltd 混成集積回路

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005328087A (ja) * 1999-03-24 2005-11-24 Mitsubishi Materials Corp パワーモジュール用基板
JP2008277654A (ja) * 2007-05-02 2008-11-13 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板及びパワーモジュール

Also Published As

Publication number Publication date
JPH0739233Y2 (ja) 1995-09-06

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