JPS60146349U - 半導体装置の放熱板半田付け構造 - Google Patents

半導体装置の放熱板半田付け構造

Info

Publication number
JPS60146349U
JPS60146349U JP1984034242U JP3424284U JPS60146349U JP S60146349 U JPS60146349 U JP S60146349U JP 1984034242 U JP1984034242 U JP 1984034242U JP 3424284 U JP3424284 U JP 3424284U JP S60146349 U JPS60146349 U JP S60146349U
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode plate
heat sink
device heat
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984034242U
Other languages
English (en)
Inventor
上川　孝
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1984034242U priority Critical patent/JPS60146349U/ja
Publication of JPS60146349U publication Critical patent/JPS60146349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のダイオードの構成を示す断面図、第２図
はこの考案の一実施例の構成を示す断面図、第３図はこ
の実施例に用いる電極板の斜視図、第４図はこの考案の
他の実施例の構成を示す断面図、第５図は第４図の実施
例に用いる電極板の斜視図、第６図はこの考案に用いる
電極板の他の例を示す斜視図である。 図において、１は半導体基体、２Ａ、　　２Ｂ、　　２
Ｃは電極板、４は放熱板、６．　６ａ、　６ｂ、　６ｃ
は半田材、９は貫通孔、１１は溝である。なお、図中同
一符号は同一または相当部分を示す。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）半導体基体に少なくとも電極板を介して冷却用放
    熱板を重ね、それぞれの間を半田付けしてなる構造にお
    いて、上記電極板の上記半導体基体との半田付は部位よ
    り外側の部位に貫通孔を設けたことを特徴とする半導体
    装置の放熱板半田付は構造。
  2. （２）電極板は半導体基体側主要に貫通孔から上記電極
    板の外端縁に達する溝を有することを特徴とする実用新
    案登録請求の範囲第１項記載の半導体装置の放熱板半田
    付は構造。
JP1984034242U 1984-03-07 1984-03-07 半導体装置の放熱板半田付け構造 Pending JPS60146349U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984034242U JPS60146349U (ja) 1984-03-07 1984-03-07 半導体装置の放熱板半田付け構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984034242U JPS60146349U (ja) 1984-03-07 1984-03-07 半導体装置の放熱板半田付け構造

Publications (1)

Publication Number Publication Date
JPS60146349U true JPS60146349U (ja) 1985-09-28

Family

ID=30537429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984034242U Pending JPS60146349U (ja) 1984-03-07 1984-03-07 半導体装置の放熱板半田付け構造

Country Status (1)

Country Link
JP (1) JPS60146349U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273155A (ja) * 1991-02-27 1992-09-29 Nec Corp パワー用混成集積回路の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273155A (ja) * 1991-02-27 1992-09-29 Nec Corp パワー用混成集積回路の製造方法

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