JPS5948047U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5948047U
JPS5948047U JP12740083U JP12740083U JPS5948047U JP S5948047 U JPS5948047 U JP S5948047U JP 12740083 U JP12740083 U JP 12740083U JP 12740083 U JP12740083 U JP 12740083U JP S5948047 U JPS5948047 U JP S5948047U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
package
plating layer
silicon chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12740083U
Other languages
English (en)
Inventor
邦彦 林
菅原　武久
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP12740083U priority Critical patent/JPS5948047U/ja
Publication of JPS5948047U publication Critical patent/JPS5948047U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案の実施例の構造の説明図であって、第１図は
パッケージに金−ゲルマニウム半田ヲ施すときの状態を
示す説明図、第２図はパッケージにシリコン・チップを
接合するときの状態を示す説明図である。 図において、１は金−ゲルマニウム合金半田の層、２は
ニッケルめっき層、３はパッケージ用金属板、４はパッ
ケージ、５はシリコン・チップを示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. メタライズしたセラミック表面にニッケルめっき層を有
    するパッケージに、金ゲルマニウム合金゛半田を介して
    半導体装置用シリコン・チップを接合したことを特徴と
    する半導体装置。
JP12740083U 1983-08-18 1983-08-18 半導体装置 Pending JPS5948047U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12740083U JPS5948047U (ja) 1983-08-18 1983-08-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12740083U JPS5948047U (ja) 1983-08-18 1983-08-18 半導体装置

Publications (1)

Publication Number Publication Date
JPS5948047U true JPS5948047U (ja) 1984-03-30

Family

ID=30289363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12740083U Pending JPS5948047U (ja) 1983-08-18 1983-08-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS5948047U (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613989A (en) * 1979-07-16 1981-02-10 Sanyo Electric Co Washing device
JPS5615797A (en) * 1979-07-20 1981-02-16 Sanyo Electric Co Washing device
JPS5627299A (en) * 1979-08-11 1981-03-17 Sanyo Electric Co Washing device
JPS5643992A (en) * 1979-09-17 1981-04-22 Sanyo Electric Co Washing device
JPS5657490A (en) * 1979-10-16 1981-05-19 Sanyo Electric Co Washing device
JPS571394A (en) * 1980-06-05 1982-01-06 Sanyo Electric Co Washing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613989A (en) * 1979-07-16 1981-02-10 Sanyo Electric Co Washing device
JPS5615797A (en) * 1979-07-20 1981-02-16 Sanyo Electric Co Washing device
JPS5627299A (en) * 1979-08-11 1981-03-17 Sanyo Electric Co Washing device
JPS5643992A (en) * 1979-09-17 1981-04-22 Sanyo Electric Co Washing device
JPS5657490A (en) * 1979-10-16 1981-05-19 Sanyo Electric Co Washing device
JPS571394A (en) * 1980-06-05 1982-01-06 Sanyo Electric Co Washing device

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