JPH0143478B2 - - Google Patents
Info
- Publication number
- JPH0143478B2 JPH0143478B2 JP55169804A JP16980480A JPH0143478B2 JP H0143478 B2 JPH0143478 B2 JP H0143478B2 JP 55169804 A JP55169804 A JP 55169804A JP 16980480 A JP16980480 A JP 16980480A JP H0143478 B2 JPH0143478 B2 JP H0143478B2
- Authority
- JP
- Japan
- Prior art keywords
- printing
- conductive paint
- hole
- squeegee
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007639 printing Methods 0.000 claims description 45
- 239000003973 paint Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はスルホールプリント配線板の両面導通
を導電ペイントによつて形成するスルホールプリ
ント配線板の製造方法の改良に関し、スクリーン
印刷機にて、簡単に導電ペイントを孔内に充填す
ることができる方法を提供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a through-hole printed wiring board in which conductivity on both sides of the board is formed using conductive paint. The present invention provides a method that can be filled.
従来、導電ペイントで両面の導通をする方法と
しては、導通すべき孔にピンなどに導電ペイント
を付着させた後、孔にピンを押しこんで、孔壁に
導電ペイントを塗布し、両面を導通させる方法が
一般的であるが、特殊な塗布機が必要であり、設
備費が高く、導通孔の孔あけにおいて、打抜きに
よる寸法の変動が大きいため、導電ペイント塗布
機と孔位置とを精度よく合致させることが不可能
であり、均一な導電ペイントの塗布は困難であつ
た。また、ピンに導電ペイントを付着させて、孔
に挿入する時、孔径よりも大きな径の導電ペイン
トを付着させて塗布しないと孔壁全周に導電ペイ
ントが付着しない部分が発生するため、インキを
必要以上に多量に塗布する必要があり、そのため
孔の周囲にも導電ペイントの大きな付着域が発生
する。したがつて、高密度化を計るためには大き
な障害となるなどの欠点を有するものであつた。 Conventionally, the method of establishing conductivity on both sides with conductive paint is to attach conductive paint to a pin or the like in the hole where conductivity is to be established, then push the pin into the hole, apply conductive paint to the hole wall, and establish conductivity on both sides. The most common method is to use a conductive paint applicator, but it requires a special coating machine, the equipment cost is high, and the dimensions of the conductive holes vary greatly due to punching. It was impossible to match, and uniform application of conductive paint was difficult. Also, when applying conductive paint to the pin and inserting it into the hole, if you do not apply conductive paint with a diameter larger than the hole diameter, there will be areas around the hole wall where the conductive paint does not adhere, so use more ink than necessary. A large amount of conductive paint must be applied to the pores, resulting in a large area of conductive paint around the pores. Therefore, it has drawbacks such as being a major hindrance to achieving higher density.
また、導電ペイントを孔に充填するのにスクリ
ーン印刷によつて行なう方法も知られているが、
印刷するのと同時に吸引が必要であり、吸引量を
調整できる特殊なスクリーン印刷機でないと印刷
ができない。また、プリント配線板が板厚1.6mm
の標準厚さの場合には、吸引をしても、導電ペイ
ントを十分な厚さで孔内に充填することは不可能
であり、ピンで塗布した製品より信頼性の乏しい
ものしかできないものであつた。また、吸引によ
り導電ペイントを強制的に引くため、裏面への導
電ペイントの不要な飛散が多い。スクリーン版を
吸引のために密着させたりすると導電ペイントの
にじみが発生し、精度の良い塗布ができないなど
の欠点を有するものであつた。 Another known method is to use screen printing to fill the holes with conductive paint.
Suction is required at the same time as printing, and printing is only possible with a special screen printing machine that can adjust the amount of suction. In addition, the printed wiring board is 1.6mm thick.
standard thickness, it is impossible to fill the holes with conductive paint to a sufficient thickness even with suction, and the result is less reliable than a pin-applied product. It was hot. Furthermore, since the conductive paint is forcibly pulled by suction, the conductive paint is often unnecessarily scattered onto the back surface. If the screen plate is brought into close contact with the screen plate for suction, the conductive paint will bleed, making it impossible to apply accurately.
本発明はこのような従来の欠点を解消し、簡単
に、どこにでもあるスクリーン印刷機で、導電ペ
イントを孔に充填できるスルホールプリント配線
板の製造方法に関するものである。 The present invention overcomes these conventional drawbacks and relates to a method for manufacturing a through-hole printed wiring board, which allows the holes to be easily filled with conductive paint using a screen printing machine that can be found anywhere.
すなわち、本発明は通常使用されているスキー
ジの先端角度を調整することにより、印刷基板と
の印刷角度を極端に小さくし、吸引をしないで導
電ペイントを孔に十分に充填できるようにしたこ
とを特徴としている。 In other words, the present invention makes it possible to extremely reduce the printing angle with the printed circuit board by adjusting the tip angle of a commonly used squeegee, making it possible to sufficiently fill the holes with conductive paint without suction. It is a feature.
以下、図面を参照にしながら本発明を説明す
る。第１図Ａ，Ｂは通常におけるスクリーン印刷
法の断面図であり、印刷基板１上にスクリーン版
２を配し、スキージ３を移動することにより導電
ペイント４を印刷基板１上に印刷している。しか
し、この方法で印刷しても印刷基板１の孔５を充
填することはできない。平面上への印刷はできて
も孔５へも充填するほどの十分な導電ペイント４
はスクリーンの乳剤厚を厚くしても困難であり、
どうしても吸引を必要とするものである。 The present invention will be described below with reference to the drawings. FIGS. 1A and 1B are cross-sectional views of the usual screen printing method, in which a screen plate 2 is placed on a printing board 1 and a conductive paint 4 is printed on the printing board 1 by moving a squeegee 3. . However, even if printed using this method, the holes 5 in the printed circuit board 1 cannot be filled. The conductive paint 4 is sufficient to print on a flat surface but also fill the holes 5.
is difficult even if the emulsion thickness of the screen is increased;
It absolutely requires suction.
本発明はこれらの欠点をスキージの先端角度を
調整することにより解決したことにある。すなわ
ち、第２図Ａ，Ｂにみられるようなスキージ３の
加工により、被印刷物への印刷角度を極度に小さ
くすることにより、吸引もなく導電ペイント４を
多量にスクリーン版２より押し出すようにしたも
のである。第１図Ａの印刷方式では一般にスキー
ジ３の取付角度を調整できるが、印刷基板１との
印刷角度を60゜以下にするとスキージ３が印刷時
に逃げてしまい十分な印圧が加わらないため、印
刷が不均一となり、導電ペイント４も十分でてこ
ないしにじみが発生し、印刷は不可能である。ま
た、60゜以上の印刷角度で印刷すると平面への印
刷は良好にできるが、孔５内への導電ペイント４
の充填はほとんど期待できない。 The present invention solves these drawbacks by adjusting the tip angle of the squeegee. That is, by processing the squeegee 3 as shown in FIGS. 2A and 2B to make the printing angle on the printing material extremely small, a large amount of the conductive paint 4 can be pushed out from the screen plate 2 without suction. It is something. In the printing method shown in Fig. 1A, the mounting angle of the squeegee 3 can generally be adjusted, but if the printing angle with the printing board 1 is set to less than 60 degrees, the squeegee 3 will escape during printing and insufficient printing pressure will be applied. The conductive paint 4 does not come out sufficiently and bleeds occur, making printing impossible. In addition, printing at a printing angle of 60° or more can print well on a flat surface, but if the conductive paint 4 inside the holes 5
filling is hardly expected.
そこで、本発明者らは第２図Ａのようにスキー
ジ３の先端を加工した。先端の角度７を３〜40゜
とし、さらにスキージ３の取付角度を60度〜90度
に調整した。このスキージ３で印刷をすると孔５
へ導電ペイント４が多量に入るようになり、にじ
みのない印刷ができた。この時の印刷基板１とス
キージ３の印刷角度は取付角度の調整により40゜
以下になつていた。スキージ３の先端角度が40゜
以上の場合には、孔５への導電ペイント４の充填
量を十分に確保することは困難であつた。また、
第１図Ｂの印刷方式でも第２図Ｂのスキージ３の
先端角度を３〜40゜の範囲、好ましくは３〜25゜に
するのが良好であつた。スキージ３の先端角度を
3゜以下にすると、印刷時にスキージ３が印圧で変
形し、先端の角度が失なわれ、先端を調整した意
味がなくなり、導電ペイント４の孔５への充填は
困難であつた。 Therefore, the present inventors processed the tip of the squeegee 3 as shown in FIG. 2A. The angle 7 of the tip was set to 3 to 40 degrees, and the mounting angle of the squeegee 3 was adjusted to 60 to 90 degrees. When printing with this squeegee 3, holes 5
A large amount of the conductive paint 4 came to be applied, and printing without bleeding was possible. At this time, the printing angle between the printed circuit board 1 and the squeegee 3 was 40° or less by adjusting the mounting angle. When the tip angle of the squeegee 3 is 40 degrees or more, it is difficult to ensure that the hole 5 is filled with a sufficient amount of the conductive paint 4. Also,
Even in the printing method shown in FIG. 1B, it was found that the tip angle of the squeegee 3 shown in FIG. 2B was preferably in the range of 3 to 40 degrees, preferably 3 to 25 degrees. Adjust the tip angle of squeegee 3
If the angle is less than 3 degrees, the squeegee 3 is deformed by the printing pressure during printing, the angle of the tip is lost, the adjustment of the tip becomes meaningless, and it is difficult to fill the holes 5 with the conductive paint 4.
ここで、本発明の一実施例について第３図によ
つてのべる。先ず、印刷基板としての両面銅張積
層板１にパターン印刷をし、エツチングにより必
要な回路パターンを形成する。片面の銅張板およ
び、アデイテイブ法によるパターン形成法によつ
てもよい。次に、両面を導通すべき個所にプレス
やドリル法により孔あけをし、この導通すべき孔
５の直径より大きな外周ランド直径を中心線をほ
ぼ一致させて配置したスクリーン版２（ポリエス
テル繊維布200メツシユ。マスク用乳剤塗布層の
厚さ30μ）を、前記孔５上に多少の間隔をもつて
配置する。孔あけのされた印刷基板１の導通孔５
の下には孔径より大きな孔径で孔６′をあけた厚
さ３mm以上の平板よりなる印刷用下板６（例えば
アルミ板）を配置する。板厚が３mm以下の場合は
導電ペイント４の印刷時に導電ペイント４が印刷
機のテーブル１２に付着し、孔５へ充填した導電
ペイント４を取去つてしまう恐れがある。また、
印刷用下板６の孔６′の直径は、印刷基板の導電
ペイント印刷孔より、直径において0.1mm以上好
ましくは0.2mm以上あけることが必要である。ス
キージ３は第２図ＡまたはＢのように先端の角度
を３〜40゜に加工した。このスキージ３を印刷機
（例えばアルゴン社のコンパクトＩ型印刷機）に
取付け、導電ペイント４（デユポン社5504A）を
スクリーン版２上に適量のせ、スキージ３をマス
ク孔のある方向へ移動させて、印刷基板１の孔内
５へ導電ペイント４を充填した。第５図に示すよ
うにこの時のスキージ３の取付角度９と印圧は印
刷される印刷基板１の孔径や板厚によつて異なつ
てくるが、印刷基板１とスキージ３との印刷角度
１０は３〜40゜ほどであつた。この印刷により、
導電ペイント４は孔５の両面に孔径より大きなラ
ンド径で銅箔ランド１１ににじみもなく均一に付
着するとともに孔５内にも充填された。この印刷
基板１はしばらく放置し、導電ペイント４の溶剤
をほゞ揮発させたのちに（溶剤レスの導電ペイン
トでは必ずしも必要はない）150℃―30分の硬化
により、第４図に示すように両面の導通を完成さ
せた。１ホールの抵抗値は板厚1.6mmで10〜20ｍ
Ω.板厚0.8mmで５〜10ｍΩ従来の方法による板厚
1.6mmの抵抗値15〜60ｍΩ板厚0.8mmで５〜40ｍΩ
より、バラツキを小さくできた。また、孔周囲の
導電ペイントの印刷されたランドの直径は印刷用
マスクのランド径にほぼ等しい径で印刷面は設計
で自由に設定でき、孔径との関係より1.0φの孔に
対して1.2、1.4、1.6、2.0、2.4といつた印刷ラン
ドの組合せが可能である。印刷の裏面のランド径
も印圧スキージ角度の調整によつて、表ランド径
より小さくも、大きくもできる。そして孔径をせ
ばめることにより従来より、高密度化が可能とな
つた。スルホールの260℃20秒のオイルデツプ５
サイクルの試験での抵抗値変化率も均一なスルホ
ール導通によりバラツキが少ないものとなり、従
来の特性の変化の小さい部分に集中するようにな
つた。 Here, one embodiment of the present invention will be described with reference to FIG. First, a pattern is printed on a double-sided copper-clad laminate 1 serving as a printed circuit board, and a necessary circuit pattern is formed by etching. A single-sided copper clad plate and an additive pattern forming method may be used. Next, holes are made by pressing or drilling at the locations where electrical conduction is to be made on both sides, and the screen plate 2 (polyester fiber cloth A mask emulsion coating layer of 200 mesh (thickness: 30 μm) is placed over the hole 5 with some spacing. Conductive holes 5 of the printed circuit board 1 that have been drilled
A lower printing plate 6 (for example, an aluminum plate) made of a flat plate with a thickness of 3 mm or more and having holes 6' with a hole diameter larger than the hole diameter is placed below. If the plate thickness is 3 mm or less, the conductive paint 4 may adhere to the table 12 of the printing machine during printing, and the conductive paint 4 filled into the holes 5 may be removed. Also,
The diameter of the hole 6' in the lower printing plate 6 must be 0.1 mm or more, preferably 0.2 mm or more in diameter, than the conductive paint printing hole on the printing board. The tip of squeegee 3 was machined to have an angle of 3 to 40 degrees as shown in Fig. 2 A or B. Attach this squeegee 3 to a printing machine (for example, Argon's Compact I type printing machine), place an appropriate amount of conductive paint 4 (DuPont 5504A) on the screen plate 2, and move the squeegee 3 in the direction of the mask hole. The conductive paint 4 was filled into the holes 5 of the printed circuit board 1. As shown in FIG. 5, the mounting angle 9 of the squeegee 3 and the printing pressure at this time vary depending on the hole diameter and board thickness of the printed circuit board 1 to be printed, but the printing angle 9 between the printed circuit board 1 and the squeegee 3 is The angle was about 3 to 40 degrees. With this printing,
The conductive paint 4 adhered uniformly to the copper foil land 11 on both sides of the hole 5 with a land diameter larger than the hole diameter without bleeding, and also filled the hole 5. This printed circuit board 1 was left for a while to volatilize most of the solvent in the conductive paint 4 (this is not necessarily necessary for solvent-less conductive paint), and then cured at 150°C for 30 minutes to form a film as shown in Figure 4. Completed continuity on both sides. The resistance value of one hole is 10 to 20 m with a board thickness of 1.6 mm.
Ω.Plate thickness of 0.8mm and 5 to 10mΩ by conventional method
Resistance value of 1.6mm 15~60mΩ 5~40mΩ with plate thickness 0.8mm
This made it possible to reduce the variation. In addition, the diameter of the land printed with conductive paint around the hole is almost the same as the land diameter of the printing mask, and the printing surface can be freely set in the design. Combinations of printing lands such as 1.4, 1.6, 2.0, and 2.4 are possible. The land diameter on the back side of printing can be made smaller or larger than the front land diameter by adjusting the printing pressure squeegee angle. By narrowing the pore diameter, it has become possible to achieve higher density than before. Through hole oil depth 5 at 260℃ for 20 seconds
The rate of change in resistance value during cycle tests also has less variation due to uniform through-hole conduction, and is now concentrated in areas where the change in characteristics is small compared to conventional methods.
このような本発明のスルホールプリント配線板
製造方法は一般のスクリーン印刷機により、簡単
に孔へ導電ペイントを充填でき、スクリーン法で
あるため、精度の良い、均一なスルホール導通
と、均一な両面のランド形成により、より高密度
化ができ、ワークサイズの大板化による生産性向
上、吸引なしのため、導電ペイントの飛散もな
く、導電ペイントの孔内への充填を十分に厚くで
きるため、特性の良好な導通が可能となるなど、
工業的価値は非常に大なるものである。 The through-hole printed wiring board manufacturing method of the present invention can easily fill the holes with conductive paint using a general screen printing machine, and because it is a screen method, it can achieve accurate and uniform through-hole conduction and uniform both sides. By forming a land, higher density can be achieved, productivity can be improved by increasing the size of the workpiece, there is no suction, there is no scattering of conductive paint, and the holes can be filled with conductive paint sufficiently thickly, so the characteristics Good conduction is possible, etc.
The industrial value is enormous.
なお、前記内容において、スキージのゴム硬度
を軟かくしたり、丸形のスキージを使用すること
により、類似の効果をだすことも可能である。 In addition, in the above content, it is also possible to produce a similar effect by softening the rubber hardness of the squeegee or using a round squeegee.
またスキージの先端角の頂点をスキージー中央
より、前面、中央、後方にもつてくること、スキ
ージーのバツクを平たんにしたり、はねあげにす
ることによつても、擬似的にゴム硬度や、印圧を
変化させる効果をもたせることができる。 Also, by bringing the tip angle of the squeegee to the front, center, or rear of the squeegee center, or by making the back of the squeegee flat or raised, it is possible to simulate the rubber hardness and printing pressure. It can have the effect of changing the
第１図Ａ，Ｂは一般的なスクリーン印刷の断面
図、第２図Ａ，Ｂは本発明のスルホールプリント
配線板の製造方法に用いるスキージの形状の断面
図、第３図は本発明の製造方法によるスクリーン
印刷の断面図、第４図は本発明による両面導通ス
ルホールの断面図、第５図は印刷時のスキージの
取付角度と印刷角度を示す断面図である。
１……印刷基板、２……スクリーン版、３……
スキージ、４……導電ペイント、５……両面の導
通孔、６……印刷用下板、７……スキージの先端
角度、８……スキージのはねあげ、９……取付角
度、１０……印刷角度、１１……銅箔ランド。
Figures 1A and B are cross-sectional views of general screen printing, Figures 2 A and B are cross-sectional views of the shape of a squeegee used in the method of manufacturing a through-hole printed wiring board of the present invention, and Figure 3 is a cross-sectional view of the manufacturing method of the present invention. FIG. 4 is a cross-sectional view of a double-sided conductive through hole according to the present invention, and FIG. 5 is a cross-sectional view showing the mounting angle of a squeegee and the printing angle during printing. 1...Printed board, 2...Screen plate, 3...
Squeegee, 4... Conductive paint, 5... Conductive holes on both sides, 6... Lower plate for printing, 7... Squeegee tip angle, 8... Squeegee flip-up, 9... Mounting angle, 10... Printing angle , 11...Copper foil land.
Claims (1)
させた前記孔より0.1mm以上大きな直径の孔を有
する厚さ３mm以上の平板よりなる印刷用下板を印
刷基板の下面に配置し、印刷基板の両面導通をす
べき孔上にその孔径より大きなランド径を設けた
スクリーン版を適当な間隔をあけ配置し、そのス
クリーン版上に導電ペイントをのせ、先端角度を
３〜40゜に加工したスキージを用いて印刷するこ
とにより前記印刷基板の孔内に導電ペイントを充
填し、プリント配線板の両面を導通させることを
特徴とするスルホールプリント配線板の製造方
法。1. Place a lower printing plate made of a flat plate with a thickness of 3 mm or more and having a hole with a diameter 0.1 mm or more larger than the hole whose center line coincides with the hole in which the conductive paint is printed on the lower surface of the printing board, and A screen plate with a land diameter larger than the hole diameter is placed over the hole where double-sided conduction is to be made at an appropriate interval, conductive paint is placed on the screen plate, and a squeegee with a tip angle of 3 to 40 degrees is used. 1. A method for manufacturing a through-hole printed wiring board, characterized in that conductive paint is filled into the holes of the printed wiring board by printing using a conductive paint, thereby making both sides of the printed wiring board electrically conductive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16980480A JPS5792892A (en) | 1980-12-02 | 1980-12-02 | Method of producing through hole printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16980480A JPS5792892A (en) | 1980-12-02 | 1980-12-02 | Method of producing through hole printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5792892A JPS5792892A (en) | 1982-06-09 |
| JPH0143478B2 true JPH0143478B2 (en) | 1989-09-20 |
Family
ID=15893196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16980480A Granted JPS5792892A (en) | 1980-12-02 | 1980-12-02 | Method of producing through hole printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5792892A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01248592A (en) * | 1988-03-30 | 1989-10-04 | Hitachi Ltd | Method of filling through-hole with conductor paste |
| JP2008034442A (en) * | 2006-07-26 | 2008-02-14 | Fujikura Ltd | Method of inserting conductive ball in printed circuit board, and device therefor |
-
1980
- 1980-12-02 JP JP16980480A patent/JPS5792892A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5792892A (en) | 1982-06-09 |
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