JPH03159297A - Multilayer printed wiring board and manufacture thereof - Google Patents
Multilayer printed wiring board and manufacture thereofInfo
- Publication number
- JPH03159297A JPH03159297A JP29914489A JP29914489A JPH03159297A JP H03159297 A JPH03159297 A JP H03159297A JP 29914489 A JP29914489 A JP 29914489A JP 29914489 A JP29914489 A JP 29914489A JP H03159297 A JPH03159297 A JP H03159297A
- Authority
- JP
- Japan
- Prior art keywords
- blind
- hole
- wiring board
- holes
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 12
- 238000005553 drilling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子部品の高密度化に対応させた高密度多層
印刷配線基板、特に表裏両面よりブラインドスルーホー
ルを形成した多層印刷配線基板及びその製造方法に関す
るものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a high-density multilayer printed wiring board that is compatible with the increasing density of electronic components, particularly a multilayer printed wiring board in which blind through holes are formed from both the front and back sides. The present invention relates to a manufacturing method thereof.
［従来の技術］
近年、配線基板への電子部品の実装密度が高まるにつれ
、配線基板に印刷される配線パターンの多層化が進んで
いる。[Prior Art] In recent years, as the mounting density of electronic components on wiring boards has increased, wiring patterns printed on wiring boards have become more multilayered.
表面の配線パターンと基板内部の配線パターン或は裏面
の配線パターンとの電気的接続を行う手段としてスルー
ホールが用いられている。Through holes are used as means for electrically connecting the wiring pattern on the front surface and the wiring pattern inside the board or the wiring pattern on the back surface.
更に、配線パターンが多層化すると配線基板を貫通しな
いスルーホール即ちブラインドスルーホールが設けられ
る。Furthermore, when the wiring pattern becomes multilayered, through holes that do not penetrate the wiring board, ie, blind through holes, are provided.
ブラインドスルーホールが設けられる従来の多層印刷配
線基板及びその製造方法を爾３図（Ａ）〜（Ｄ）に於い
て説明する。A conventional multilayer printed wiring board provided with blind through holes and a method for manufacturing the same will be explained with reference to FIGS. 3(A) to 3(D).
従来の多層印刷配線基板は、内部に内層パターンが形成
された多層印刷配線素板１の（第３図（Ａ））、表裏か
らドリルによりブラインドスルーホール用下穴３，３を
穿設する（第３図（Ｂ））、次に、スルーホールメツキ
４゜４を施し、表面の銅箔層５と内層パターン６とを電
気的に接続し、裏面の銅箔層７と内層のパターン８とを
電気的にそれぞれ接続する。A conventional multilayer printed wiring board is manufactured by drilling pilot holes 3, 3 for blind through holes from the front and back sides of a multilayer printed wiring board 1 (FIG. 3(A)), which has an internal layer pattern formed therein (FIG. 3(A)). FIG. 3(B)), Next, through-hole plating 4°4 is applied to electrically connect the copper foil layer 5 on the front side and the inner layer pattern 6, and the copper foil layer 7 on the back side and the inner layer pattern 8. Connect each electrically.
最後に不要な部分をエツチング除去してブラインドスル
ーホール９を有する多層印刷配線基板が製造される。Finally, unnecessary portions are removed by etching to produce a multilayer printed wiring board having blind through holes 9.
［発明が解決しようとする課題］
然し乍ら、上記従来の製造方法による多層印刷配線基板
では以下に述べる様な問題がある。[Problems to be Solved by the Invention] However, the multilayer printed wiring board manufactured by the above conventional manufacturing method has the following problems.
■ ブラインドスルーホールの穴明作業に於いて、ドリ
ル長さ寸法のバラツキや、配線素板の厚みのバラツキか
ら各配線基板毎に一定にできず、その都度ブラインドス
ルーホールの穴の深を調整する必要があると共に、内層
のパターンとの接続が不完全となる可能性があった。■ When drilling blind through holes, the depth of the blind through holes cannot be made uniformly for each wiring board due to variations in the length of the drill and variations in the thickness of the wiring board, so the depth of the blind through holes must be adjusted each time. In addition to this, there was a possibility that the connection with the inner layer pattern would be incomplete.
■ 穴明時、配線基板の表面、裏面の両面から、それぞ
れ穴明けを行う為、穴明方向を間違えるという誤作業が
生じ易く、少滴り低下を紹いていた。■ When drilling holes, since the holes are drilled from both the front and back sides of the wiring board, it is easy to make errors such as drilling in the wrong direction, resulting in slight dripping.
■ ブラインドホールは、必要とされる完全穴部の深さ
に更にドリルの先端部（リップ部）が加わったものとな
るので、リップ部が食込む領域ではブラインドスルーホ
ールの最深部と該ブラインドスルーホールが接続してい
ない内層パターン間の絶縁間隔が狭くなり、内層パター
ンを自在に配線することができない。■ A blind hole is made by adding the drill tip (lip part) to the required depth of the complete hole, so in the area where the lip part bites, there is a gap between the deepest part of the blind through hole and the blind through hole. The insulation interval between inner layer patterns to which holes are not connected becomes narrower, and the inner layer patterns cannot be freely wired.
■ スルーホールメツキ工程でブラインドスルーホール
最深部でのメッキ厚が薄くなる為、メッキ厚を全体的に
厚くしなければならず、不経済であると共にメツキ処理
時間が長くなる。■ In the through-hole plating process, the plating thickness at the deepest part of the blind through-hole becomes thinner, so the overall plating thickness must be increased, which is uneconomical and increases the plating time.
■ ブラインドスルーホール内は表面処理液の流通が充
分に行われず、又ブラインドスルーホール内に表面処理
液が残ってしまい、腐蝕の原因となる。- The surface treatment liquid does not flow sufficiently through the blind through hole, and the surface treatment liquid remains inside the blind through hole, causing corrosion.
■ ブラインドスルーホールの形成後穴内壁面に保護被
膜を塗布しなければ、銅メツキ処理されている表面が酸
化してしまう。■ If a protective film is not applied to the inner wall surface of the hole after forming the blind through hole, the copper-plated surface will oxidize.
［課題を解決するための手段］
本発明は、上記実情を鑑みてなしたものであり、内部に
内層パターンが形成された配線素板に予めスルーホール
を形成し、該配線素板を２枚、接着剤により接着したこ
とを特徴とするものである。[Means for Solving the Problems] The present invention has been made in view of the above-mentioned circumstances.Through holes are formed in advance in a wiring board in which an inner layer pattern is formed, and two wiring boards are combined. , is characterized in that it is bonded with an adhesive.
［作 用］
予めスルーホールを形成した２枚の配線素板を接着剤で
貼合せ、貼合せによりブラインドスルーホールを形成す
るのでブラインドスルーホールの品質は大幅に改善され
、更に貼合せ面にも自在にパターンが形成できる。[Function] Two wiring boards with through-holes formed in advance are pasted together with adhesive, and a blind through-hole is formed by the pasting, so the quality of the blind through-hole is greatly improved, and the quality of the blind through-hole is also improved. Patterns can be formed freely.
［実 施 例］ 以下、図面を参照しつつ本発明の一実施例を説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.
本発明に係る多層印刷配線基板は、第１図に示す如く、
予めスルーホール１１．１１を形成した配線素板１２ａ
、 １２ｂを接着剤１３により、接着してブラインドス
ルーホールを形成し、更にブラインドスルーホール内部
をエポキシ樹脂（前記接着剤）等の樹脂で充填した後ブ
ラインドスルーホールを電導体ランド１４．１４で被覆
したものである。The multilayer printed wiring board according to the present invention, as shown in FIG.
Wiring blank board 12a with through holes 11.11 formed in advance
, 12b are bonded with adhesive 13 to form a blind through hole, and after filling the inside of the blind through hole with a resin such as epoxy resin (the adhesive described above), the blind through hole is covered with a conductor land 14.14. This is what I did.
次に、第２図（Ａ）〜（Ｈ）に於いて製造工程を順を追
って説明する。Next, the manufacturing process will be explained step by step with reference to FIGS. 2(A) to 2(H).
尚、図中第３図（Ａ）〜（Ｄ）中で示したものと同一の
ものには同符号を付しである。Components in the figure that are the same as those shown in FIGS. 3(A) to 3(D) are designated by the same reference numerals.
表裏に銅箔層１５ａ、 １５ｂが形成されると共に予め
内層パターン６を形成した配線素板１２（第２図（Ａ）
参照）に貫通孔１６を穿設する（第２図（Ｂ））。A wiring board 12 (FIG. 2(A)
(see FIG. 2(B)).
次に、配線素板１２にスルーホールメツキ層１７を付着
させて、スルーホール１１を形成しく第２図（Ｃ））、
２板の配線素板１２ａ、 １２ｂを貼合せた時、互に内
層側となる表面にパターン１８を形成する（第２図（Ｄ
））。Next, a through-hole plating layer 17 is attached to the wiring board 12 to form through-holes 11 (FIG. 2(C)).
When the two wiring boards 12a and 12b are pasted together, a pattern 18 is formed on the inner layer side of each other (see Fig. 2(D)).
)).
内層側の表面にパターン１８の成形が完了した配線素板
１２ａ、 １２ｂの間に接着剤（エポキシ樹脂）１３を
挟み、加熱加圧して接着させる（第２図（Ｅ）（Ｆ）＞
。An adhesive (epoxy resin) 13 is sandwiched between the wiring boards 12a and 12b on which the pattern 18 has been formed on the inner layer surface, and the wiring boards are bonded together by heating and pressing (Fig. 2 (E) and (F)).
.
この接着の過程で、溶融した接着剤がスルーホール１１
の内部に流込み、スルーホール１１を完全に充填する。During this bonding process, the molten adhesive is applied to the through hole 11.
and completely fills the through hole 11.
又、該スルーボール１１はもう１枚の配線素板で閉塞さ
れるので、２枚の配線素板１２ａ、 １２ｂで構成され
る多層印刷配線基板１９に対しては、ブラインドスルー
ホールとなる。Further, since the through ball 11 is closed by another wiring board, it becomes a blind through hole for the multilayer printed wiring board 19 composed of the two wiring boards 12a and 12b.
次に、前記多層印刷配線基板１９の表裏面に無電解銅、
電解銅のメツキを施し、表裏全面に亘ってメツキ層２０
を付着させる（第２図（Ｇ））。Next, electroless copper is applied to the front and back surfaces of the multilayer printed wiring board 19.
Electrolytic copper plating is applied, and a plating layer 20 is applied over the entire front and back surfaces.
(Fig. 2 (G)).
最後に多層印刷配線基板１９の表裏にエツチング処理に
よりパターン成形を行う（第２図（Ｈ））。Finally, patterns are formed on the front and back surfaces of the multilayer printed wiring board 19 by etching (FIG. 2(H)).
尚、このパターン成形時にエツチング液によるブライン
ドスルーホールの銅メツキ層の破壊を防ぐ為、ブライン
ドスルーホール及びその周囲を覆う電導体ランド１４を
残しておく、又、該導体ラントド１４は実際に多層印刷
配線基板１９が使用される際のブラインドスルーホール
の保護にもなる。In addition, in order to prevent the copper plating layer of the blind through hole from being destroyed by the etching solution during pattern formation, a conductor land 14 covering the blind through hole and its surroundings is left, and the conductor land 14 is actually multilayer printed. This also serves to protect the blind through holes when the wiring board 19 is used.
［発明の効果］
以上述べた如く本発明によれば、下記の優れた効果を発
揮する。[Effects of the Invention] As described above, according to the present invention, the following excellent effects are exhibited.
■ ブラインドスルーホールはドリルの長さ寸法、配線
素板の厚みのバラツキと無関係に形成することができる
為、配線素板内部の内層パターンとの接続が完全に行え
る。■ Since blind through holes can be formed regardless of variations in the length of the drill or the thickness of the wiring board, it can be perfectly connected to the inner layer pattern inside the wiring board.
■ スルーホール用孔を穿設する際、一方向からの作業
でよく、孔明作業で間違いが生じない。■ When drilling holes for through-holes, you only need to work from one direction, so there are no mistakes in drilling.
■ ブラインドスルーホールにはリップ部がない為、配
線素板の内層面側のパターンを自在に形成でき、配線の
自由度が増す。■ Since blind through holes do not have a lip, patterns on the inner layer side of the wiring board can be formed freely, increasing the degree of freedom in wiring.
■ スルーホールのメツキは貫通孔の状態で行われる為
、孔の最深部に於いてもメッキ厚が薄くなることがなく
、スルーホールの品質が向上すると共に全体のメッキ厚
を薄くできて経済的である。■ Since through-hole plating is done in the state of the through-hole, the plating thickness does not become thinner even at the deepest part of the hole, improving the quality of the through-hole and making it possible to reduce the overall plating thickness, which is economical. It is.
■ ブラインドスルーホール内部が樹脂で充填される為
、該ブラインドスルーホール内部にエツチング処理液か
残ることがなく、スルーホールの腐蝕が防止される。(2) Since the inside of the blind through hole is filled with resin, no etching solution remains inside the blind through hole, and corrosion of the through hole is prevented.
第１図は本発明に係る多層印刷配線基板の断面図、第２
図（Ａ）〜（Ｈ）は本発明に係る製造工程を示す説明図
、第３図（Ａ）〜（Ｄ）は従来の製造工程を示す説明図
である。
１１はスルーホール、１２．１２ａ、 １２ｂは配線素
板、１３は接着剤、１９は多層印刷配線基板を示す。FIG. 1 is a sectional view of a multilayer printed wiring board according to the present invention, and FIG.
FIGS. 3A to 3H are explanatory views showing the manufacturing process according to the present invention, and FIGS. 3A to 3D are explanatory views showing the conventional manufacturing process. 11 is a through hole, 12, 12a and 12b are wiring boards, 13 is an adhesive, and 19 is a multilayer printed wiring board.
Claims (1)
ルーホールを形成し、該配線素板を２枚、接着剤により
接着したことを特徴とする多層印刷配線基板。 ２）内部に内層パターンが形成された配線素板にスルー
ホールを形成し、該配線素板の接着面側にパターンを形
成し、２板の配線素板を該パターン面で接着剤を挟んで
接着させ、接着後表裏両面にパターンを形成する多層印
刷基板の製造方法。[Scope of Claims] 1) A multilayer printed wiring board, characterized in that through-holes are formed in advance in a wiring board having an inner layer pattern formed therein, and two of the wiring boards are bonded together with an adhesive. 2) A through hole is formed in a wiring board with an inner layer pattern formed inside, a pattern is formed on the adhesive side of the wiring board, and the two wiring boards are sandwiched between the patterned surfaces with an adhesive. A method for manufacturing a multilayer printed circuit board, which involves bonding and forming patterns on both the front and back sides after bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29914489A JPH03159297A (en) | 1989-11-17 | 1989-11-17 | Multilayer printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29914489A JPH03159297A (en) | 1989-11-17 | 1989-11-17 | Multilayer printed wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03159297A true JPH03159297A (en) | 1991-07-09 |
Family
ID=17868696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29914489A Pending JPH03159297A (en) | 1989-11-17 | 1989-11-17 | Multilayer printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03159297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| JPH06350253A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Production of multilayer printed wiring board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124768A (en) * | 1977-04-06 | 1978-10-31 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS6324696A (en) * | 1986-07-17 | 1988-02-02 | 日本電気株式会社 | High multilayer interconnection board |
| JPS63137499A (en) * | 1986-11-29 | 1988-06-09 | 日本電気株式会社 | Manufacture of multilayer printed interconnection board |
| JPH01143295A (en) * | 1987-11-28 | 1989-06-05 | Toshiba Corp | Manufacture of multilayer printed wiring board |
-
1989
- 1989-11-17 JP JP29914489A patent/JPH03159297A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124768A (en) * | 1977-04-06 | 1978-10-31 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS6324696A (en) * | 1986-07-17 | 1988-02-02 | 日本電気株式会社 | High multilayer interconnection board |
| JPS63137499A (en) * | 1986-11-29 | 1988-06-09 | 日本電気株式会社 | Manufacture of multilayer printed interconnection board |
| JPH01143295A (en) * | 1987-11-28 | 1989-06-05 | Toshiba Corp | Manufacture of multilayer printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| JPH06350253A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Production of multilayer printed wiring board |
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