JPS59175191A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS59175191A JPS59175191A JP4920183A JP4920183A JPS59175191A JP S59175191 A JPS59175191 A JP S59175191A JP 4920183 A JP4920183 A JP 4920183A JP 4920183 A JP4920183 A JP 4920183A JP S59175191 A JPS59175191 A JP S59175191A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- insulating substrate
- holes
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（技術分野）
本発明は予め導通部を設けたプリント配線基板に関する
。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a printed wiring board in which a conductive portion is provided in advance.
（従来技術）
紙−フェノール、ガラスエポキシ、ポリエステル、ポリ
イミドなどの絶縁基板に銅箔等の金属箔を片面若しくは
両面に貼り合わせ、更に両面の導通を図るために貫通孔
を設げ１貫通孔内に導電物質な充填できるようにしたプ
リント配線基板は知られている。このプリント配線基板
は回路形成の前後にＮＣ穴あげ機などによりスルーホー
ル加工を行なった後にメッキ処理を施すことにより、表
裏の導通馨行なう。(Prior art) Metal foil such as copper foil is pasted on one or both sides of an insulating substrate made of paper - phenol, glass epoxy, polyester, polyimide, etc., and through-holes are provided to ensure conduction on both sides. Printed wiring boards that can be filled with conductive material are known. Before and after circuit formation, this printed wiring board is formed with through-holes using an NC drilling machine, etc., and then plated to provide electrical conductivity between the front and back sides.
しかし、メッキ処理による導通処理では導゛通部の信頼
性を光分高くすることは困難である上、必要箇所にスル
ーホール加工な行なう煩雑さが避けられない。However, it is difficult to increase the reliability of the conductive portion by an optical amount when conductive treatment is performed by plating, and the complexity of forming through-holes at necessary locations is unavoidable.
本発明は上記従来の欠点を解消するものであって、本発
明のプリント配線基板は絶縁基板に微細な貫通孔が形成
され、前記貫通孔は導電性物質が充填され、かつ、絶縁
基板の表裏のうち少なくとも片面には金属箔が積層され
ていることな特徴とするものである。The present invention solves the above-mentioned conventional drawbacks, and the printed wiring board of the present invention has fine through holes formed in an insulating substrate, the through holes are filled with a conductive substance, and It is characterized in that metal foil is laminated on at least one side.
第１図は本発明のプリント配線基板の一実施例を示す断
面図であり、絶縁基板ｌには貫通孔コが形成され、貫通
孔コには導電性物質３が充填されており、絶縁基板二の
表裏の両面には金属箔ダ及び４ｔ／が積層されている。FIG. 1 is a sectional view showing an embodiment of the printed wiring board of the present invention, in which a through hole is formed in an insulating substrate l, the through hole is filled with a conductive substance 3, and the insulating substrate l is filled with a conductive substance 3. Metal foils and 4t/ are laminated on both the front and back sides of the second piece.
第２図は本発明の他の実施例な示す断面図であり、第１
図に示したものとは異なり、金属箔は一方の面にのみ積
層されている。FIG. 2 is a sectional view showing another embodiment of the present invention;
Unlike what is shown in the figure, the metal foil is laminated on only one side.
上記において、絶縁基板としては、従来と同様、紙−フ
ェノール、ガラスエポキシ、ポリエステル、ポリイミド
等からなるものが使用できろ。貫通孔は微細なものでよ
く、直径は０３〜１０咽程匠であり、又、通常、３〜１
０ｍＭ＋のピッチで絶縁基板の全面に形成する。In the above, the insulating substrate may be made of paper-phenol, glass epoxy, polyester, polyimide, etc., as in the past. The through hole may be minute, with a diameter of 0.3 to 10 mm, and usually 3 to 1 mm in diameter.
It is formed on the entire surface of the insulating substrate at a pitch of 0mM+.
貫通孔に充填する導電性物質としては、例えばアルミニ
ウムや銅の導電性金属を合成樹脂バインダー中に分散し
たものである。The conductive material to be filled in the through holes is, for example, a conductive metal such as aluminum or copper dispersed in a synthetic resin binder.
金属箔としては導電性がよく、化学的に安定なものが好
ましく、通常は、剣司箔乞使用する。The metal foil preferably has good conductivity and is chemically stable, and Kenji foil is usually used.
上記のようなプリント配線基板を製造する方法の一例を
次に示す。An example of a method for manufacturing the above-mentioned printed wiring board will be described below.
まず第３図に示すように絶縁基板ｌに導通用の微細な貫
通孔コを形成する。貫通孔コの形成は、Ｖ−ブー光の照
射、電子線の照射、パンチング、ＮＣ穴あけ機の利用に
より行なえる。First, as shown in FIG. 3, fine through holes for conduction are formed in an insulating substrate l. The through holes can be formed by irradiation with V-boo light, irradiation with electron beams, punching, or using an NC drilling machine.
一方、金属箔グの片面に前記の絶縁基板に形成した貫通
孔と同ピツチで導電性パターン！ｒＹ形成する。導電性
パターンｊの形成は導電性の中に、導電性金＠を分散さ
せて得られる導電性塗料ないしインキ乞用いて適宜７１
パターン形成法、例えばシルクスクリーン印刷による
印刷法によって行なう。この他、凹版印刷、グラビヤ印
刷も利用しつる。導電性パターンの厚みは、第１図示の
プリント配線基板を製造する場合で、一方〇金鴎箔のみ
に形成する際は絶縁基板の厚みと同等若しくはそれ以上
であり、両方の金属箔ダ及びｑ′に形成する際には絶縁
基板の厚みの硲程度である。第２図示のプリント配線基
板を製造する際には絶縁基板の厚みと同等若しくはそれ
以上の厚みの導電性パターン乞形成する。On the other hand, a conductive pattern is formed on one side of the metal foil at the same pitch as the through holes formed in the insulating substrate. form rY. The conductive pattern j is formed by appropriately using a conductive paint or ink obtained by dispersing conductive gold in conductive material.
This is carried out by a pattern forming method, for example, a printing method using silk screen printing. In addition, intaglio printing and gravure printing are also used. The thickness of the conductive pattern is equal to or greater than the thickness of the insulating substrate when the printed wiring board shown in Figure 1 is manufactured, whereas when it is formed only on the gold foil, the thickness of the conductive pattern is equal to or greater than the thickness of the insulating substrate. 1, the thickness is about the same as that of the insulating substrate. When manufacturing the printed wiring board shown in the second figure, a conductive pattern is formed to have a thickness equal to or greater than the thickness of the insulating board.
更に、以上のようにして貫通孔を形成した絶縁基板の一
方、若しくは両方に、導電性パターン乞形成した金属箔
な、絶縁基板と導電性パターンが向かい合うように、か
つ、絶縁基板に形成された貫通孔と導電性パターンとが
一致するように位置決めを行なって重ね、全体を加熱加
圧して積層を行なう。Furthermore, a conductive pattern is formed on one or both of the insulating substrates in which the through holes are formed as described above, such as a metal foil formed on the insulating substrate so that the insulating substrate and the conductive pattern face each other. The through holes and the conductive patterns are positioned so that they match, and the conductive patterns are overlapped, and the entire structure is heated and pressurized to perform lamination.
なお、重ね合わせに先立って、接着面のいずれか一方、
若しくは両方に、脱脂等の前処理、プライマー処理、接
着剤塗布ヲ行なってもよい。In addition, before overlapping, either one of the adhesive surfaces,
Alternatively, pretreatment such as degreasing, primer treatment, and adhesive coating may be performed on both.
上記の製造法においては、導電性物質乞予め金属箔上に
パターン状に形成したが、導電性物質は絶縁基板の貫通
孔内に予め充填してあってもよ（、充填は、第７図に示
すようにスキージ−６等を用いて導電性塗料りな押し込
む方法や貫通孔の曲刃からの吸引等によってもよい。第
２図に示すプリント配線基板を製造する際には貫通孔を
形成した絶縁基板と金用箔とを積層してから導電性物質
を充填することも可能である。In the above manufacturing method, the conductive material is formed in a pattern on the metal foil in advance, but the conductive material may be filled in the through holes of the insulating substrate in advance (the filling is shown in Fig. 7). As shown in Figure 2, the conductive paint may be pushed in using a squeegee 6 or the like, or by suction from the curved blade of the through hole.In manufacturing the printed wiring board shown in Figure 2, the through hole was formed. It is also possible to fill the conductive material after laminating the insulating substrate and the gold foil.
本発明のプリント配線基板は不要の導通部をくり抜（か
、或いは不要の導通部上の金属箔な切削等により貫通孔
よりは太き目に除去して使用すればよい。The printed wiring board of the present invention may be used by cutting out unnecessary conductive parts (or cutting metal foil on the unnecessary conductive parts, etc.) to make the parts thicker than the through-holes.
（効 果）
以上の構成ＹＷする本発明のプリント配線基板は、貫通
孔部分の電気的な導通の信頼性が高く、又、導通の不要
な箇所は簡単な操作で導通部の貫通孔全体乞くり抜くか
、表面を除去することにより導通ヲナ（すことができる
。(Effects) The printed wiring board of the present invention having the above-described configuration has high reliability of electrical continuity in the through-hole portion, and the entire through-hole in the conductive portion can be removed by a simple operation in areas where conduction is not required. Continuity can be achieved by hollowing out or removing the surface.
第１図及び第２図はいずれも本発明のプリント配線基板
の実施例を示す断面図、第３図は本発明のプリント配線
基板を製造する方法の一例を示す説明図、第ダ図は導電
性塗料を絶縁基板の貫通孔に充填する方法？示す説明図
である。
ｌ・・・・０・絶縁基板
ユ・・・０・・貫通孔
３ ・・・・・・・導電性物質
ダ・・・・・・・金属箔1 and 2 are both cross-sectional views showing embodiments of the printed wiring board of the present invention, FIG. 3 is an explanatory view showing an example of the method for manufacturing the printed wiring board of the present invention, and Fig. 3 is a conductive diagram. How to fill the through-holes of an insulating board with adhesive paint? FIG. l...0 Insulating substrate Yu...0 Through hole 3... Conductive material... Metal foil
Claims (1)
電性物質が充填され、かつ、絶縁基板の表裏のうち少な
（とも片面には金属箔が積層されていることを特徴とす
るプリント配線基板。A print characterized in that minute through-holes are formed in an insulating substrate, the through-holes are filled with a conductive substance, and a metal foil is laminated on one side of the front and back of the insulating substrate. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4920183A JPS59175191A (en) | 1983-03-24 | 1983-03-24 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4920183A JPS59175191A (en) | 1983-03-24 | 1983-03-24 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59175191A true JPS59175191A (en) | 1984-10-03 |
Family
ID=12824376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4920183A Pending JPS59175191A (en) | 1983-03-24 | 1983-03-24 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59175191A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268345A (en) * | 1992-05-06 | 1994-09-22 | Matsushita Electric Ind Co Ltd | Circuit forming board and production thereof |
| JPH07170046A (en) * | 1993-09-22 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Printed-wiring board and manufacture thereof |
| US5440075A (en) * | 1992-09-22 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Two-sided printed circuit board a multi-layered printed circuit board |
| JP2009088474A (en) * | 2007-09-28 | 2009-04-23 | Samsung Electro-Mechanics Co Ltd | Inter layer conduction method for printed circuit board |
-
1983
- 1983-03-24 JP JP4920183A patent/JPS59175191A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268345A (en) * | 1992-05-06 | 1994-09-22 | Matsushita Electric Ind Co Ltd | Circuit forming board and production thereof |
| US5440075A (en) * | 1992-09-22 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Two-sided printed circuit board a multi-layered printed circuit board |
| JPH07170046A (en) * | 1993-09-22 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Printed-wiring board and manufacture thereof |
| JP2009088474A (en) * | 2007-09-28 | 2009-04-23 | Samsung Electro-Mechanics Co Ltd | Inter layer conduction method for printed circuit board |
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