JPH0135517B2 - - Google Patents
Info
- Publication number
- JPH0135517B2 JPH0135517B2 JP6933179A JP6933179A JPH0135517B2 JP H0135517 B2 JPH0135517 B2 JP H0135517B2 JP 6933179 A JP6933179 A JP 6933179A JP 6933179 A JP6933179 A JP 6933179A JP H0135517 B2 JPH0135517 B2 JP H0135517B2
- Authority
- JP
- Japan
- Prior art keywords
- printing
- paint
- hole
- printed
- printing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はマスクを用いて板又はフイルムよりな
る被印刷物の穿孔部の内壁および周囲にペイント
を印刷するに当つて一方向からのみの一回のスキ
ージー作業によつて能率的に行なうためのスルホ
ール印刷法に関し、被印刷物の孔部に対応する部
分に前記孔の直径よりも大きい径の孔をあけた印
刷台を下敷とし、印刷マスクの配置面と反対面へ
インクの匍状（クリープ）前進を妨げないように
することを目的とするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention improves efficiency by using a mask to print paint on the inner wall and surrounding area of a perforated portion of a substrate made of a plate or film by performing a single squeegee operation from one direction only. Regarding the through-hole printing method, a printing table with holes larger than the diameter of the holes in the portions corresponding to the holes of the printing material is used as an underlay, and ink is applied to the surface opposite to the surface on which the printing mask is placed. The purpose of this is to ensure that creep progress is not obstructed.
従来の印刷機においては被印刷物の下面支持は
真空吸着用の孔は例外として、平たんな面である
のが普通である。しかしながら、板状被印刷物の
孔を通して印刷ペイントが浸入し、裏面すなわち
印刷スキージーの移動する面と反対側において拡
がり匍状（クリープ）するような印刷法において
は、このクリープすなわち被印刷物の裏面におけ
る印刷パターンの形成を阻止妨害したり、印刷面
のペイントが被印刷物の下面支持台に付着したり
してはなはだ不都合である。 In conventional printing machines, the lower surface of the substrate to be printed is usually a flat surface, with the exception of holes for vacuum suction. However, in a printing method in which the printing paint infiltrates through the holes in the plate-like substrate and spreads and creeps on the back side, that is, the side opposite to the surface on which the printing squeegee moves, this creep, that is, the printing on the back side of the printing substrate. This is particularly disadvantageous because it prevents pattern formation and causes paint on the printing surface to adhere to the lower support of the substrate.
本発明は下面支持台へのペイントの附着、被印
刷物裏面へのクリープ印刷の阻止妨害を防ぎ、併
せて余剰のペイントを被印刷物や下面支持台に附
着させないようにするために被印刷物の支持台と
被印刷物との間に底のある孔の加工をした印刷台
を形成し、１回の印刷ごとに印刷台をも更新され
るようにするのである。この底のある孔の加工し
た印刷台は、上記効果によつて、すなわち、スキ
ージー作業により、透孔を通して、裏面よりはみ
だしたインキは、最初円くふくらみ透孔の裏から
ぶらさがつた状態になり、その後、インキのチク
ソ性と、浸潤性によつて、透孔の渕に広がり第２
図に示す様な型（サカサ富士）でスルホール印刷
が完成されるものである。その為印刷インキが透
孔の裏面で以上の様に形状変態を行なう空間が必
要である。これが本発明の凹溝を有する印刷台で
ある。 The present invention is designed to prevent paint from adhering to the lower support, prevent creep printing from occurring on the back side of the printing material, and to prevent excess paint from adhering to the printing material or the lower support. A printing table with a hole at the bottom is formed between the printing plate and the printing material, and the printing table is updated every time printing is performed. This printing table with a hole at the bottom has the effect described above, that is, due to the squeegee operation, the ink that protrudes from the back side through the hole will initially swell into a circular shape and hang from the back of the hole. Then, due to the thixotropic and invasive properties of the ink, it spreads to the edge of the hole and forms a second layer.
Through-hole printing is completed with the mold shown in the figure (Sakasa Fuji). Therefore, a space is required in which the printing ink undergoes the shape transformation as described above on the back side of the through-hole. This is the printing table with grooves of the present invention.
以下、具体例に挙げて説明する。 A specific example will be described below.
まず、第１図に示すように厚さ0.2mmのステン
レススチール板に深さ0.1mm、段巾0.5mm、底部直
径1.0mm（従つて頂部直径は2.0mm）の段付き孔１
１をフオトエツチング法で加工してマスク１とす
る。つぎに、両面に銅箔を被着したのち選択的に
エツチングして導体パターン９，１０を形成した
厚さ0.8mmの紙基材フエノール樹脂積層板を用意
する。これが被印刷物４であり、穿孔部５の孔径
は01mm、表面の銅箔ランド９の径は2.5mm、裏面
の銅箔ランド１０の径も2.5mmである。つぎに厚
さ2.4mmの紙基材フエノール樹脂積層板に前記被
印刷物４の孔５に中心線を合せて直径3.0mm、深
さ1.2mmの孔７を配置し、印刷台６とする。そし
て、導電ペイント３として銀粉−樹脂系のデユポ
ン社5504を用い、100センチポイスの粘度でスキ
ージー２の前面、マスク１の上に置き毎秒10cmの
速度で水平角40゜のスキージー２を１回移動させ
る。このようにすると、第２図に示すように被印
刷物４の上面の孔周囲には直径2.0mmの銀ペイン
トランドが表面の孔周囲に形成され、直径1.6mm
の銀ペイントランドが裏面の孔周囲に形成され
た。この時ペイントの裏面クリープが印刷台６の
存在によつて妨害されず、また孔部直下の余剰銀
ペイントは印刷台６の孔７に滴下し、他に付着し
たり拡がることがなく、安定した印刷法を確立す
ることができた。この被印刷物４は150℃の炉で
30分間処理され、第３図に示すようにペイントを
固着させた。 First, as shown in Figure 1, a stepped hole 1 with a depth of 0.1 mm, a step width of 0.5 mm, and a bottom diameter of 1.0 mm (therefore, the top diameter is 2.0 mm) is made in a stainless steel plate with a thickness of 0.2 mm.
Mask 1 is obtained by processing the mask 1 using a photo-etching method. Next, a paper-based phenolic resin laminate with a thickness of 0.8 mm is prepared, with copper foil coated on both sides and then selectively etched to form conductive patterns 9 and 10. This is the printing material 4, and the hole diameter of the perforated portion 5 is 01 mm, the diameter of the copper foil land 9 on the front surface is 2.5 mm, and the diameter of the copper foil land 10 on the back surface is also 2.5 mm. Next, a hole 7 having a diameter of 3.0 mm and a depth of 1.2 mm is placed in a paper-based phenolic resin laminate having a thickness of 2.4 mm, with its center line aligned with the hole 5 of the printing substrate 4, thereby forming a printing table 6. Then, silver powder-resin based DuPont 5504 was used as the conductive paint 3, and with a viscosity of 100 centipoise, it was placed on the front of the squeegee 2 and on the mask 1, and the squeegee 2 was moved once at a horizontal angle of 40 degrees at a speed of 10 cm per second. . In this way, as shown in FIG. 2, a silver paint land with a diameter of 2.0 mm is formed around the hole on the upper surface of the printing substrate 4, and a silver paint land with a diameter of 1.6 mm is formed around the hole on the surface.
A silver painted land was formed around the hole on the back side. At this time, the creep of the back side of the paint is not hindered by the presence of the printing table 6, and the excess silver paint directly under the hole drips into the hole 7 of the printing table 6, and does not adhere to or spread elsewhere, making it stable. We were able to establish a printing method. This printing material 4 was heated in a furnace at 150℃.
The paint was treated for 30 minutes to set the paint as shown in FIG.
本発明に用いるマスクとしては他に鉄、アルミ
ニウム、銅などの金属板又はフイルムのエツチン
グ加工、印刷加工木材、プラスチツク材の切削加
工、プラスチツクフイルムの貼合せ加工により段
付のものが使用出来る。 In addition, the mask used in the present invention can be a stepped mask made by etching a metal plate or film such as iron, aluminum or copper, cutting a printed wood or plastic material, or laminating a plastic film.
印刷するペイントとして導電性ペイントを用い
れば、表面の配線と裏面の配線との電気的接続を
計ることができる。またスルホールめつき形成物
については、樹脂ペイントを印刷して、耐エツチ
ングレジストとしたり、スルホール構造の機械的
補強を計ることができる。 If conductive paint is used as the printing paint, it is possible to make electrical connections between the wiring on the front surface and the wiring on the back surface. In addition, for the through-hole plating formed product, resin paint can be printed to make it an etching-resistant resist or to mechanically reinforce the through-hole structure.
図面は本発明のスルホール印刷法を示し、第１
図はその印刷前の準備過程の説明図、第２図はそ
の印刷過程の説明図、第３図はその印刷後の硬化
過程の説明図である。
１……マスク、２……スキージー、３……ペイ
ント、４……被印刷物、５……穿孔部、６……印
刷台、７……凹溝、９，１０……ランド、１１…
…段付き孔。
The drawings show the through-hole printing method of the present invention, and the first
FIG. 2 is an explanatory diagram of the preparation process before printing, FIG. 2 is an explanatory diagram of the printing process, and FIG. 3 is an explanatory diagram of the curing process after printing. 1... Mask, 2... Squeegee, 3... Paint, 4... Printing material, 5... Perforation, 6... Printing table, 7... Concave groove, 9, 10... Land, 11...
...Stepped hole.
Claims (1)
置に上記穿孔部の直径より大きい直径の凹溝を有
する印刷台上に載置すると共に、前記被印刷物上
に前記穿孔部に対応する開孔部を段付き孔とした
マスクを載置し、その後、スキージーにより前記
マスク面においたペイントを押し出し、そのペイ
ントを上記被印刷物の穿孔部の表側と孔壁と裏側
にわたつて印刷するスルホール印刷法であつて、
上記印刷台の凹溝の直径および深さが、上記被印
刷物裏面への上記ペイントによる印刷パターン形
成を阻止せず、さらに上記ペイントが上記印刷台
に付着しない程度の大きさを有するようにしたこ
とを特徴とするスルホール印刷法。 ２ 印刷するペイントとして導電性ペイントを用
いたことを特徴とする特許請求の範囲第１項記載
のスルホール印刷法。 ３ 印刷するペイントとして絶縁性ペイントを用
いたことを特徴とする特許請求の範囲第１項記載
のスルホール印刷法。 ４ 被印刷物として両面印刷配線板を使用し、そ
の穿孔部に導電性ペイントを印刷して両面の円形
ランド間を上記導電性ペイントにてスルー接続す
ることを特徴とする特許請求の範囲第１項記載の
スルホール印刷法。 ５ 被印刷物としてスルホールめつき部を有する
両面印刷配線板を使用し、そのスルホールめつき
部にペイントをクリープ印刷することを特徴とす
る特許請求の範囲第１項記載のスルホール印刷
法。[Scope of Claims] 1. A printing material is placed on a printing table having a groove having a diameter larger than the diameter of the perforation at a position corresponding to a perforation provided on the printing material, and the perforation is formed on the printing material. A mask with stepped holes corresponding to the holes is placed, and then the paint placed on the mask surface is pushed out with a squeegee, and the paint is spread over the front side of the perforated portion, the hole wall, and the back side of the printing substrate. It is a through-hole printing method that prints with
The diameter and depth of the concave groove of the printing table are large enough not to prevent the paint from forming a printing pattern on the back surface of the printing material, and to prevent the paint from adhering to the printing table. A through-hole printing method featuring 2. The through-hole printing method according to claim 1, characterized in that a conductive paint is used as the paint to be printed. 3. The through-hole printing method according to claim 1, characterized in that an insulating paint is used as the paint to be printed. 4. Claim 1, characterized in that a double-sided printed wiring board is used as the printing material, conductive paint is printed on the perforated portions of the board, and through-connections are made between the circular lands on both sides using the conductive paint. Through-hole printing method described. 5. The through-hole printing method according to claim 1, characterized in that a double-sided printed wiring board having through-hole plated areas is used as the printing material, and paint is creep-printed on the through-hole plated areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6933179A JPS55162296A (en) | 1979-06-01 | 1979-06-01 | Through hole printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6933179A JPS55162296A (en) | 1979-06-01 | 1979-06-01 | Through hole printing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55162296A JPS55162296A (en) | 1980-12-17 |
| JPH0135517B2 true JPH0135517B2 (en) | 1989-07-25 |
Family
ID=13399452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6933179A Granted JPS55162296A (en) | 1979-06-01 | 1979-06-01 | Through hole printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55162296A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58111972U (en) * | 1982-01-25 | 1983-07-30 | シャープ株式会社 | Double-sided printed circuit board manufacturing equipment |
| JPS6112054A (en) * | 1984-06-22 | 1986-01-20 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of producing semiconductor package |
| JPH10163068A (en) * | 1996-12-04 | 1998-06-19 | Rohm Co Ltd | Layered ceramic capacitor array, and its manufacture |
-
1979
- 1979-06-01 JP JP6933179A patent/JPS55162296A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55162296A (en) | 1980-12-17 |
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