JP3340752B2 - Manufacturing method of flexible printed wiring board - Google Patents
Manufacturing method of flexible printed wiring boardInfo
- Publication number
- JP3340752B2 JP3340752B2 JP19909391A JP19909391A JP3340752B2 JP 3340752 B2 JP3340752 B2 JP 3340752B2 JP 19909391 A JP19909391 A JP 19909391A JP 19909391 A JP19909391 A JP 19909391A JP 3340752 B2 JP3340752 B2 JP 3340752B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- flexible printed
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器等に使用され
るフレキシブルプリント配線板に関するもので、特に高
密度配線／実装を要求されるフレキシブルプリント配線
板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board used for electronic equipment and the like, and more particularly to a method for manufacturing a flexible printed wiring board requiring high-density wiring / mounting.
【０００２】[0002]
【従来の技術】電子機器等に使用されるプリント配線板
の高密度化に伴い、フレキシブルプリント配線板を含む
プリント配線板の一般的傾向として、スルーホールを用
いた他層化、スルーホール径の極小化、配線パターンの
細小化等の対応を行っている。2. Description of the Related Art With the increase in density of printed wiring boards used in electronic equipment and the like, the general tendency of printed wiring boards, including flexible printed wiring boards, has been to increase the number of layers using through holes and to reduce the diameter of through holes. Minimization, miniaturization of wiring patterns, etc. are being addressed.
【０００３】[0003]
【発明が解決しようとする課題】フレキシブルプリント
配線板において、層数を増加させたり、パターン幅を細
くしたり、スルーホールランドを極小化することは、既
に技術的／加工精度的に限界に近く、製造コストも飛躍
的に増大させ、この様な方法による高密度化にも限りが
ある。In a flexible printed wiring board, increasing the number of layers, reducing the pattern width, and minimizing through-hole lands are already close to their technical and processing accuracy limits. In addition, the manufacturing cost is dramatically increased, and there is a limit in increasing the density by such a method.
【０００４】そこで、本発明は、両面以上のフレキシブ
ルプリント配線板において、層間の接続に用いるスルー
ホールと表面実装型部品の実装ランドを一体化し、スル
ーホールランドによって基板表面積を占有されないよう
にして、部品実装密度やパターン配線密度を向上させる
ものである。Accordingly, the present invention provides a flexible printed wiring board having two or more surfaces, by integrating through holes used for connection between layers and mounting lands of surface-mounted components so that the through hole lands do not occupy the substrate surface area. This is to improve the component mounting density and the pattern wiring density.
【０００５】[0005]
【課題を解決するための手段】スルーホールを有するフ
レキシブルプリント配線板の製造方法において、スルー
ホールを両側から塞ぐようにスルーホール配線板の両面
に、フィルムカバーレイを熱板プレスし、スルーホール
上及びスルーホール近傍のフィルムカバーレイを除去し
た後、スルーホール上及びスルーホール近傍のフィルム
カバーレイを除去した部分に銅メッキを行なうことによ
って銅メッキにてスルーホール上及びスルーホール近傍
に表面実装用ランドを形成する。又、スルーホール上及
びスルーホール近傍のフィルムカバーレイを除去するの
に、エキシマレーザーを用いる。 Means for Solving the Problems The method of manufacturing a flexible printed wiring board having a through hole, through
On both sides of the through-hole wiring board so as to close the holes from both sides, the film coverlay and the hot plate press, after divided through holes and on the through-holes near the film cover lay, in the vicinity and on the through holes through-hole film
Through holes in the copper plating on and near the through-holes by performing copper plating to the portion removed coverlay
Then, land for surface mounting is formed. In addition, through hole
And remove the film coverlay near through holes
An excimer laser is used.
【０００６】[0006]
【作用】本発明では、熱板プレス工程によって、フィル
ムカバーレイの接着材がスルーホールに充填されるの
で、スルーホールの充填とフィルムカバーレイの形成を
同時に行なうことができる。又、スルーホール上のフィ
ルムカバーレイの除去にエキシマレーザーを用いるの
で、レーザーの照射時間によって除去する厚みを容易に
調整することができ、表面銅箔と完全に同一の高さにな
るように加工できる。また、除去した表面に汚染物や残
渣が残らない。ゆえに、後にこの部分にほどこす銅メッ
キの密度性が良く、接続信頼性が高い。また、レーザー
加工の際、マスキングによって実装ランドの大きさを自
由に決定できる。According to the present invention, the through hole is filled with the adhesive of the film cover lay by the hot plate pressing step, so that the filling of the through hole and the formation of the film cover lay can be performed simultaneously. In addition, since the excimer laser is used to remove the film coverlay on the through-hole, the thickness to be removed can be easily adjusted according to the laser irradiation time, and it is processed so that it is completely the same height as the surface copper foil it can. Further, no contaminants or residues remain on the removed surface. Therefore, the density of the copper plating applied to this portion later is good, and the connection reliability is high. In laser processing, the size of the mounting land can be freely determined by masking.
【０００７】[0007]
【実施例】図面に従って本発明の製造方法を両面フレキ
シブルプリント配線板を例にとって説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The manufacturing method of the present invention will be described with reference to the drawings, taking a double-sided flexible printed wiring board as an example.
【０００８】まず、両面フレキシブルプリント配線板
は、ベース絶縁材料（たとえば、ポリイミド）１と銅箔
２，２で構成される（図１）。この両面フレキシブルプ
リント配線板にスルーホール穴３の加工（たとえば、ド
リル加工）を行う（図２）。次に、層間接続を行う為
に、無電解及び電解銅メッキ４を行う（図３）。この基
板をエッチングして所定の銅パターン５を形成する（図
４）。First, a double-sided flexible printed wiring board is composed of a base insulating material (for example, polyimide) 1 and copper foils 2 and 2 (FIG. 1). The through-hole 3 is processed (for example, drilled) on the double-sided flexible printed wiring board (FIG. 2). Next, in order to perform interlayer connection, electroless and electrolytic copper plating 4 is performed (FIG. 3). This substrate is etched to form a predetermined copper pattern 5 (FIG. 4).
【０００９】フィルムカバーレイは、図５のようにベー
ス絶縁材料６と接着材７で構成され、このフィルムカバ
ーレイ８を実装ランドを開口する為に穴加工した後、パ
ターン形成したフレキシブルプリント配線板の両面に熱
プレスする（図６）。この熱プレスによって、スルーホ
ール９にフィルムカバーレイ８の接着材が充填される。The film cover lay is composed of a base insulating material 6 and an adhesive 7 as shown in FIG. 5, and after forming a hole in the film cover lay 8 to open a mounting land, a pattern-formed flexible printed wiring board is formed. Is hot pressed on both sides (FIG. 6). This hot press fills the through holes 9 with the adhesive of the film coverlay 8.
【００１０】これまでの加工は、従来の技術によるもの
である。The processing so far is based on the prior art.
【００１１】これ以降が本発明の核となる部分である。The following is the core of the present invention.
【００１２】フィルムカバーレイを熱プレスしたフレキ
シブルプリント配線板のスルーホール９上及びその近傍
に、マスキング１１によって選択的にエキシマレーザー
ビーム１０を照射する（図７）。照射するエキシマレー
ザー１０の照射時間を調節することによって、銅パター
ン５を形成している表面銅箔と同一の高さ１２まで、フ
ィルムカバーレイ８の絶縁層を除去する（図８）。次
に、無電解銅メッキと電気銅メッキで、スルーホール９
上に表面実装用のランド１３を形成する（図９）。他の
開口部１４は他の部品の実装ランドであるが、場合によ
りマスキングして銅メッキが付かないようにしてもよ
い。An excimer laser beam 10 is selectively irradiated by a masking 11 onto and around the through hole 9 of the flexible printed wiring board on which the film coverlay is hot pressed (FIG. 7). By adjusting the irradiation time of the excimer laser 10 to be irradiated, the insulating layer of the film coverlay 8 is removed to the same height 12 as the surface copper foil on which the copper pattern 5 is formed (FIG. 8). Next, through holes 9 are formed by electroless copper plating and electrolytic copper plating.
A land 13 for surface mounting is formed thereon (FIG. 9). The other openings 14 are mounting lands for other components, but may be masked so that copper plating is not applied in some cases.
【００１３】[0013]
【発明の効果】本発明では、表面実装部品の実装用ラン
ドの裏に層間接続用のいわゆるスルーホールが形成で
き、大幅に実装／配線密度の向上が図れる。又、スルー
ホール上のフィルムカバーレイの除去にエキシマレーザ
ーを用いるため、この実装ランドになる部分の表面は平
滑度が高く、無電解メッキの密着性及び電気メッキ銅の
均一性が高い。According to the present invention, a so-called through hole for interlayer connection can be formed on the back of the mounting land of the surface mounting component, and the mounting / wiring density can be greatly improved. In addition, since an excimer laser is used to remove the film cover lay on the through-hole, the surface of the mounting land has high smoothness, high adhesion of electroless plating, and high uniformity of electroplated copper.
【図１】本発明の一実施例の製造例を示す一工程断面図
である。FIG. 1 is a one-step cross-sectional view showing a production example of one embodiment of the present invention.
【図２】同工程断面図である。FIG. 2 is a sectional view of the same step.
【図３】同工程断面図である。FIG. 3 is a sectional view of the same step.
【図４】同工程断面図である。FIG. 4 is a sectional view of the same step.
【図５】フィルムカバーレイの構成例を示す断面図であ
る。FIG. 5 is a cross-sectional view illustrating a configuration example of a film coverlay.
【図６】同工程断面図である。FIG. 6 is a sectional view of the same step.
【図７】同工程断面図である。FIG. 7 is a sectional view of the same step.
【図８】同工程断面図である。FIG. 8 is a sectional view of the same step.
【図９】同工程断面図である。FIG. 9 is a sectional view of the same step.
８ フィルムカバーレイ ９ スルーホール １０ エキシマレーザービーム １３ 表面実装用ランド Reference Signs List 8 film coverlay 9 through hole 10 excimer laser beam 13 land for surface mounting
Claims (2)
ント配線板の製造方法において、前記スルーホールを両
側から塞ぐようにスルーホール配線板の両面にフィルム
カバーレイを熱板プレスし、前記スルーホール上及びス
ルーホール近傍のフィルムカバーレイを除去し、次いで
前記スルーホール上及びスルーホール近傍のフィルムカ
バーレイを除去した部分に銅メッキを行い、該銅メッキ
にて前記スルーホール上及びスルーホール近傍に表面実
装用ランドを形成したことを特徴とするフレキシブルプ
リント配線板の製造方法。1. A method of manufacturing a flexible printed wiring board having a through hole , wherein
Both sides in the film coverlay through hole wiring board so as to cover from the side hot plate pressing, was removed dividing the through hole and on the through-holes near the film cover lay, then
A film cover on and near the through hole
Copper plating is performed on the part from which the burley has been removed .
Forming a land for surface mounting on the through hole and in the vicinity of the through hole .
傍のフィルムカバーレイを除去するのに、エキシマレー
ザーを用いることを特徴とする請求項１記載のフレキシ
ブルプリント配線板の製造方法。 2. The method according to claim 1, further comprising : on and near the through hole.
Excimera is used to remove the film coverlay on the side
2. The flexi according to claim 1, wherein a heat sink is used.
Manufacturing method of bull print wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909391A JP3340752B2 (en) | 1991-08-08 | 1991-08-08 | Manufacturing method of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909391A JP3340752B2 (en) | 1991-08-08 | 1991-08-08 | Manufacturing method of flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0548246A JPH0548246A (en) | 1993-02-26 |
| JP3340752B2 true JP3340752B2 (en) | 2002-11-05 |
Family
ID=16402001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19909391A Expired - Fee Related JP3340752B2 (en) | 1991-08-08 | 1991-08-08 | Manufacturing method of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3340752B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2804941B2 (en) * | 1994-01-24 | 1998-09-30 | 矢崎総業株式会社 | Terminal insert |
| JP2967903B2 (en) * | 1994-01-26 | 1999-10-25 | 矢崎総業株式会社 | Connector with lever |
| GB2597960B (en) * | 2020-08-11 | 2022-09-07 | Aptiv Tech Ltd | Connector assembly with sealed symmetrical split lever |
-
1991
- 1991-08-08 JP JP19909391A patent/JP3340752B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0548246A (en) | 1993-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05218618A (en) | Manufacture of printed wiring board | |
| US6599617B2 (en) | Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof | |
| KR100752017B1 (en) | Manufacturing Method of Printed Circuit Board | |
| JP3340752B2 (en) | Manufacturing method of flexible printed wiring board | |
| JP3575783B2 (en) | Printed wiring board and method of manufacturing the same | |
| JPH1032371A (en) | Composite circuit board and its manufacture | |
| JP2741238B2 (en) | Flexible printed wiring board and method of manufacturing the same | |
| JPH08107263A (en) | Manufacturing method of printed-wiring board | |
| JP3432534B2 (en) | Printed wiring board | |
| JPS63137498A (en) | Manufacture of through-hole printed board | |
| JP2003142823A (en) | Manufacturing method for both-sided flexible circuit board | |
| JP2710177B2 (en) | Multilayer printed wiring board | |
| JPH10313177A (en) | Manufacture of multilayered printed wiring board | |
| KR20030042339A (en) | Method for creating through holes in printed wiring board | |
| JP2770262B2 (en) | Method of manufacturing multilayer substrate with built-in resistor | |
| JPS584999A (en) | Method of producing printed circuit board | |
| JPH03229488A (en) | Manufacture of printed wiring board | |
| JPH01217994A (en) | Printed wiring board | |
| JPH0430494A (en) | Printed wiring board and manufacture thereof | |
| JPH04152692A (en) | Manufacture of printed wiring board | |
| JPH0499394A (en) | Multilayer printed circuit board | |
| JPH118465A (en) | Manufacture of printed wiring board through additive method | |
| JPH01295489A (en) | Manufacture of printed wiring board and wiring board obtained by this manufacturing method | |
| JPH0799376A (en) | Printed-wiring board | |
| KR20120026848A (en) | The flexible printed circuit board and the method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070816 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080816 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080816 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090816 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |