JP3221316B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP3221316B2 JP3221316B2 JP08251796A JP8251796A JP3221316B2 JP 3221316 B2 JP3221316 B2 JP 3221316B2 JP 08251796 A JP08251796 A JP 08251796A JP 8251796 A JP8251796 A JP 8251796A JP 3221316 B2 JP3221316 B2 JP 3221316B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- insulating layer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、スルーホールから
放射されるノイズを低減するために、スルーホールの一
方の開口を覆う絶縁層上に導電性ペーストを形成した印
刷配線板の製造方法に関する。The present invention relates to a method for manufacturing a printed wiring board in which a conductive paste is formed on an insulating layer covering one opening of a through hole in order to reduce noise radiated from the through hole.
【０００２】[0002]
【従来の技術】図３は一般的なスクリーン印刷法を説明
する図、図４は従来の印刷配線板の断面図である。これ
らの図に基づいて従来の印刷配線板の製造方法を説明す
る。全体を符号１で示す印刷配線板は、両面に接着剤３
が塗布された積層板２にドリルによって直径Ｒ1 が０．
３ｍｍの貫通孔４が穿孔され、外層回路（図示せず）と
逆パターン状にめっきレジスト６を塗布し、無電解銅め
っきにより外層回路と、貫通孔４の側壁部および両端縁
に導体部５ａ，５ｂが析出されてスルーホール５とが形
成される。2. Description of the Related Art FIG. 3 is a view for explaining a general screen printing method, and FIG. 4 is a sectional view of a conventional printed wiring board. A conventional method for manufacturing a printed wiring board will be described with reference to these drawings. The printed wiring board, generally designated by the reference numeral 1, has an adhesive 3 on both sides.
Diameter R 1 is 0 but the coated drill laminate 2.
A 3 mm through hole 4 is drilled, a plating resist 6 is applied in a pattern reverse to that of an outer layer circuit (not shown), and the outer layer circuit is formed by electroless copper plating. , 5b are deposited to form through holes 5.
【０００３】そして、図３に示すように、版乳剤がスル
ーホール５に対応した以外のインク塗布に不必要な部分
に塗布されたスクリーン印刷用版１４に、インク押出部
材であるスキージ１５の押出部材１５ａの先端を押圧さ
せながらスキージ１５を矢印Ｂ方向に移動させることに
より、絶縁樹脂インク１３をスクリーン印刷用版１４を
介してスルーホール５の一方の開口と導体部５ｂとを覆
うようにして塗布して絶縁層８を形成し、この絶縁層８
上に導電性ペースト９をスクリーン印刷法によって形成
する。このようにして形成された導体部５ｂと導電性ペ
ースト９との間は厚さＴなる絶縁層８によって絶縁され
る。[0003] As shown in FIG. 3, a squeegee 15, which is an ink extruding member, is extruded onto a screen printing plate 14 in which a plate emulsion is applied to portions not required for ink application other than the portions corresponding to the through holes 5. By moving the squeegee 15 in the direction of arrow B while pressing the tip of the member 15a, the insulating resin ink 13 covers one opening of the through hole 5 and the conductor portion 5b via the screen printing plate 14. The insulating layer 8 is formed by coating.
A conductive paste 9 is formed thereon by a screen printing method. The conductive layer 5b thus formed and the conductive paste 9 are insulated by the insulating layer 8 having a thickness T.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の印刷配
線板の製造方法においては、絶縁樹脂インク１３をＵＶ
硬化系のものを使用し、インク１３の粘度を４００ポイ
ズ、印刷用版のメッシュを１５０〜１８０、版乳剤の厚
みを１００μｍとすることにより、絶縁樹脂インク８が
孔４の下方に流入することがなく、所定の厚さＴなる絶
縁層８を形成することが可能であることが確かめられて
いる。しかしながら、図５に示すようにスルーホール５
の孔４の直径Ｒ2 を０．３ｍｍ以上とすると、絶縁樹脂
インク８が孔４の下方（図中矢印Ｃで示す方向）に流
れ、このため導電性ペースト９が孔４内に落ち込み、ス
ルーホール５の導体部５ｂとの間に所定の絶縁間隔が得
られなくなり、絶縁不良が発生する。そこで、本出願人
は、孔４の直径を０．５ｍｍとし、絶縁樹脂インク１３
をインク粘度が３００〜８００ポイズの種々のものを用
い、版乳剤の厚みも２０μｍからインク転写限界の１０
０μｍまで種々変えて実験を試みてみたが、いずれも絶
縁樹脂インク１３が孔４内に流れ込む結果となった。孔
４の直径が０．３ｍｍ以下の場合では、強度上孔４を穿
孔するドリルの全長を長くすることができないため、通
常１回での穿孔作業によって印刷配線板１を２枚重ねて
穿孔するのが限界となり、生産性の向上に支障をきたし
ていた。In the above-described conventional method for manufacturing a printed wiring board, the insulating resin ink 13 is made of UV.
By using a hardening type ink, the viscosity of the ink 13 is 400 poise, the mesh of the printing plate is 150 to 180, and the thickness of the plate emulsion is 100 μm. It has been confirmed that it is possible to form the insulating layer 8 having a predetermined thickness T. However, as shown in FIG.
Of When the diameter R 2 of the hole 4 0.3 mm or more, the insulating resin ink 8 flows below the hole 4 (the direction indicated by arrow C), Accordingly the conductive paste 9 falls into the hole 4, through A predetermined insulation interval cannot be obtained between the hole 5 and the conductor portion 5b, and insulation failure occurs. Therefore, the present applicant sets the diameter of the hole 4 to 0.5 mm and sets the insulating resin ink 13
Of a plate emulsion having a viscosity of 300 to 800 poise, and a plate emulsion having a thickness of 20 μm to 10
Experiments were conducted with various changes to 0 μm, but all resulted in the insulating resin ink 13 flowing into the holes 4. When the diameter of the hole 4 is 0.3 mm or less, the overall length of the drill for drilling the hole 4 cannot be increased because of the strength. Therefore, two printed wiring boards 1 are usually drilled in a single drilling operation. Has become a limit, and has hindered productivity improvement.
【０００５】したがって、本発明は上記した従来の問題
に鑑みてなされたものであり、その目的とするところ
は、スルーホール孔の直径を大きくしてもスルーホール
と導電性ペーストとの間に所定の絶縁耐圧が得られるよ
うにし、生産性の向上を図った印刷配線板の製造方法を
提供することにある。Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a semiconductor device having a predetermined distance between the through hole and the conductive paste even if the diameter of the through hole is increased. It is an object of the present invention to provide a method for manufacturing a printed wiring board, which is capable of obtaining a high withstand voltage and improving productivity.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る印刷配線板の製造方法は、スルーホー
ルの一方の開口を覆うように、インク押出部材によって
スクリーン部材を介して絶縁性のインクを転写して絶縁
層を形成し、この絶縁層上に導電性ペーストを形成した
印刷配線板の製造方法であって、前記絶縁層を形成する
前に、スルーホール孔の他方の開口を粘着フィルムで閉
塞したものである。したがって、絶縁層を形成するとス
ルーホール孔内が密閉状態となり、スルーホール孔内の
空気の空気圧により絶縁性のインクのスルーホール孔内
への流れ込みが規制される。In order to achieve the above object, a method of manufacturing a printed wiring board according to the present invention is provided in which an ink extruding member is used to cover one opening of a through-hole via a screen member. A method for manufacturing a printed wiring board, wherein an insulating layer is formed by transferring a conductive ink, and a conductive paste is formed on the insulating layer, wherein the other of the through-hole holes is formed before forming the insulating layer. Is closed with an adhesive film. Therefore, when the insulating layer is formed, the inside of the through-hole is sealed, and the flow of the insulating ink into the through-hole is regulated by the air pressure of the air in the through-hole.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。図１は本発明に係る印刷配線板の断
面図、図２は同じくラミネートする方法を説明する図で
ある。本発明の特徴とするところは、スクリーン印刷用
版１４を介して絶縁樹脂インク１３を塗布して絶縁層８
を形成する前に、スルーホール５の孔４の絶縁層８を形
成するのと反対側の開口を粘着フィルム７で閉塞した点
にある。すなわち、直径０．５ｍｍの孔４を穿孔し、積
層板２に無電解銅めっきにより外層回路（図示せず）
と、スルーホール５とを形成した後、図２に示すように
積層板２の表裏を反転させてロール１１に載置し、積層
板２の裏面側にフィルムロール１０に巻回された厚さ１
０μｍの粘着フィルム７を５Ｋｇ／ｍｍ2 以上のラミネ
ート圧を加えて貼着する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a printed wiring board according to the present invention, and FIG. 2 is a view for explaining a laminating method. A feature of the present invention is that the insulating resin ink 13 is applied through the screen printing plate 14 to form the insulating layer 8.
The point is that the opening of the hole 4 of the through hole 5 on the side opposite to the side on which the insulating layer 8 is formed is closed with the adhesive film 7 before forming the same. That is, a hole 4 having a diameter of 0.5 mm is formed, and an outer layer circuit (not shown) is formed on the laminate 2 by electroless copper plating.
And the through-holes 5 are formed, and as shown in FIG. 2, the laminated plate 2 is placed on a roll 11 with its front and back reversed, and the thickness is wound around a film roll 10 on the back surface of the laminated plate 2. 1
The adhesive film 7 having a thickness of 0 μm is adhered by applying a laminating pressure of 5 kg / mm 2 or more.
【０００８】ここで、粘着フィルム７の厚みを厚くする
と、積層板２の表面の凹凸に対応できずに良好な密着性
が得れなくなるために１０〜１５μｍとするのが望まし
い。また、本実施の形態では、スルーホール５の導体部
５ｂと外層回路とをアデティブ法によって同時に形成し
たので、これら導体部５ｂと外層回路とが同じ厚みに形
成され、このため粘着フィルム７の貼着面に凹凸が形成
されず、粘着フィルム７の密着性が良好となる。Here, if the thickness of the adhesive film 7 is increased, it is not possible to cope with the unevenness of the surface of the laminate 2 so that good adhesion cannot be obtained, so that the thickness is desirably 10 to 15 μm. Further, in the present embodiment, since the conductor 5b of the through hole 5 and the outer layer circuit are simultaneously formed by the additive method, the conductor 5b and the outer layer circuit are formed to have the same thickness. No irregularities are formed on the attachment surface, and the adhesiveness of the adhesive film 7 is improved.
【０００９】粘着フィルム７を貼着した後に、上述した
図３に示す従来周知のスクリーン印刷方法でメッシュ１
８０のスクリーン印刷用版１４に８０μｍの厚さの版乳
剤を塗布して、５００ポイズ以上の高粘度の絶縁樹脂イ
ンク１３をスルーホール５の粘着フィルム７が貼着され
た側と反対側の開口を覆うように塗布する。このとき、
粘着フィルム７によってスルーホール５の一方の開口が
閉塞されているので、孔４内が密閉された状態となり、
孔４内の密閉された空気の存在によって絶縁樹脂インク
１３が孔４内に流れ込むようなことがなく、絶縁層８上
に形成した導電性ペースト９とスルーホール５の導体部
５ｂとの間に所定の厚さの絶縁層８が形成される。After the adhesive film 7 is adhered, the mesh 1 is formed by the screen printing method shown in FIG.
An 80 μm-thick plate emulsion is applied to a screen printing plate 14 of 80, and a high-viscosity insulating resin ink 13 of 500 poise or more is applied to the opening of the through hole 5 on the side opposite to the side on which the adhesive film 7 is adhered. Apply to cover. At this time,
Since one opening of the through hole 5 is closed by the adhesive film 7, the inside of the hole 4 is in a sealed state,
The insulating resin ink 13 does not flow into the hole 4 due to the presence of the sealed air in the hole 4, and the space between the conductive paste 9 formed on the insulating layer 8 and the conductor portion 5 b of the through hole 5 is prevented. An insulating layer 8 having a predetermined thickness is formed.
【００１０】このようにして形成された本実施の形態の
絶縁層８と導電性ペースト９との界面の絶縁耐圧をＪＩ
Ｓ−Ｃ２１１０に準じて測定した。また、スルーホール
５を形成せずに外層回路を形成した印刷配線板において
外層回路上に絶縁層８を形成し、絶縁層８上に導電性ペ
ースト９を形成したものとを比較した。The withstand voltage at the interface between the thus formed insulating layer 8 and the conductive paste 9 of the present embodiment is determined by JI
It measured according to S-C2110. Further, a printed wiring board in which an outer layer circuit was formed without forming the through hole 5 was compared with a printed wiring board in which an insulating layer 8 was formed on the outer layer circuit and a conductive paste 9 was formed on the insulating layer 8.
【００１１】表１はその測定結果であり、スルーホール
５の孔４の直径を０．３ｍｍ以上に形成した印刷配線板
１が、スルーホール５を形成しない印刷配線板と同じ特
性が得られることがわかり、導電性ペースト９とスルー
ホール５の導体部５ｂとの間に所定の絶縁耐圧が得られ
る。したがって、スルーホール５から放射されるノイズ
を導電性ペースト９によって低減でき、かつスルーホー
ル５の孔４の直径を大きくできるので、全長の長いドリ
ルを用いることができ、このため生産性が向上する。Table 1 shows the measurement results. The printed wiring board 1 in which the diameter of the hole 4 of the through hole 5 is 0.3 mm or more can obtain the same characteristics as the printed wiring board in which the through hole 5 is not formed. It can be seen that a predetermined withstand voltage is obtained between the conductive paste 9 and the conductor portion 5b of the through hole 5. Therefore, the noise radiated from the through-hole 5 can be reduced by the conductive paste 9 and the diameter of the hole 4 of the through-hole 5 can be increased, so that a drill having a long overall length can be used, thereby improving the productivity. .
【００１２】[0012]
【表２】 絶縁耐圧測定結果
（単位：ＫＶ） [Table 2] Dielectric strength measurement results
(Unit: KV)
【００１３】[0013]
【発明の効果】以上説明したように本発明によれば、ス
ルーホールの一方の開口を覆うように、インク押出部材
によってスクリーン部材を介して絶縁性のインクを転写
して絶縁層を形成し、この絶縁層上に導電性ペーストを
形成し、絶縁層を形成する前に、スルーホール孔の他方
の開口を閉塞したことにより、絶縁層の形成時にスルー
ホール孔が密閉されるので、スルーホール孔内の密閉さ
れた空気により、絶縁層がスルーホール孔内に流れ込む
ことがなく、絶縁層によって導電性ペーストとスルーホ
ールとの間の絶縁が保たれ、このためスルーホールから
放射されるノイズを低減することができ、電子部品の高
密度実装が可能となる。また、スルーホールの直径を大
きくすることができるので、全長の長いドリルを用いる
ことができ、このため多数の印刷配線板を一度に穿孔す
ることができ、生産性の向上が図られる。As described above, according to the present invention, an insulating layer is formed by transferring insulating ink through a screen member by an ink extruding member so as to cover one opening of a through hole. By forming a conductive paste on this insulating layer and closing the other opening of the through-hole before forming the insulating layer, the through-hole is closed when the insulating layer is formed. Due to the sealed air inside, the insulating layer does not flow into the through hole, the insulating layer keeps the insulation between the conductive paste and the through hole, thus reducing the noise radiated from the through hole And high-density mounting of electronic components becomes possible. Further, since the diameter of the through-hole can be increased, a drill having a long overall length can be used, so that a large number of printed wiring boards can be punched at one time, thereby improving productivity.
【図面の簡単な説明】[Brief description of the drawings]
【図１】 本発明に係る印刷配線板の断面図である。FIG. 1 is a sectional view of a printed wiring board according to the present invention.
【図２】 本発明に係る印刷配線板の製造方法において
用いられる粘着フィルムをラミネートする方法を説明す
る図である。FIG. 2 is a diagram illustrating a method of laminating an adhesive film used in the method of manufacturing a printed wiring board according to the present invention.
【図３】 印刷配線板の製造方法において用いられる一
般的なスクリーン印刷法を説明する図である。FIG. 3 is a diagram illustrating a general screen printing method used in a method of manufacturing a printed wiring board.
【図４】 従来の印刷配線板の製造方法によって製造さ
れたスルーホールの直径が０．３ｍｍ以下の印刷配線板
の断面図である。FIG. 4 is a cross-sectional view of a printed wiring board in which a diameter of a through hole manufactured by a conventional method for manufacturing a printed wiring board is 0.3 mm or less.
【図５】 従来の印刷配線板の製造方法によって製造さ
れたスルーホールの直径が０．３ｍｍ以上の印刷配線板
の断面図である。FIG. 5 is a cross-sectional view of a printed wiring board in which a diameter of a through hole manufactured by a conventional method for manufacturing a printed wiring board is 0.3 mm or more.
１…印刷配線板、２…積層板、４…孔、５…スルーホー
ル、７…粘着フィルム、８…絶縁層、９…導電性ペース
ト、１０…フィルムロール。DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Laminated board, 4 ... Hole, 5 ... Through hole, 7 ... Adhesive film, 8 ... Insulating layer, 9 ... Conductive paste, 10 ... Film roll.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/11 H05K 3/28 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 1/11 H05K 3/28
Claims (1)
に、インク押出部材によってスクリーン部材を介して絶
縁性のインクを転写して絶縁層を形成し、この絶縁層上
に導電性ペーストを形成した印刷配線板の製造方法であ
って、前記絶縁層を形成する前に、スルーホール孔の他
方の開口を粘着フィルムで閉塞したことを特徴とする印
刷配線板の製造方法。 1. A method for covering one opening of a through hole.
In addition, the ink is extruded through the screen
The insulating ink is transferred to form an insulating layer, and on this insulating layer
A method for manufacturing a printed wiring board having a conductive paste formed thereon.
Therefore, before forming the insulating layer, other than the through-hole holes
A seal characterized in that one opening is closed with an adhesive film
Manufacturing method of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08251796A JP3221316B2 (en) | 1996-04-04 | 1996-04-04 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08251796A JP3221316B2 (en) | 1996-04-04 | 1996-04-04 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09275259A JPH09275259A (en) | 1997-10-21 |
| JP3221316B2 true JP3221316B2 (en) | 2001-10-22 |
Family
ID=13776736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08251796A Expired - Fee Related JP3221316B2 (en) | 1996-04-04 | 1996-04-04 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3221316B2 (en) |
-
1996
- 1996-04-04 JP JP08251796A patent/JP3221316B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09275259A (en) | 1997-10-21 |
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| LAPS | Cancellation because of no payment of annual fees |