JP6596356B2 - かしめ治具及びそれを使用する製造方法 - Google Patents
かしめ治具及びそれを使用する製造方法 Download PDFInfo
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 3
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- 229910052594 sapphire Inorganic materials 0.000 description 3
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- B21J15/00—Riveting
- B21J15/38—Accessories for use in connection with riveting, e.g. pliers for upsetting; Hand tools for riveting
- B21J15/48—Devices for caulking rivets
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- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
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- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
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- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/409—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using manual data input [MDI] or by using control panel, e.g. controlling functions with the panel; characterised by control panel details or by setting parameters
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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Description
図1に示すように、本発明により製造される基板支持装置1は、例えば、アルミニウム合金等の金属からなる円盤形のプレート部材2を備えている。プレート部材2は、ヒータユニットを内蔵しており、上面2Aに載置された半導体ウエハ等の基板を所定の温度に加熱できる。
本発明の第1の実施形態のかしめ治具10について、図3乃至図6を参照して説明する。
図3は、かしめ治具10がNC工作機械100に装着された状態を示す斜視図である。本実施形態において、図3に示すように、第1の方向(左右方向)X、第2の方向(前後方向)Y、第3の方向(上下方向)Zを定義する。NC工作機械100は、第3の方向Zに移動可能な主軸頭101と、第1及び第2の方向X,Yに移動可能なテーブル102と、を備えている。
基板支持装置1を製造するには、まず、図6に示すように、プレート部材2の上面2Aに深さH1内径D2の穴5と、座ぐり部8とを形成する(穿孔ステップ)。本実施形態では、100箇所の穴5を形成する。穴5の底5Aとスペーサ部材6との隙間を小さくできるため、好ましくは底5Aを半球形に形成する。なお、底5Aの形状は半球形に限られず、平坦に形成してもよいし、円錐形に形成してもよい。
変形例では、図14に示す穿孔ステップにおいて、座ぐり部8に代えて肉抜き部8Aを形成する。肉抜き部8Aは、穴5の縁部5Bの周囲において、図15に示すかしめステップで刃先12Aが下降する位置よりも深くまで形成される。
第2の実施形態について、図16を参照して説明する。第2の実施形態は、かしめ治具10が突出部材13に接続された荷重センサ51を備える点が第1の実施形態と異なる。
第2の実施形態では、付勢部材14の付勢力に抗して突出部材13に及ぼされた荷重を荷重センサ51により測定できる。
第3の実施形態について、図17を参照して説明する。第3の実施形態は、かしめ治具10が真空源52及び真空度センサ53を備える点が第1の実施形態と異なる。
第3の実施形態では、突出部材13が、先端部31から案内軸35まで貫通する貫通孔54を有する。案内軸35は、本体11の蓋部21を貫通して本体11の外部に配置された真空源52と接続される。真空源52と突出部材13とを接続する経路には、真空度センサ53が接続される。真空度センサ53は、貫通孔54の内部の真空度を測定する。
第4の実施形態について、図18を参照して説明する。第4の実施形態は、かしめ治具10が光センサ55を備える点が第1の実施形態と異なる。
第4の実施形態では、第3の実施形態と同様、突出部材13の先端部31から案内軸35まで貫通する貫通孔54が突出部材13に形成される。光センサ55は、貫通孔54を介して突出部材13の先端部31の延長上の光の反射率を測定する。
Claims (9)
- 金属製のプレート部材の平坦な上面に形成された穴の縁部を塑性変形させて、前記穴に収容されたスペーサ部材を該スペーサ部材の上端部が前記上面から所定の高さだけ突出した位置に固定するためのかしめ治具であって、
円筒形の本体と、
前記本体の先端に設けられ、刃先がV形に尖った刃部と、
前記本体に内嵌された突出部材と、
前記突出部材を前記刃部から突出させる方向に付勢する付勢部材と、
前記突出部材を前記本体に係止する係止手段と、
を具備し、
前記突出部材は、
前記係止手段に係止されない状態において、前記付勢部材の付勢力によって先端部を前記刃先から突出させた突出位置に保持され、
前記係止手段に係止された状態において、前記付勢部材の付勢力に抗して前記先端部を前記刃先よりも没入させた没入位置に保持される
ことを特徴とするかしめ治具。 - 前記突出部材は、前記先端部よりも大径に形成された肩部をさらに有し、
前記係止手段は、
前記本体に形成され、前記本体の中心軸と直交する平面上に位置し、該中心軸と交わらない弦の位置において前記本体を貫通する係止孔と、
前記係止孔に挿入され、前記付勢部材が前記突出部材を付勢する方向とは反対側から前記突出部材の前記肩部に当接する係止ピンと、を有している
ことを特徴とする請求項1に記載のかしめ治具。 - 前記突出部材の前記先端部は、基端に向かって凹むように形成されている
ことを特徴とする請求項1又は2に記載のかしめ治具。 - 前記付勢部材の付勢力に抗して前記突出部材に及ぼされた荷重を測定する荷重センサをさらに具備し、
前記荷重センサにより前記突出部材が前記スペーサ部材と当接しているか否か検知する
ことを特徴とする請求項1乃至3のいずれか一項に記載のかしめ治具。 - 前記突出部材と接続された真空源をさらに具備し、
前記突出部材は、先端から基端まで貫通する貫通孔を有し、
前記真空源が、前記貫通孔を介して前記先端部に前記スペーサ部材を吸着する
ことを特徴とする請求項1又は2に記載のかしめ治具。 - 前記貫通孔の真空度を測定する真空度センサをさらに具備し、
前記真空度センサにより前記先端部に前記スペーサ部材が吸着されているか否か検知する
ことを特徴とする請求項5に記載のかしめ治具。 - 前記突出部材に接続された光センサをさらに具備し、
前記突出部材は、先端から基端まで貫通する貫通孔を有し、
前記光センサが前記貫通孔を介して反射率を測定することにより、前記先端部の延長上に前記スペーサ部材が配置されているか否か検知する
ことを特徴する請求項1又は2に記載のかしめ治具。 - 金属製のプレート部材の平坦な上面に複数の穴を形成する穿孔ステップと、
前記穴にスペーサ部材をそれぞれ挿入するスペーサ配置ステップと、
刃部と、該刃部から突出する方向に付勢された突出部材と、を備えたかしめ治具をNC工作機械に取り付ける治具装着ステップと、
前記突出部材を前記刃部よりも没入させた状態に保持し、前記刃部の高さを校正して前記NC工作機械に所定のかしめ位置を設定する治具位置補正ステップと、
前記突出部材を前記刃部から突出させた状態で、前記かしめ治具を下降させて前記スペーサ部材を前記突出部材で押圧し前記穴の底に当接させるスペーサ位置補正ステップと、
前記突出部材の付勢力に抗して前記刃部を前記かしめ位置までさらに下降させ、該刃部により前記穴の縁部を塑性変形させて前記スペーサ部材を固定するかしめステップと、
を具備した基板支持装置の製造方法。 - 前記スペーサ位置補正ステップにおいて、前記穴に前記スペーサ部材が収容されているか否かを検知し、前記スペーサ部材が収容されていない場合、前記かしめステップに進まないで前記かしめ治具の下降を中断することを特徴とする請求項8に記載の基板支持装置の製造方法。
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TW106105780A TWI649137B (zh) | 2016-02-24 | 2017-02-21 | 模鍛治具及使用該模鍛治具的製造方法 |
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