CN108698108B - 一种铆接钻模及使用铆接钻模的制造方法 - Google Patents
一种铆接钻模及使用铆接钻模的制造方法 Download PDFInfo
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Abstract
本发明提供这样一种铆接钻模:通过在突出构件缩回的状态下校正刃部的高度来应用NC机床的同时,通过在校正隔离构件的位置的状态下使孔的边缘部塑性变形,从而使隔离构件的上端部的高度均匀统一。铆接钻模(10)配备有本体(11),刃部(12),突出构件(13),推动构件(14),锁定装置(15)。突出构件(13)在未通过锁定装置(15)锁定的状态下,保持在通过推动构件(14)的推动力其顶端部(31)从刀头(12A)开始突出的突出位置(P1)上。在通过锁定装置(15)锁定的状态下,突出构件(13)抵抗推动构件(14)的推动力保持在其顶端部(31)没入比刀头(12A)还要里面的没入位置(P2)上。
Description
技术领域
本发明的实施例涉及用于加工基板支撑装置的铆接钻模及使用铆接钻模制造基板支撑装置的制造方法,其中基板支撑装置用于半导体晶片的热处理等。
背景技术
在制造半导体过程中,需要使用具有加热功能的基板支撑装置以对晶体等的基板进行热处理。基板支撑装置配备有内置有加热单元的板构件,并将基板载置于板构件上表面以进行加热。
但是,万一板构件存在导致污染的微粒子的话,微粒子会附着于与板构件密切相接的基板的内表面,从而导致半导体的品质降低。为了解决这种问题,提出过下面这种基板支撑装置(例如特许文献1):在基板和板构件之间设置小缝隙,从而可以不使基板与板构件密切相接地进行热处理。
先行技术文献
专利文献
【专利文献1】特许4629574号公报。
发明内容
发明待解决问题
该基板支撑装置配备有具有平坦的上表面的金属制的板构件,形成于板构件上表面并具有多个的孔,收纳于孔中的球形隔离构件。隔离构件的上端部从板构件的上表面略微突出,并且通过使孔的开口边缘部塑性变形而形成的铆接部来防止其脱落。
如果使用尺寸精度高的隔离构件并且通过NC机床来形成深度均匀的孔的话,从板构件的上表面突出的隔离构件的上端部的高度应该可以变得均匀。但是,如果铆接部在隔离构件不与孔的底部相接的状态下形成的话,那么隔离构件的上端部的高度会因隔离构件和孔的底部之间的间隙而变得层次不齐。为了使孔的底部与隔离构件相接,操作者需要每次手动调节隔离构件的位置,非常麻烦。
本发明的目的在于提供这样一种铆接钻模:通过在突出构件缩回的状态下校正刃部的高度来应用NC机床的同时,通过在校正隔离构件的位置的状态下使孔5的边缘部塑性变形,使隔离构件的上端部的高度均匀统一。
解决本课题的方式
根据实施例,铆接钻模配备有圆柱形的本体,刀头为V字形的刃部,突出构件、推动构件和锁定装置。推动构件用以将向从刃部突出的方向推动突出构件。锁定装置用于将突出构件锁定于本体上。突出构件内嵌于本体内。突出构件在未通过锁定装置锁定的状态下,保持在通过推动构件的推动力其顶端部从刀头开始突出的突出位置上。在通过锁定装置锁定的状态下,突出构件抵抗推动构件的推动力保持在其顶端部没入比刀头还要里面的没入位置上。
此时,突出构件还可以具有肩部,所述肩部的直径比顶端部还要大。锁定装置也可以具有锁定孔和锁定销。锁定孔形成于本体,并且位于垂直于本体的中心轴的平面上的同时,在不与中心轴相交的弦的位置中贯穿本体。当锁定销***锁定孔时,锁定销从与推动构件推动突出构件的方向相反的侧抵靠在突出构件的肩部上。
突出构件的顶端部也可以形成为具有朝向基端的凹部。还可以具有荷重传感器,以检测抵抗推动构件的推动力施加于突出构件的荷重。荷重传感器可以检测突出构件是否与隔离构件接触。
突出构件也可以具有贯通顶端至基端的贯通孔。还可以具有连接突出构件的真空源。还可以具有测定贯通孔真空度的真空度传感器。真空源可以通过贯通通孔将隔离构件吸附于顶端部上。通过真空度传感器,可以检测隔离构件是否吸附于顶端部上。还可以具有连接突出构件的光传感器。光传感器通过经由贯通孔检测反射率,可以检测得知隔离构件是否配置于顶端部的延长部分上。
根据实施例,半导体晶体支撑装置的制造方法可以具有穿孔步骤,配置隔离步骤,安装钻模步骤,校正钻模位置步骤,校正隔离位置步骤,铆接步骤。在穿孔步骤中,在金属制的板构件的平坦的上表面上形成多个孔。在配置隔离步骤中,在孔中***隔离构件。在安装钻模步骤中,将铆接钻模安装于NC机床中。所述铆接钻模具有刃部和向从刃部的突出方向被施力的突出构件。在校正钻模位置的步骤中,在使突出构件没入比刃部还要里面的没入位置的状态下校正刃部的高度。基于校正结果,设定NC机床的预定铆接位置。在校正隔离位置的步骤中,在使突出构件从刀头突出的在状态下,下降铆接钻模。然后,用突出构件按压隔离构件使隔离构件与孔的底部相接触。在铆接步骤中,克服突出构件的推动力使刃部进一步下降到铆接位置。然后,通过刃部使孔的边缘部塑性变形并且固定隔离构件。
在校正隔离位置的步骤中,可以检测隔离构件是否容纳于孔中,并且在隔离构件未容纳于孔中的情况下,可以在不进行铆接步骤的状态下暂停铆接钻模的下降。
附图说明
图1为各实施例的基板支撑装置的透视图。
图2为图1所示的隔离配置部的细节剖视图。
图3为示出铆接钻模安装在数控(NC)机床上的状态的透视图。
图4为示出第1实施例的铆接钻模的剖视图。
图5为示出图3所示的突出构件保持在缩回位置的状态的剖视图。
图6为示出在使用第1实施例的铆接钻模制造基板支撑装置的制造方法中包含的钻孔步骤的剖视图。
图7为继图6的配置隔离步骤的剖视图。
图8为继图7的校正钻模位置步骤的剖视图。
图9为继图8的校正隔离位置步骤的部分剖视图。
图10为继图9的校正隔离位置步骤的部分剖视图。
图11为继图10的铆接步骤的剖视图。
图12为根据本发明的制造方法得到的基板支撑装置的隔离构件而计算出的球直径的示意图。
图13为根据在不校正隔离构件位置的情况下使孔的边缘部塑性变形的基板支撑装置而计算出的球直径的示意图。
图14为图6所示的孔的变形例的剖视图。
图15为示出适用于制造图14所示的孔的变形例的本发明的制造方法的剖视图。
图16为示出第2实施例的铆接钻模的剖视图。
图17为示出第3实施例的铆接钻模的剖视图。
图18为示出第4实施例的铆接钻模的剖视图。
符号说明
1···基板支撑装置,2···板构件,2A···板构件的上表面,5···孔,5A···孔的边缘部,6···隔离构件,6A···隔离构件的上端部,10···铆接钻模,10A···铆接钻模的基端,10B···铆接钻模的顶端,11···本体,12···刃部,12A···刃部刀头,13···突出构件,14···推动构件,15···锁定构件,31···突出构件的顶端部,34···突出构件的肩部,41···锁定孔,42···锁定销,51···荷重传感器,52···真空源,53···真空度传感器,54···贯通孔,55···光传感器,100···NC机床,H2···隔离构件的上端部的高度。
具体实施方式
首先,参考图1及图2对根据本发明制造的基板支撑装置进行说明。
如图1所示,根据本发明制造的基板支撑装置1例如具备有由铝合金等金属制造的圆盘形的板构件2。板构件2内置有加热单元,载置于上表面2A的半导体晶圆等可以将基板加热至预定温度。
上表面2A可以通过机械加工等平坦化,并且设置有多个隔离配置部3和多个通孔4。从通孔4的下方***有突出钉,以将载置于上表面2A上的基板推上去。
图2为详细示出隔离配置部3的截面图。如图2所示,隔离配置部3具有形成于上表面2A的具有底部的孔5,收纳于孔5中的隔离构件6,以及使隔离构件6不会从孔5中脱离的铆接部7。
隔离构件6的一例是蓝宝石球体。另外,隔离构件的材质不限于蓝宝石、也可以使用红宝石等其他钢玉、碳化硅、氮化铝,或其他陶瓷制成的球体。也可以是圆柱形、炮弹形、圆锥形等具有直径的其他形状。隔离构件6的直径D1为例如为2.000mm。如果隔离构件6是球形的话,可以容易地获得具有优异尺寸精度的构件。
孔的底部5A形成为半球形的凹部。孔5的边缘5B从上往下看是圆形。孔5的内径D2相比隔离构件6的直径D1略大。即使板构件2冷却并且热收缩,孔5的内径D2也不会低于隔离构件6的直径D1。孔的深度H1相比隔离构件6的直径D1略小。孔的深度H1例如为1.87~1.88mm。
隔离构件6的上端部6A与基板的内表面相接,并且在基板和板构件2之间设置有微小的缝隙。隔离构件6的上端部6A从板构件2的上表面2A稍微突出,其突出的高度为H2。通过使隔板构件6的下端部6B与孔5的底部5A相接,可以精确地控制隔离构件6的高度H2。
铆接部7是这样形成的:通过后述的铆接钻模10使边缘部5B通过塑性变形从而使边缘部5B的开口幅度D3小于隔离构件6的直径D1。即使板构件2加热并且膨胀,开口幅度D3的尺寸也不会超过板构件6的直径D1。
在图2所示的示例中,隔离配置部3还具有平坦的沉孔部8和截面为V形的槽9。沉孔部8设置成围绕孔5。槽9沿着铆接部7的外圆周设置。另外,沉孔部8及槽9不是必须的要素。在下列说明中,当铆接钻模10的刀头12A与板构件2的上表面2A相接触时,也包括铆接钻模10的刀头12A与沉孔部8相接触的情况。
[第1实施例]
下面参考图3至图6,对本发明的第1实施例的铆接钻模10进行说明。
图3为示出铆接钻模10安装在NC机床100时的透视图。在本实施例中,如图3所示,将第1方向(左右方向)定义为X,将第2方向(前后方向)定义为Y,将第3方向(垂直方向)定义为Z。Nc机床100配备有可以在第3方向Z上移动的主轴头101和可以在第1及第2方向X、Y上移动的工作台102。
主轴头101配备有可以旋转的主轴103。在主轴103上固定有铆接钻模10,并且使铆接钻模10的高度方向与第3方向Z一致。在铆接钻模10中,将固定于NC机床100侧的一端设为基端10A,将和基端10A相反侧的另一端设为顶端10B,并将靠近基端10A的一侧设为基端侧,靠近顶端10B的一侧设为顶端侧。
图4及图5为铆接钻模10的截面图,图4示出了突出构件13保持于突出位置P1的状态,图5示出了突出构件13保持于没入位置P2的状态。如图4所示,铆接钻模10配备有本体11,刃部12,突出构件13,推动构件14,以及根据需要使用的锁定装置15。
本体11形成为从铆接钻模10的基端10A延伸至刃部12的圆柱形。在图4所示的示例中,本体11具有内含有铆接钻模10的基端10A的盖部21,与盖部21相接的扩径部22,和与扩径部22相连的位于盖部21的相反侧的缩径部23。
盖部21为圆柱形,在靠近顶端的外圆周表面设有公螺纹21A。在与盖部21的基端10A相反侧的一面中形成有朝向基端10A的轴承凹孔21B。
扩径部22形成为与盖部21的直径相同的圆柱形,并且在靠近基端的内圆周表面设有母螺纹22A。母螺纹22A固定在盖部21的公螺纹21A上。内部空间24通过本体11的盖部21扩径部22被划分。内部空间24的基端侧封闭于盖部21,而其顶端侧逐渐变细并且经由缩径部23与外部连通。在内部空间21的靠近顶端处形成有倾斜面24A。
缩径部23形成为比扩径部22的直径小的圆柱形,并且与扩径部22和刃部12相连。
刃部12形成为铆接钻模10的顶端部,并且其形状为与本体11的缩径部23的直径相同的圆环形。刃部12的顶端侧具有V字形突出的刀头12A。当突出构件13位于没入位置P2(如图5所示)时,刀头12A与铆接钻模10的顶端10B重合。
除了盖部21之外的本体11和刃部12形成为整体构造物。本体11及刃部12的材质例如为与切削工具相同的金属或陶瓷等。
突出构件13形成为棒状并且内嵌于本体11内。突出构件13可以在如图4所示的突出位置P1和图5所示的没入位置P2之间移动。突出构件13具有顶端部31,轴部32,基端部33,肩部34和引导轴35。
在推动构件14位于突出位置P1时,顶端部31从本体11的刀头12A突出,当推动构件14位于没入位置P2时,没入于刀头12A内。顶端部31的顶端面的中央形成有朝向铆接钻模10的基端10A的凹部。当推动构件14位于突出位置P1时,顶端面31的顶端同与铆接钻模10的顶端10B重合。
轴部32形成为与顶端部31的直径相同的长形棒状。轴部32***于本体11的缩径部23内,并且连接顶端部31和基端部33。
基端部33形成为比轴部32的直径大。推动构件14在与轴部32相反的一侧与基端部33相接。基端部33中形成有靠近轴部32的肩部34。肩部34形成为连接轴部32的平滑的圆锥形。
引导轴35穿过推动构件14,并且从基端部33延伸至本体11的盖部21。引导轴35的另一侧固定于基端部33中。引导轴35的一端***于盖部21的轴承凹孔21B中。
在如图4所示的示例中,顶端部31,轴部32,基端部33以及肩部34的材质例如为PEEK树脂。可以使用不限于PEEK树脂的各种材料,只要具有优异的尺寸精度且不会损伤隔离构件6。顶端部31,轴部32,基端部33以及肩部34形成为整体构造物。引导轴35例如为金属。另外,也可以用PEEK树脂形成引导轴35,从而将整个顶端部31,轴部32,基端部33,肩部34以及引导轴35形成为整体构造物。
推动构件14由诸如螺旋弹簧或泡沫塑料等的弹性构件形成为圆柱形,并且收纳于本体11的内部空间24中。推动构件14的基端侧的端部14A支撑于本体11的盖部21上。顶端侧的端部14B与突出构件13的基端部33相接并且向铆接钻模10的顶端10B推动突出构件13。
本发明的铆接钻模10配备有可以将突出构件13锁定于本体的锁定装置15。如图5所示,锁定装置配备有锁定孔41和锁定销42。
锁定孔41形成于本体11的扩径部22中。锁定孔41位于垂直于本体11的中心轴的平面上,并且在不与中心轴相交的弦的位置处穿过本体11。在如图4所示的示例中,锁定孔41比倾斜面24A还要靠近基端侧。另外,锁定孔41也可以形成为含有倾斜面24的一部分。锁定销42形成为具有略小于锁定孔41的截面的棒状。
当锁定销42***于锁定孔41时,锁定销42被配置成横切内部空间24并且从顶端侧与突出构件13的肩部34相接。通过锁定孔41以及锁定销42,控制突出构件13向顶端侧的移动并锁定于本体11内。
当突出构件13通过锁定装置15锁定于本体11中时,突出构件13的顶端部31抵抗推动构件14的推动力保持在比本体11的刀头12A还要里面的没入位置P2。
下面参考图6至图11,对使用上述构成的铆接钻模10制造基板支撑装置1的本发明的制造方法进行说明。
在制造基板支撑装置1中,首先如图6所示,在板构件2的上表面2A处形成深度H1内径D2的孔5和沉孔部8(穿孔步骤)。在本实施例中,形成100个孔5。为了缩小孔5的底部5A和隔离构件6之间的缝隙,优选将底部5A设为半球形。另外,底部5A的形状也可以不限于半球形,也可以是平坦状或圆锥形。
准备和孔5的数量相同的隔离构件6,如图7所示,将隔离构件6分别***于孔5中(配置隔离步骤)。此时,有可能会发生***的隔离构件6的下端部6B与孔5的底部5A不接触,略微浮起来的情况。
接下来,将铆接钻模10安装于NC机床100的主轴103上。将接触传感器104载置于NC机床100的工作台102上。如图8所示,操作NC机床100,下降主轴头101,使安装于NC机床100的铆接钻模10的刀头12A与接触传感器104的上表面相接触。铆接钻模10的刀头12A和NC机床100的主轴头101的相对位置由接触传感器104测量,并且反映在NC机床100的第3方向Z的设定中(校正钻模位置步骤)。
此时,铆接钻模10的突出构件13保持在比刀头12A还要里面的没入位置P2中,缩回从而使突出构件13不干扰接触传感器104。一旦校正结束,锁定销42抽出,使铆接钻模10的突出构件13从刀头12A突出。
如图3所示,将在图7中所示的配置隔离步骤中准备好的板构件2固定于NC机床100的工作台102中,并且校正板构件2和工作台102之间的相对位置。在第1方向X及第2方向Y中移动工作台102,并且如图9所示,使固定于主轴103的铆接钻模10的中心轴与孔5以及隔离构件6的中心轴一致。下降主轴头101,使铆接钻模10靠近板构件2的上表面2A。
接下来,首先使突出构件13的顶端部31与隔离构件6相接。突出构件13将隔离构件6向下推直至隔离构件6的下端部6B与孔5的底部5A相接(校正隔离位置步骤)。当进一步下降主轴头101时,如图10所示,突出构件13便会抵抗推动构件14的推动力没入本体11中,并且刀头12A靠近板构件2。
最终,V字形的刀头12A嵌入板构件2中并且使孔5的边缘部5B塑性变形。当NC机床100的主轴头101沿着第3方向Z下降到预定位置时,刀头12A形成具有预定深度的槽9(铆接步骤)。
在这种状态下,孔5中形成有防止隔离构件6脱离的铆接部7。隔离构件6的上端部6A从板构件2的上表面2A稍微突出,其突出的高度为H2。
图12为根据本发明的制造方法制造的基板支撑装置1而计算出的球直径的示意图。图13为根据使用不配备有突出构件13的铆接钻模而制造的作为对照例的基板支撑装置,计算出的球直径的示意图。
在图13的作为对照例的制造方法中,省略了图9及图10所示的校正隔离位置的步骤。另外,在图7所示的配置隔离步骤后,为了使隔离构件6与孔5的底部5A相接,进行了手动按压隔离构件6。
图12及图13的横轴表示从板构件2的外圆周向中心以螺旋形状计数的第1至第100个隔离配置部3。纵轴表示针对第1至第100个隔离配置部3,在基于事先测定的孔5的深度H1的基础上,加上隔离构件6的上端部6A的高度H2而计算出的球直径。如果隔离构件6的下端部6B与孔5的底部5B相接,则计算出的球直径等于隔离构件6的直径2.000mm。
在对照例的制造方法中,如图13所示,隔离构件6的上端部6A的高度H2相对于孔5的深度H1,在0~0.026mm的范围内幅动。另一方面,在本发明的制造方法中,如图12所示,隔离构件6的上端部6A的高度H2相对于孔5的深度H1,在0~0.008mm的范围内幅动。
根据本发明,隔离构件6的上端部的高度H2的振动幅度控制在对照例1/3以下。也就是说,隔离构件6的上端部忠实于孔5的深度H1,突出于板构件2的上表面2A。
通过上述结构的铆接钻模10以及使用该铆接钻模10的制造方法,由于铆接钻模俱备突出构件13,因此可以在通过突出构件13校正隔离构件6与孔5的底部5A相接的位置的同时使孔5的边缘部5B塑性变形。因此,如图12所示,可以在忠实于孔5的深度H1的形状下,使隔离构件6的上端部6A突出。
但是,也可以如对照例的制造方法,不使用铆接钻模10的突出构件13,而是用操作者的手按压隔离构件6如隔离构件6的下端部6B与孔5的底部5A相接。但是,如果隔离构件6既小又轻,那么操作者的手接触时,会发生隔离构件6从未形成铆接部7的孔5脱离遗失的情况。此外,如果隔离构件6像在本实施例中使用的蓝宝石一样是透明的话,则不能在视觉上确认是否存在隔离构件6。
万一在孔5中未收纳隔离构件6的状态下形成铆接部7的话,那么基板支撑装置1就会变为不良品。由于形成如图11的铆接部7的孔5的边缘部5B的塑性变形是不可逆的,因此无法再次利用并更换铆接失败的基板支撑装置1的不合格地方。导致基板支撑装置1整个都不能使用。
根据本实施例的话,可以不通过操作者的手而准确地使隔离构件6的下端部6B与孔5的底部5A相接。因此,可以控制基板支撑装置1的不良品产生。而且,可以减少基他操作者检查由于操作者手误导致的错误的工时数。其结果是,可以削减成本。
在本实施例中,铆接钻模10俱备有锁定装置15。由于突出构件13可以在通过锁定装置15保持在没入位置P2的同时安装在NC机床上,因此可以在突出构件13缩回到缩回位置P2的情况下校正刃部12的刀头12A的高度而应用NC机床。由于应用NC机床使孔5的边缘部5B可塑性变形,因此可以形成具有优异的尺寸精度的铆接部7。
根据兼具有突出构件13以及锁定装置15的本实施例,由于可以通过突出构件13校正隔离构件6的高度位置的同时应用NC机床使孔5的边缘部5B可塑性变形,因此可以使隔离构件6的上端部6A的高度H2变得均匀。
而且,在本实施例中,锁定装置15为组合锁定孔41和锁定销42的简易结构,因此可以控制铆接钻模10的成本。由于在拔插锁定销42时不需要打开盖部21的公螺纹21A,因此从铆接钻模10的基端10A至刀头12A的尺寸不变。锁定孔41设于本体11中并且锁定销42不从基端10A或刀头12A突出,因此不会构成在第3方向Z上校正铆接钻模10的尺寸的障碍。
在本实施例中,突出构件13形成为比隔离构件6还要软柔的材料。在如图10所示的突出构件13的顶端部31中即使按压隔离构件,也不会损伤隔离构件6的上端部6A。
在本实施例中,顶端部31形成有朝向基端侧的凹部。即使用突出构件13按压隔离构件6,由于突出构件13的顶端部31不直接与隔离构件6的上端部6A接触,因此不会损伤隔离构件6的上端部6A。
图14和图15示出了上述制造方法的变形例,图14为穿孔步骤,图15示出了铆接步骤。
在变形例中,在如图14所示的穿孔步骤中,形成去肉部8A而不是沉孔部8。去肉部8A形成于孔5的边缘部5B的周围,并且比在如图5所示的铆接步骤中刀头12A下降的位置更深。
即使是变形例,也可以使用本实施例的铆接钻模10制造基板支撑装置1。而且,在变形例中,通过比刀头12A更深的去肉部8A不需要形成槽9,因此可以使边缘部5B相比本实施例更容易塑性变形。因此,即使板构件2是硬金属,也可以在不对NC机床或铆接钻模10的刀头12A施加过大的负荷的情况下形成铆接部7。
下面对第2至第4实施例的铆接钻模以及使用该铆接钻模的制造方法进行说明。此外,对于和第1实施例的铆接钻模相同的结构或者具有类似的功能的结构,附加了相同的标记,请参考相对应的第1实施例的描述,在这里将省略说明。另外,下列未说明的结构,为与第1实施例相同的结构。
[第2实施例]
下面参考图16,对第2实施例进行说明。第2实施例与第1实施例的不同之处在于,铆接钻模10包括连接到突出构件13的载荷传感器。
在第2实施例中,通过荷重传感器51检测抵抗推动构件14的推动力施加于突出构件13上的荷重。
由于突出构件13的顶端部31比刃部12的刀头12A还要突出,所以在如图10所示的当隔离构件6在孔5内时,先是突出构件13接触隔离构件6而不是刀头12A接触板构件2的上表面,并且在荷重传感器51上检测荷重。
另一方面,当隔离构件6如图16所示未容纳于孔5中时,在荷重传感器51上检测不到荷重。可以通过是否在荷重传感器51上检测到荷重来检测得知隔离构件6是否容纳于孔5中。在如图10所示的校正隔离位置的步骤中,当NC机床100的主轴头101下降到在第3方向Z的预定位置时,通过荷重传感器51检查隔离构件6是否容纳于孔5中,并且可以不进行如图11所示的铆接步骤中断铆接钻模10的下降。预定位置的一例,可以是如图10所示的突出构件13的顶端部31已经接触隔离构件6的上端部6A的位置并且刀头12A还未与板构件2的上表面接触。由于铆接部7的形成是不可逆的,因此如果失败的话无法再次利用损失变大,但是如果根据第2实施例的话,通过荷重传感器51,可以防止由于铆接部7的形成失败而造成的损失。
[第3实施例]
下面参考图17,对第3实施例进行说明。第3实施例与第1实施例的不同之处在于,铆接钻模10配备有真空源52以及真空度传感器53。
在第3实施例中,突出构件13具有贯穿顶端部31至引导轴35的贯穿孔54。引导轴35与贯穿本体11的盖部21并且配置于本体11外部的真空源52相连。在连接真空源52和突出构件13的路径中,连接有真空度传感器53。真空度传感器53检测贯通孔54内部的真空度。
通过第3实施例,由于突出构件13与真空源52相连,因此可以将隔离构件6吸附于突出构件13的顶端部31。如果在吸附隔离构件6的状态下运行NC机床100的主轴头101以及工作台102的话,可以将隔离构件6传输至板构件2的任意隔离配置3中。通过将隔离配置部3的位置输入NC机床100,可以自动将隔离构件6传送至隔离配置部3的孔5中。
而且,由于是将吸附着的隔离构件6送入孔5中,因此和NC机床100的主轴头101下降的动作是连续的,如果保持这样的状态将主轴头101下降到如图11的状态的话,那么在传送隔离构件6的同时可以形成铆接部7。也就是说,可以省略如图7所示的配置隔离的步骤。
如果吸附于突出构件13的隔离构件6在传送过程中掉落的话,可以通过连接于突出构件13和真空源52之间的路径的真空度传感器53检测得知。此时,和第2实施例相同,可以在未形成铆接部7的状态下停止装置,从而防止由于铆接部7的形成失败而引起的损失。
[第4实施例]
下面参考图18,对第4实施例进行说明。第4实施例与第1实施例的不同之处在于,铆接钻模10配备有光传感器55。
在第4实施例中,和第3实施例相同的是,突出构件13上形成有贯穿突出构件13的顶端部31至引导轴35的贯穿孔54。光传感器55用于通过贯通孔54检测光在突出构件13的顶端部31的延长部分上的反射率。
根据第4实施例,可以通过光传感器55检测顶端部31的延长部分上是否存在隔离构件6。因此,和第2及第3实施例相同,可以防止由于铆接部7的形成失败而引起的损失。
虽然已经对本发明的几个实施例进行了说明,但是这些实施例只是作为示例进行提示,而不旨在限制发明的范围。这些新颖的实施例也可以通过其他各种各样的形式进行实施,只要在不脱离本发明的主旨的范围内,可以进行各种省略、置换、变更。这些实施例或变形例,在包含于本发明的范围或主旨的同时,也包含于权利要求范围中记载的发明及其同等范围内。
例如,虽然将刃部构造成了连接环形状,但是也可以多个(例如3个刀头构造成排列成等间距的环状。在这种情况下,根据刀头的形状,可以将边缘部形成为不连续的环状。虽然将突出构件的肩部构造成与轴部连接的平滑圆锥形,但是也可以是从轴部沿径向突出的凸缘或突起。
Claims (9)
1.一种铆接钻模,其使形成于金属制的板构件的平坦的上表面中的孔的边缘部塑性变形,从而将收容于所述孔内的隔离构件固定于该隔离构件的上端部从所述上表面突出预定高度的位置,包括:
本体,呈圆柱形;
刃部,所述刃部设于所述本体的顶端,并且所述刃部的刀头呈V字形突出;
突出构件,所述突出构件内嵌于所述本体内;
推动构件,所述推动构件用于向从所述刃部突出的方向推动所述突出构件;
锁定装置,所述锁定装置用于将突出构件锁定于所述本体上;
其特征在于,
在未通过所述锁定装置锁定的状态下,所述突出构件通过所述推动构件的推动力保持在其顶端部从所述刀头突出的突出位置;
在通过所述锁定装置锁定的状态下,所述突出构件抵抗推动构件的推动力保持在其顶端部没入比刀头还要里面的没入位置上。
2.根据权利要求1所述的铆接钻模,其特征在于,
所述突出构件还具有肩部,所述肩部的直径比所述顶端部的直径还要大;
所述锁定装置具有锁定孔和锁定销;
所述锁定孔形成于所述本体中,位于和所述本体的中心轴垂直的平面上并且在不与该中心轴相交的弦的位置中贯穿所述本体;
所述锁定销***于所述锁定孔中,并且从与所述推动构件推动所述突出构件的方向相反的一侧抵靠所述突出构件的所述肩部。
3.根据权利要求1所述的铆接钻模,其特征在于,所述突出构件的所述顶端部具有朝向基端的凹部。
4.根据权利要求1所述的铆接钻模,其特征在于,所述铆接钻模还具有荷重传感器,所述荷重传感器用以检测抵抗所述推动构件的推动力施加于所述突出构件的荷重;通过所述荷重传感器可以检测所述突出构件是否与所述隔离构件接触。
5.根据权利要求1所述的铆接钻模,其特征在于,所述铆接钻模还具有连接所述突出构件的真空源;所述突出构件具有贯通顶端至基端的贯通孔,所述真空源用于通过贯通孔将所述隔离构件吸附于所述顶端部上。
6.根据权利要求5所述的铆接钻模,其特征在于,所述铆接钻模还具有测定所述贯通孔真空度的真空度传感器;通过所述真空度传感器,可以检测所述隔离构件是否吸附于所述顶端部上。
7.根据权利要求1所述的铆接钻模,其特征在于,所述铆接钻模还具有连接所述突出构件的光传感器;所述突出构件具有贯通顶端至基端的贯通孔,所述光传感器通过经由所述贯通孔检测反射率,可以检测得知所述隔离构件是否配置于所述顶端部的延长部分上。
8.一种基板支撑装置的制造方法,其特征在于,包括:
穿孔步骤,在所述穿孔步骤中,在金属制的板构件的平坦的上表面上形成多个孔;
配置隔离步骤,在所述配置隔离步骤中,在所述孔中分别***隔离构件;
安装钻模步骤,在所述安装钻模步骤中,将配备有刃部和向从所述刃部突出的方向被施力的突出构件的铆接钻模安装于NC机床中;
校正钻模位置的步骤,在所述校正钻模位置的步骤中,将所述突出构件保持在没入比所述刃部还要里面的位置的状态下校正所述刃部的高度,然后在所述NC机床中设置预定的铆接位置;
校正隔离位置的步骤,在所述校正隔离位置的步骤中,在使所述突出构件从所述刃部突出的状态下,下降所述铆接钻模,通过所述突出构件按压所述隔离构件并使所述隔离构件与所述孔的底部相接触;
铆接步骤,在所述铆接步骤中,抵抗所述突出构件的推动力使所述刃部进一步下降到所述铆接位置,通过所述刃部使所述孔的边缘部塑性变形从而固定所述隔离构件。
9.根据权利要求8所述的基板支撑装置的制造方法,其特征在于,在所述校正隔离位置的步骤中,检测所述隔离构件是否容纳于所述孔中,并且当所述隔离构件未容纳于孔中时,在不进行所述铆接步骤的状态下中断所述铆接钻模下降。
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US11052455B2 (en) | 2021-07-06 |
KR20180104076A (ko) | 2018-09-19 |
EP3421150A4 (en) | 2019-10-16 |
US20180361464A1 (en) | 2018-12-20 |
CN108698108A (zh) | 2018-10-23 |
TW201733706A (zh) | 2017-10-01 |
EP3421150B1 (en) | 2021-01-06 |
EP3421150A1 (en) | 2019-01-02 |
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