JP6487122B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP6487122B2
JP6487122B2 JP2018523895A JP2018523895A JP6487122B2 JP 6487122 B2 JP6487122 B2 JP 6487122B2 JP 2018523895 A JP2018523895 A JP 2018523895A JP 2018523895 A JP2018523895 A JP 2018523895A JP 6487122 B2 JP6487122 B2 JP 6487122B2
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wire
solder layer
semiconductor device
power semiconductor
conductor layer
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Japanese (ja)
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JPWO2017217369A1 (ja
Inventor
辰則 柳本
辰則 柳本
晋助 浅田
晋助 浅田
耕一 東久保
耕一 東久保
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H01L2924/00012—Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
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JP2022031611A (ja) * 2018-11-09 2022-02-22 住友電気工業株式会社 半導体装置
WO2020116306A1 (ja) * 2018-12-04 2020-06-11 株式会社クラレ 高電圧用回路基板およびそれを用いた高電圧デバイス
EP3675190B1 (de) 2018-12-25 2023-05-03 Nichia Corporation Verfahren zur herstellung einer lichtquellenvorrichtung und lichtquellenvorrichtung
CN113711349A (zh) * 2019-04-25 2021-11-26 京瓷株式会社 发光元件搭载用基板以及发光装置
JP7282048B2 (ja) * 2020-02-12 2023-05-26 三菱電機株式会社 電力用半導体装置およびその製造方法
KR20210129483A (ko) * 2020-04-20 2021-10-28 현대자동차주식회사 솔더링 구조, 이를 갖는 파워 모듈 및 파워 모듈의 제조 방법
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JP6983187B2 (ja) 2021-12-17
CN115274465A (zh) 2022-11-01
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CN109314063A (zh) 2019-02-05
DE112017002961B4 (de) 2022-06-09

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