JP6346170B2 - 仮固定用両面粘着テープ - Google Patents

仮固定用両面粘着テープ Download PDF

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Publication number
JP6346170B2
JP6346170B2 JP2015510025A JP2015510025A JP6346170B2 JP 6346170 B2 JP6346170 B2 JP 6346170B2 JP 2015510025 A JP2015510025 A JP 2015510025A JP 2015510025 A JP2015510025 A JP 2015510025A JP 6346170 B2 JP6346170 B2 JP 6346170B2
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Japan
Prior art keywords
sensitive adhesive
pressure
adhesive layer
double
crystalline polymer
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Active
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JP2015510025A
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English (en)
Japanese (ja)
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JPWO2014162943A1 (ja
Inventor
正芳 山本
正芳 山本
伸一郎 河原
伸一郎 河原
山田　博行
博行 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta Corp
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Nitta Corp
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Publication of JPWO2014162943A1 publication Critical patent/JPWO2014162943A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
JP2015510025A 2013-04-05 2014-03-26 仮固定用両面粘着テープ Active JP6346170B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013079354 2013-04-05
JP2013079354 2013-04-05
PCT/JP2014/058477 WO2014162943A1 (ja) 2013-04-05 2014-03-26 仮固定用両面粘着テープおよびそれを用いた被加工物の仮固定方法

Publications (2)

Publication Number Publication Date
JPWO2014162943A1 JPWO2014162943A1 (ja) 2017-02-16
JP6346170B2 true JP6346170B2 (ja) 2018-06-20

Family

ID=51658241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015510025A Active JP6346170B2 (ja) 2013-04-05 2014-03-26 仮固定用両面粘着テープ

Country Status (5)

Country Link
JP (1) JP6346170B2 (ko)
KR (1) KR102195502B1 (ko)
CN (1) CN105073932B (ko)
TW (1) TWI636112B (ko)
WO (1) WO2014162943A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11837119B2 (en) 2019-11-20 2023-12-05 Lg Display Co., Ltd Display device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6460367B2 (ja) * 2014-03-26 2019-01-30 ニッタ株式会社 仮固定用両面粘着テープおよびそれを用いた被加工物の仮固定方法
JP6390366B2 (ja) * 2014-11-13 2018-09-19 東洋インキＳｃホールディングス株式会社 粘着剤組成物、その製造方法、粘着テープ
JP2016199725A (ja) * 2015-04-14 2016-12-01 ニッタ株式会社 セラミック電子部品製造用の感温性粘着シートおよびセラミック電子部品の製造方法
WO2017187800A1 (ja) * 2016-04-26 2017-11-02 日東電工株式会社 造形ステージ用粘着シートおよび積層造形装置
JP6967908B2 (ja) * 2016-09-09 2021-11-17 ニッタ株式会社 感温性粘着シートおよびこれを用いるウエハの製造方法
US9909035B1 (en) * 2017-09-29 2018-03-06 Mayapple Baby Llc Mountable articles, dual-adhesive-adhesive tape and mounting methods using them
CN108559425B (zh) * 2018-05-11 2020-01-17 华南协同创新研究院 一种防fdm打印器件翘曲的无溶剂型胶黏剂、打印平台及其制作方法
KR102381023B1 (ko) * 2020-05-28 2022-03-31 주식회사 휴먼텍 발포층을 포함하는 점착 필름

Family Cites Families (20)

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JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPH0669324A (ja) 1992-08-21 1994-03-11 Hitachi Electron Eng Co Ltd 薄膜部品の仮固定方法
US5889118A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Thermomorphic "smart" pressure sensitive adhesives
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP4391623B2 (ja) * 1999-06-10 2009-12-24 ニッタ株式会社 セラミック電子部品用生シートの仮止め粘着テープ及びセラミック電子部品の製造方法
JP2002088320A (ja) * 2000-09-13 2002-03-27 Sliontec Corp 加熱剥離型粘着テープ・シート及びその製造方法
JP5097336B2 (ja) * 2005-03-07 2012-12-12 ニッタ株式会社 積層セラミック電子部品の製造方法
JP2007284666A (ja) * 2006-03-20 2007-11-01 Furukawa Electric Co Ltd:The 加熱剥離性粘着テープ
JP5074716B2 (ja) 2006-07-03 2012-11-14 ニッタ株式会社 粘着シート
JP5074715B2 (ja) * 2006-07-03 2012-11-14 ニッタ株式会社 粘着シート
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP2008115272A (ja) * 2006-11-04 2008-05-22 Nitto Denko Corp 熱剥離性両面粘着シート及び被加工体の加工方法
US7691225B2 (en) * 2007-01-15 2010-04-06 Nitto Denko Corporation Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend
JP5379453B2 (ja) 2008-11-21 2013-12-25 ニッタ株式会社 感温性粘着テープおよびこれを用いたチップ型電子部品の製造方法
KR20100096031A (ko) * 2009-02-23 2010-09-01 닛토덴코 가부시키가이샤 적층 세라믹 시트 절단용 열박리형 점착 시트 및 적층 세라믹 시트의 절단 가공 방법
JP5564209B2 (ja) * 2009-07-13 2014-07-30 ニッタ株式会社 エッチング加工用保護テープおよびエッチング加工方法
JP2011037944A (ja) * 2009-08-07 2011-02-24 Nitta Corp 感温性粘着剤および感温性粘着テープ
JP5623125B2 (ja) * 2010-05-07 2014-11-12 ニッタ株式会社 粘着シート
JP5174217B2 (ja) * 2010-06-10 2013-04-03 公立大学法人大阪市立大学 易解体性粘着剤組成物及び易解体性粘着テープ
JP2012149182A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11837119B2 (en) 2019-11-20 2023-12-05 Lg Display Co., Ltd Display device

Also Published As

Publication number Publication date
KR20150141929A (ko) 2015-12-21
JPWO2014162943A1 (ja) 2017-02-16
TW201502232A (zh) 2015-01-16
CN105073932A (zh) 2015-11-18
CN105073932B (zh) 2017-09-22
WO2014162943A1 (ja) 2014-10-09
TWI636112B (zh) 2018-09-21
KR102195502B1 (ko) 2020-12-28

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