JP6317785B2 - 基板ホルダ及び基板ホルダ製造方法 - Google Patents
基板ホルダ及び基板ホルダ製造方法 Download PDFInfo
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- JP6317785B2 JP6317785B2 JP2016121468A JP2016121468A JP6317785B2 JP 6317785 B2 JP6317785 B2 JP 6317785B2 JP 2016121468 A JP2016121468 A JP 2016121468A JP 2016121468 A JP2016121468 A JP 2016121468A JP 6317785 B2 JP6317785 B2 JP 6317785B2
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- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Composite Materials (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Magnetic Heads (AREA)
Description
[0001] 本出願は、2012年2月3日出願の米国仮出願第61/594,857号、2012年4月9日出願の米国仮出願第61/621,648号及び2012年4月9日出願の米国仮出願第61/621,660号の利益を主張し、その全体を参照により本明細書に組み込むものとする。
[0031] −放射ビームB(例えばUV放射、DUV放射又はEUV放射)を調節するように構成された照明システム(イルミネータ)ILと、
[0032] −パターニングデバイス(例えばマスク)MAを支持するように構築され、特定のパラメータに従ってパターニングデバイスを正確に位置決めするように構成された第1のポジショナPMに接続された支持構造(例えばマスクテーブル)MTと、
[0033] −基板(例えばレジストコートウェーハ)Wを保持するように構築され、特定のパラメータに従って基板を正確に位置決めするように構成された第2のポジショナPWに接続された基板テーブル(例えばウェーハテーブル)WTと、
[0034] −パターニングデバイスMAによって放射ビームBに与えられたパターンを基板Wの目標部分C(例えば1つ以上のダイを含む)に投影するように構成された投影システム(例えば屈折投影レンズシステム)PSと、を備える。
−放射ビームB(例えばEUV放射)を調節するように構成された照明システム(イルミネータ)EILと、
−パターニングデバイス(例えばマスク又はレチクル)MAを支持するように構築され、パターニングデバイスを正確に位置決めするように構成された第1のポジショナPMに接続された支持構造(例えばマスクテーブル)MTと、
−基板(例えばレジストコートウェーハ)Wを保持するように構築され、基板を正確に位置決めするように構成された第2のポジショナPWに接続された基板テーブル(例えばウェーハテーブル)WTと、
−パターニングデバイスMAによって放射ビームBに与えられたパターンを基板Wのターゲット部分C(例えば1つ以上のダイを含む)に投影するように構成された投影システム(例えば反射投影システム)PSと、を備える。
Claims (14)
- リソグラフィ装置で使用するオブジェクトホルダの補修方法であって、前記オブジェクトホルダはオブジェクトを支持する複数のバールと粗い上面を有する少なくとも1つの損傷したバールとを有し、前記方法は、
平滑な表面を提供するように前記損傷したバールの前記粗い上面を研削するステップと、
前記平滑な表面の高さが前記複数のバールの高さよりも高くなるように前記平滑な表面の上部に層を追加するステップと、
前記損傷したバールの元の形状及び/又は高さに前記損傷したバールを再構築するステップと、を含み、
前記損傷したバールの前記粗い上面を研削するステップの間に前記複数のバールを覆うように、一時的な保護コーティングを提供するステップをさらに含む、方法。 - 前記平滑な表面の上部に前記層を追加するステップは、レーザ焼結を含む、請求項1に記載の方法。
- 前記レーザ焼結が、
前記平滑な表面の上部に粉末の層を塗布するステップと、
前記粉末の層を放射ビームで選択的に照射し、照射した場所の前記粉末を少なくとも部分的に溶融させるステップと、
を含む、請求項2に記載の方法。 - 前記レーザ焼結が、
前記平滑な表面上のある場所を照射するステップと、
前記照射した場所に粉末を噴射するステップと、
を含む、請求項2に記載の方法。 - 前記損傷したバールを再構築するステップは、レーザ焼結を含む、請求項1〜4のいずれか一項に記載の方法。
- 前記損傷したバールを再構築するステップは、前記複数のバールの前記高さに合ったレベルに前記損傷したバールを研磨することをさらに含む、請求項1〜5のいずれか一項に記載の方法。
- 前記平滑な表面を洗浄及び/又は事前処理するステップをさらに含む、請求項1〜6のいずれか一項に記載の方法。
- 前記平滑な表面は、オゾンで洗浄される、請求項7に記載の方法。
- 前記平滑な表面は、プライマーの塗布により事前処理される、請求項7又は8に記載の方法。
- 前記補修されたバールが、Ti、Si、溶融石英、コージェライト、ダイヤモンドライクカーボン、SiC、SiO2、AIN、TiN及びCrNからなる群から選択した少なくとも1つの材料を含む、請求項1〜9のいずれか一項に記載の方法。
- 前記補修されたバールが、マトリクス材料及び前記マトリクス材料内に埋込まれた粒子から形成される、請求項1〜10のいずれか一項に記載の方法。
- 前記補修されたバールが、第1の材料の第1の層と、前記第1の材料とは異なる第2の材料の第2の層と、を含む、請求項1〜11のいずれか一項に記載の方法。
- 前記第1及び第2の材料は、特性又は成分が異なる、請求項12に記載の方法。
- 前記オブジェクトが、基板又はパターニングデバイスである、請求項1〜13のいずれか一項に記載の方法。
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