JP5774968B2 - 部品移載装置および部品移載装置における吸着位置調整方法 - Google Patents

部品移載装置および部品移載装置における吸着位置調整方法 Download PDF

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Publication number
JP5774968B2
JP5774968B2 JP2011250001A JP2011250001A JP5774968B2 JP 5774968 B2 JP5774968 B2 JP 5774968B2 JP 2011250001 A JP2011250001 A JP 2011250001A JP 2011250001 A JP2011250001 A JP 2011250001A JP 5774968 B2 JP5774968 B2 JP 5774968B2
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Japan
Prior art keywords
wafer
head
component
take
push
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JP2011250001A
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English (en)
Japanese (ja)
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JP2013105959A (ja
Inventor
鈴木　康弘
康弘 鈴木
保佳 本樫
保佳 本樫
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2011250001A priority Critical patent/JP5774968B2/ja
Priority to US13/535,209 priority patent/US10103041B2/en
Priority to KR1020120080019A priority patent/KR101431572B1/ko
Publication of JP2013105959A publication Critical patent/JP2013105959A/ja
Application granted granted Critical
Publication of JP5774968B2 publication Critical patent/JP5774968B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011250001A 2011-11-15 2011-11-15 部品移載装置および部品移載装置における吸着位置調整方法 Active JP5774968B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011250001A JP5774968B2 (ja) 2011-11-15 2011-11-15 部品移載装置および部品移載装置における吸着位置調整方法
US13/535,209 US10103041B2 (en) 2011-11-15 2012-06-27 Component transfer apparatus and suction position adjustment method for component transfer apparatus
KR1020120080019A KR101431572B1 (ko) 2011-11-15 2012-07-23 부품 이송장치 및 부품 이송장치에 있어서의 흡착 위치 조정방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011250001A JP5774968B2 (ja) 2011-11-15 2011-11-15 部品移載装置および部品移載装置における吸着位置調整方法

Publications (2)

Publication Number Publication Date
JP2013105959A JP2013105959A (ja) 2013-05-30
JP5774968B2 true JP5774968B2 (ja) 2015-09-09

Family

ID=48280256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011250001A Active JP5774968B2 (ja) 2011-11-15 2011-11-15 部品移載装置および部品移載装置における吸着位置調整方法

Country Status (3)

Country Link
US (1) US10103041B2 (ko)
JP (1) JP5774968B2 (ko)
KR (1) KR101431572B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107535089B (zh) * 2015-05-25 2019-10-01 株式会社富士 元件安装机
DE102015112518B3 (de) * 2015-07-30 2016-12-01 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips
KR102140520B1 (ko) * 2015-12-10 2020-08-03 한화정밀기계 주식회사 최적 노즐 및 스피드 선정 장치
JP6781677B2 (ja) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
US11343948B2 (en) * 2018-03-13 2022-05-24 Fuji Corporation Mounting device and mounting method
CN111863690B (zh) * 2019-04-29 2023-10-20 成都辰显光电有限公司 批量转移头及其加工方法
WO2021157077A1 (ja) * 2020-02-07 2021-08-12 株式会社Ｆｕｊｉ 吸着位置調整装置
CN112103210B (zh) * 2020-08-13 2023-03-31 上饶市广丰时代科技有限公司 一种用于半导体芯片封装的芯片粘接工艺设备
KR102617398B1 (ko) 2020-08-13 2023-12-26 세메스 주식회사 기판 반송 장치, 기판 처리 장치 및 기판 반송 방법
CN112718395B (zh) * 2020-12-29 2021-10-26 深圳宝创电子设备有限公司 一种hp-x3全自动镜头芯片贴装机
CN113394154B (zh) * 2021-05-18 2022-08-19 桂林芯飞光电子科技有限公司 一种用于探测器芯片的吸取装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2991593B2 (ja) * 1993-08-19 1999-12-20 株式会社東京精密 ダイシング装置の半導体ウェハ形状認識装置
JP2002118153A (ja) * 2000-10-11 2002-04-19 Toshiba Corp 電子部品の製造方法及び実装装置
JP2003059955A (ja) 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP4264694B2 (ja) 2002-05-09 2009-05-20 ソニー株式会社 固体カメラ及びこれを用いた部品実装装置
JP2004103923A (ja) 2002-09-11 2004-04-02 Tdk Corp 電子部品の実装装置および実装方法
WO2006025386A1 (ja) * 2004-08-31 2006-03-09 Nikon Corporation 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
JP4016982B2 (ja) 2004-11-18 2007-12-05 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4386007B2 (ja) * 2005-07-07 2009-12-16 パナソニック株式会社 部品実装装置および部品実装方法
JP4828356B2 (ja) * 2006-08-29 2011-11-30 ヤマハ発動機株式会社 電子部品取出装置、表面実装機、および電子部品取り出し方法
CN101689512B (zh) * 2007-06-28 2012-04-04 雅马哈发动机株式会社 元件移载装置
JP4762209B2 (ja) 2007-07-25 2011-08-31 大日本スクリーン製造株式会社 基板検出装置および基板処理装置
CN101884089B (zh) * 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装***
JP5543960B2 (ja) * 2009-03-23 2014-07-09 東レエンジニアリング株式会社 実装装置および実装方法
JP2011018734A (ja) * 2009-07-08 2011-01-27 Nidec Tosok Corp ダイボンダ

Also Published As

Publication number Publication date
JP2013105959A (ja) 2013-05-30
KR20130054119A (ko) 2013-05-24
US10103041B2 (en) 2018-10-16
KR101431572B1 (ko) 2014-08-20
US20130120554A1 (en) 2013-05-16

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