WO2015097865A1 - 部品実装装置、部品実装方法 - Google Patents
部品実装装置、部品実装方法 Download PDFInfo
- Publication number
- WO2015097865A1 WO2015097865A1 PCT/JP2013/085123 JP2013085123W WO2015097865A1 WO 2015097865 A1 WO2015097865 A1 WO 2015097865A1 JP 2013085123 W JP2013085123 W JP 2013085123W WO 2015097865 A1 WO2015097865 A1 WO 2015097865A1
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- WIPO (PCT)
- Prior art keywords
- tray
- component
- camera
- imaging
- component mounting
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Definitions
- the present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate by picking up the component from the tray drawn from the tray holding portion to the supply position and moving it to the substrate.
- Patent Document 1 discloses a component mounting apparatus (automatic mounting apparatus) that includes a chuck for gripping an electronic component and mounts the electronic component on the substrate by gripping the electronic component accommodated in the tray by the chuck and moving it to the substrate.
- a rack for holding a plurality of trays is attached to this apparatus. After a tray for storing electronic components corresponding to a board is pulled out from the rack to a supply position, the electronic components stored in the tray at the supply position are chucked.
- this apparatus is provided with a camera that takes an image of the electronic component gripped by the chuck, and determines the quality of the electronic component based on an image output from the camera.
- Patent Document 2 discloses a technique in which a plurality of parts are dispersed with a robot hand, and parts selected from these parts are gripped with the robot hand and carried. At this time, the state (position and orientation) of the component is recognized from an image obtained by photographing the dispersed component with the camera, and the component to be grasped is selected based on the result.
- the state of the component in the tray can be imaged in advance.
- the state of the component picked up from the tray by the chuck can be captured from the image of the camera, but there is no particular configuration for capturing the state of the component in the tray. Therefore, it is conceivable to apply the technique of Patent Document 2 to configure the component mounting apparatus so that the state of the component in the tray can be imaged.
- the component mounting apparatus is provided with a head (chuck in Patent Document 1) that picks up components from the tray at the supply position. Therefore, there is a possibility that the head located near the supply position in preparation for picking up the components may interfere with imaging of the state of the components in the tray.
- the present invention has been made in view of the above problems, and in a component mounting apparatus and a component mounting method for picking up a component from a tray drawn from a tray holding portion to a supply position by a head and moving it to a substrate, the component mounting method is located near the supply position. It is an object of the present invention to provide a technique capable of appropriately capturing an image of a state of a component in a tray while suppressing interference of a head that performs the operation.
- a component mounting apparatus transports a tray from a tray holding unit that holds a tray in which components are stored to a supply position, and the tray transport unit transports the tray.
- a camera that images the state of the component in the tray at an imaging position between the tray holding unit and the supply position in the conveyance path, and a head that picks up the component housed in the tray conveyed to the supply position and moves to the substrate I have.
- a component mounting method includes a step of removing a tray from a tray holding unit that holds a tray in which the component is stored and transporting the tray to an imaging position, and a state of the component in the tray at the imaging position. And a step of transporting the tray from the imaging position to the supply position, and a step of picking up the components housed in the tray transported to the supply position by the head and moving them to the substrate.
- the head picks up the component from the tray conveyed from the tray holding portion to the supply position and moves to the substrate.
- the head located in the vicinity of the supply position interferes with the imaging of the state of the component in the tray (that is, it is reflected or becomes a shadow).
- imaging of the state of the components in the tray is executed at an imaging position in the middle from the tray holding unit to the supply position. Therefore, such component imaging can be executed at an imaging position that is out of the head located in the vicinity of the supply position. As a result, it is possible to appropriately image the state of the components in the tray while suppressing interference between the heads located in the vicinity of the supply position.
- the component mounting apparatus may be configured such that the camera is disposed at a position different from the supply position in a direction parallel to the transport path as viewed from a direction perpendicular to the transport direction of the tray.
- Such a configuration is suitable because the camera can be arranged while avoiding contact with the head located in the vicinity of the supply position.
- the component mounting apparatus may be configured so as to further include a moving frame that moves with the head, and the camera is disposed outside the movable range of the moving frame. Such a configuration can prevent the camera from coming into contact with the moving frame, which is preferable.
- the movable range overlaps with the imaging position when viewed from above the conveyance path, and the camera is on the opposite side of the imaging position with respect to the movable range when viewed from a direction parallel to the tray conveyance direction.
- You may comprise a component mounting apparatus so that it may be arrange
- the movable range of the moving frame and the imaging position are overlapped when viewed from above the conveyance path, and thus the apparatus can be miniaturized in a direction parallel to the conveyance path.
- the camera is disposed on the side opposite to the imaging position with respect to the movable range when viewed from a direction parallel to the transport direction of the tray, contact between the camera and the moving frame is also prevented.
- the component mounting apparatus may be configured to include a control unit that causes the camera to image the state of the component in the tray with the moving frame removed from between the camera and the imaging position.
- the component mounting apparatus may be configured such that the conveyance path is horizontal and the camera is disposed above the imaging position.
- the camera is arranged on the opposite side of the movable range from the imaging position (that is, the camera is arranged above the movable range and the imaging position is arranged below the movable range), Compared with the case where a camera directed from above to below is arranged in the movable range of the moving frame, interference between the camera and the moving frame can be avoided.
- the distance from the camera to the imaging position can be sufficiently ensured as compared with the case where the camera directed from above to below is fixed to the head.
- the tray transport unit temporarily stops the tray at the imaging position during the transport from the tray holding unit to the supply position, and the camera captures the component mounting apparatus so as to capture the tray stopped at the imaging position. It may be configured. In such a configuration, since the state of the component in the tray can be imaged with the tray stopped, the component imaging can be performed with relatively high accuracy.
- the component mounting apparatus may be configured such that the camera captures an image of the tray that is transported along the transport path by the tray transport unit and passes through the imaging position.
- the component mounting apparatus may be configured to further include a user interface that displays a result captured by the camera.
- FIG. 2 is a perspective view schematically illustrating the component mounting apparatus in FIG. 1.
- FIG. 2 is a block diagram schematically illustrating an electrical configuration included in the component mounting apparatus of FIG. 1. It is a figure which illustrates typically operation performed when mounting a component supplied from a tray by a head unit. It is a flowchart which illustrates typically the operation
- FIG. 6 is an operation diagram schematically illustrating a part of a procedure executed by the flowchart of FIG. 5. It is a figure which illustrates typically the contents of the display of the user interface used for recognition of the state of parts.
- FIG. 1 is a plan view schematically illustrating a component mounting apparatus to which the present invention is applicable.
- FIG. 2 is a perspective view schematically illustrating the component mounting apparatus of FIG.
- FIG. 3 is a block diagram schematically illustrating an electrical configuration of the component mounting apparatus of FIG. 1, the X frame 61 of the component mounting apparatus 100 is shown, and the housing 11 of the component mounting apparatus 100 is partially cut away in FIG.
- the XYZ orthogonal coordinate system which makes the X-axis and Y-axis orthogonal to each other a horizontal direction, and makes a Z-axis a vertical direction is shown suitably.
- the component mounting apparatus 100 controls each part of the apparatus by the controller 8 shown in FIG. 3, and after mounting a component (electronic component or the like) on the board S carried in from the outside, the board S is carried out to the outside.
- the controller 8 includes a main control unit 80 configured with a CPU (Central Processing Unit) and a memory, and a storage unit 81 configured with a memory.
- the main control unit 80 stores a program 810 stored in the storage unit 81. Based on this, the drive control unit 82 and the image processing unit 83 are controlled to cause each unit to perform operations necessary for board carry-in, component mounting, board carry-out, and the like.
- the controller 8 also has an interface control unit 85 that communicates with the user interface 9 provided in the component mounting apparatus 100.
- the controller 8 accepts input from the user via the interface control unit 85, and displays to the user. To do.
- the main control unit 80, the storage unit 81, the drive control unit 82, the image processing unit 83, and the interface control unit 85 are connected to each other via a bus 84, and transmit / receive data via the bus 84.
- the component mounting apparatus 100 includes a base 1 that supports each functional unit that performs mounting of a component, and a housing 11 that covers the base 1 and each functional unit.
- the component mounting apparatus 100 includes a dual lane structure in which two board transfer lanes 2 arranged in parallel are provided on a base 1 and the board S is transferred in the board transfer direction X by each board transfer lane 2.
- the component mounting apparatus 100 includes four component supply units 3 that supply components, and two head units 4 that move components supplied from the component supply unit 3 to the substrate S carried in the substrate transfer lane 2. With.
- the two substrate transfer lanes 2 have a generally common configuration.
- the board conveyance lane 2 has a configuration in which two conveyors 21 extending in parallel with the board conveyance direction X are arranged in parallel.
- the four conveyors 21 are arranged in parallel. Is arranged.
- the middle two conveyors 21 are movable conveyors 21 that can move in the front-rear direction Y. By moving the movable conveyor 21 in the front-rear direction Y, each of the substrate transport lanes 2 can be moved according to the width of the substrate S. The width can be adjusted.
- the substrate transport lane 2 transports the substrate S from the upstream side in the substrate transport direction X (opposite side of the X-axis arrow) to the downstream side (X-axis arrow side) by two conveyors 21 that operate in synchronization. .
- the drive control unit 82 controls the board transfer lane 2 to carry the board S from the upstream side in the board transfer direction X to the mounting position in the component mounting apparatus 100 (the position of the board S in FIG. 1).
- the carrying-in operation to carry out and the carrying-out operation to carry out the substrate from the mounting position to the downstream side in the substrate carrying direction X can be executed.
- Two component supply units 3 are arranged in the substrate transport direction X on both sides in the front-rear direction Y of the two substrate transport lanes 2.
- the component supply unit 3 arranged on the rear side in the front-rear direction Y (opposite to the arrow of the Y axis) and upstream in the substrate transport direction X supplies a relatively large component E from the tray T. 200.
- a component supply apparatus 200 for example, a component supply apparatus described in International Publication 2011/083553 can be used.
- the component supply device 200 includes a pallet housing part 210 that houses a plurality of pallets 201 arranged in the vertical direction Z. Furthermore, the component supply apparatus 200 includes a pallet transport mechanism 220 that transports the pallet 201 in the front-rear direction Y.
- the pallet conveyance mechanism 220 includes a pair of conveyance rails 221 extending in the front-rear direction Y and a clamp mechanism 222 movable in the front-rear direction Y. Then, the clamp mechanism 222 moves in parallel with the transport rail 221 while clamping the pallet 201, so that the substrate S can be transported in the front-rear direction Y while being supported by the transport rail 221.
- the drive control unit 82 controls the pallet transport mechanism 220, whereby the pallet 201 can be pulled out from the pallet storage unit 210 to the substrate transport lane 2 side, and the pulled out pallet 201 can be returned to the pallet storage unit 210.
- the component supply device 200 includes an elevating mechanism 230 that integrally elevates and lowers the plurality of pallets 201. Then, the pallet 201 positioned at the same height as the transport rail 221 is selectively pulled out from the pallet storage unit 210 by the drive control unit 82 controlling the lifting mechanism 230.
- a tray T for accommodating a plurality of components E is placed on the pallet 201.
- a plurality of parts E are placed in a state where they are dispersed by, for example, a user.
- the tray T moves between the storage position Lc in the pallet storage section 210 and the supply position Ls on the substrate transport lane 2 side from the pallet storage section 210 in the front-rear direction Y (transport of the tray T).
- An imaging position Li is provided in the middle of the transport path P from the storage position Lc to the supply position Ls, and the tray T reaches the supply position Ls from the storage position Lc via the imaging position Li.
- the tray imaging camera Ct faces the imaging position Li from above in the vertical direction Z, and the state of the component E in the tray T is imaged by the tray imaging camera Ct at the imaging position Li, as will be described later. Therefore, the image processing unit 83 can recognize the position / posture of the component E on the tray T by performing image processing on the imaging result of the tray imaging camera Ct.
- the three component supply units 3 other than the component supply device 200 supply relatively small components from the tape feeder 5. That is, in each of the three component supply units 3, a plurality of tape feeders 5 are arranged in the substrate transport direction X, and each tape feeder 5 intermittently feeds components to the supply position 5a at the tip.
- the components supplied from each component supply unit 3 are picked up by the head unit 4 and transferred to the substrate S.
- the head unit 4 is provided on each of the front side and the rear side in the front-rear direction Y.
- the front head unit 4 picks up components from the two component supply units 3 disposed on the front side of the substrate transport lane 2, while the rear head unit 4 is disposed on the rear side of the substrate transport lane 2. Parts are picked up from the two parts supply units 3.
- Each head unit 4 includes nine mounting heads 40 arranged in the substrate transport direction X, and sucks the component supplied from the component supply unit 3 by a nozzle attached to the tip of each mounting head 40.
- the mounting head 40 is connected to the Z-axis servo motor Mz, and the drive control unit 82 controls the Z-axis servo motor Mz to move the mounting head 40 between the lowered position and the raised position (higher than the lowered position). Move up and down. As a result, the mounting head 40 moves between the component supply unit 3 and the substrate S while being positioned at the lowered position when picking up components from the component supply unit 3 or mounting components on the substrate S, for example. In the case, it is in the raised position. Further, the mounting head 40 can be rotated by receiving a driving force from the R-axis servo motor Mr, and adjusts the rotation angle of the adsorbed component by appropriately rotating.
- a head imaging camera Ch facing upward is disposed outside the substrate transport lane 2 in the front-rear direction Y, and the mounting head 40 picks up a component from the component supply unit 3 and then the head imaging camera Ch.
- the head imaging camera Ch images the components adsorbed by the mounting head 40 passing above, and the image processing unit 83 performs image processing on the imaging result of the head imaging camera Ch and is adsorbed by the mounting head 40. Recognize the rotational position of the part.
- the drive control unit 82 rotates the R-axis servo motor Mr according to the recognition result, and adjusts the rotation angle of the component adsorbed on the mounting head 40. Thereby, components can be mounted on the board S at an appropriate angle.
- the component mounting apparatus 100 includes an X drive mechanism 6 that drives the head unit 4 in the X direction.
- the X drive mechanism 6 is provided on each of the front and rear sides in the front-rear direction Y.
- the front X drive mechanism 6 supports the front head unit 4, while the rear X drive mechanism 6 is on the rear side.
- the head unit 4 is supported. Since these X drive mechanisms 6 have almost the same configuration, only one X drive mechanism 6 will be described here.
- the X drive mechanism 6 includes an X frame 61 extending in the substrate transport direction X and a screw shaft 62 attached to the X frame 61.
- the screw shaft 62 is provided in parallel with the substrate transport direction X, and the head unit 4 is screwed onto the screw shaft 62.
- the component mounting apparatus 100 further includes a Y drive mechanism 7 that drives the X drive mechanism 6 in the front-rear direction Y with the head unit 4.
- the Y drive mechanism 7 includes a pair of Y frames 71 that extend in the front-rear direction Y, and Y rails 72 that are attached to the Y frames 71 and extend in the front-rear direction Y. Then, the X drive mechanism 6 is bridged on the Y rail 72 of each Y frame 71.
- the stator built in the Y frame 71 and the mover built in the X drive mechanism 6 constitute a Y axis linear motor My, and each X drive mechanism 6 is moved in the front-rear direction Y by the Y axis linear motor My. Can be made.
- the drive control unit 82 controls the X-axis servo motor Mx and the Y-axis linear motor My, whereby the mounting head 40 of the head unit 4 can be moved in the XY plane.
- the user interface 9 described above is attached to the housing 11 of the component mounting apparatus 100 on both sides in the front-rear direction Y, respectively.
- the user interface 9 includes a display 91 and a keyboard 92.
- the controller 8 can display the state of the component mounting apparatus 100 on the display 91 or accept information input by the user using the keyboard 92 via the user interface 9.
- the display 91 may have an input function by a touch panel method or the like. Thus, when the display 91 has an input function, the keyboard 92 may be omitted.
- the head unit 4 picks up the component E from the tray T of the component supply apparatus 200 and transfers it to the substrate S.
- the component E is picked up from the tray T based on the result of imaging the state of the component E on the tray T and mounted on the substrate S. Next, this operation will be described in detail.
- FIG. 4 is a diagram schematically illustrating an operation executed when a component supplied from the tray is mounted by the head unit.
- FIG. 5 is a flowchart schematically illustrating an operation executed when a component supplied from the tray is mounted by the head unit.
- FIG. 6 is an operation diagram schematically illustrating a part of the procedure executed by the flowchart of FIG.
- a part of the configuration of the component mounting apparatus 100 is omitted, and is not necessarily the same as the display in FIG.
- a part of the configuration of the component mounting apparatus 100 is omitted, and is not necessarily the same as the display in FIG.
- the pallet accommodating portion 210 a plurality of magazine portions 211 are arranged in the vertical direction Z, and each magazine portion 211 can accommodate a tray T. Then, the pallet 201 can be inserted into and removed from the magazine portion 211 positioned at the insertion / removal position Ha having the same height as the transport rail 221 by the lifting mechanism 230.
- step S101 the user grasps a plurality of components E from the component stocker ST and distributes them on the tray T, and thus accommodates the tray T on which the components E are dispersed in the magazine unit 211. At this time, the tray T in which the component E is accommodated can be accommodated in each of the plurality of magazine portions 211.
- the lifting mechanism 230 of the component supply apparatus 200 positions the tray T in which the component E is stored at the insertion / removal position Ha.
- step S103 the pallet transport mechanism 220 pulls out the tray T from the storage position Lc to the substrate transport lane 2 side in the front-rear direction Y by the clamp mechanism 222 (FIG. 1), and stops it at the imaging position Li. In this way, preparations for imaging of components by the tray imaging camera Ct arranged above the imaging position Li are prepared.
- the X frame 61 receives the driving force from the Y-axis linear motor My and moves in the front-rear direction Y.
- the movable range R61 of the X frame 61 overlaps with the imaging position Li and the tray imaging camera Ct in a direction parallel to the transport path P (front-rear direction Y) (in other words, viewed from above). is doing.
- the tray imaging camera Ct is disposed outside the movable range R61 of the X frame 61.
- the tray imaging camera Ct is disposed on the side opposite to the imaging position Li with respect to the movable range R61 when viewed from a direction parallel to the transport direction (front-rear direction Y) of the tray T, in other words.
- a movable range R61 exists between the tray imaging camera Ct and the imaging position Li.
- the tray imaging camera Ct is not only in the movable range R61 of the X frame 61 but also out of the movable range of the head unit 4 (including the mounting head 40), that is, disposed outside the movable range of the head unit 4. ing.
- the main control unit 80 confirms the position of the X frame 61 prior to imaging by the tray imaging camera Ct.
- the main control unit 80 removes the X frame 61 from between these.
- FIG. 7 is a diagram schematically illustrating the contents of the display of the user interface used for recognizing the state of the component.
- the main control unit 80 controls the interface control unit 85 to display the captured image of the tray imaging camera Ct on the main view 911 of the display 91.
- the main control unit 80 receives an initial setting of the user via the user interface 9. In this initial setting, a pattern mainly corresponding to each state of the component E (front side, reverse side, etc.) is input by the user.
- the user initializes the pattern setting state in the image processing unit 83 by clicking on the icon 913 described as “cancel setting”. Subsequently, the user displays, on the sub-view 912, the part E that is in the pattern 1 state (the front-facing state in this example) among the parts E displayed on the main view 911. Note that the display on the subview 912 is executed by clicking the corresponding component E, for example. Subsequently, an icon 914 described as “Set to pattern 1” is clicked. As a result, the pattern of the component E in the face-up state is set in the image processing unit 83. Similarly, pattern setting is executed for the part E in the state of the pattern 2 (in the example here, facing down).
- the image processing unit 83 captures an image captured by the tray image capturing camera Ct (that is, the main view 911). Pattern matching is performed on the displayed image), and a score indicating the degree of matching between the part E and the patterns 1 and 2 is obtained. Thereby, the score about each of the patterns 1 and 2 is calculated
- the pattern 2 (that is, the state facing down) that is not more suitable for suction is determined as the pattern of the component E.
- the image processing unit 83 sets the mark MK indicating the position and rotation angle of the component E in each component E, and sets the X coordinate (mark distance X), Y coordinate (mark distance Y), and rotation angle of the mark MK. The data is displayed on the list display unit 916.
- the main control unit 80 selects a component E that can be picked up by the mounting head 40 (that is, suckable) from the plurality of trays T.
- a part E is selected (step S106).
- a part E other than the part E that is not suitable for picking up from the plurality of parts E in an overlapping manner or facing down is selected.
- the pallet transport mechanism 220 transports the tray T in the front-rear direction Y from the imaging position Li to the substrate transport lane 2 side, and supplies a supply position Ls adjacent to the substrate transport lane 2.
- the tray T is stopped (step S107).
- the main control unit 80 determines whether or not a component E that can be picked up by the mounting head 40 is present on the tray T based on the result of component selection in step S106. Judgment is made (step S108). If there is a suckable component E ("YES" in step S108), the main control unit 80 performs drive control so that the suckable component E is picked up from the tray T and moved to the substrate S. A command is issued to the unit 82. Then, the drive control unit 82 operates the head unit 4 in accordance with this command. As a result, the head unit 4 moves to the substrate S via the head imaging camera Ch after picking up the suckable component E by the mounting head 40.
- the head unit 4 places the component E on the substrate S after adjusting the mounting angle and mounting position of the component E according to the result of the head imaging camera Ch imaging the component E.
- the component E is transferred from the tray T to the substrate S, and component mounting is executed (step S109).
- step S110 the main control unit 80 refers to the program 810 and determines whether or not to continue mounting the component E. Then, when the mounting of the component E is not continued (in the case of “NO” in step S110), the main control unit 80 ends the flow of FIG. 5 while continuing the mounting of the component E (in step S110). If “YES”, the process returns to step S108.
- step S108 if it is determined whether or not the component E that can be picked up exists on the tray T, if the component E exists, steps S109 and S110 are executed again. On the other hand, if it is determined in step S108 that the suckable component E does not exist on the tray T ("NO" in step S108), the pallet transport mechanism 220 moves the tray T from the supply position Ls to the storage position Lc. Return to. In step S102, the elevating mechanism 230 raises and lowers the pallet accommodating portion 210, and positions the tray T different from the tray T returned to the accommodating position Lc in step S111 at the insertion / removal position Ha. In this way, the operations after step S103 are performed on the tray T positioned at the insertion / removal position Ha.
- the state of the component E in the tray T is imaged by the tray imaging camera Ct. Therefore, the component E in a state suitable for being picked up by the head unit 4 can be selected from the plurality of components E based on the imaging result and moved to the substrate S.
- the parts E overlap each other or the parts E face down. E is not necessarily suitable for picking up. Therefore, by imaging the state of the component E on the tray T in advance, an appropriate component E can be selected based on the imaging result.
- the mounting head 40 of the head unit 4 picks up the component E and moves to the substrate S from the tray T transported from the pallet housing part 210 to the supply position Ls.
- the mounting head 40 located in the vicinity of the imaging position Li may interfere with the imaging of the state of the component E in the tray T (that is, it may be reflected or become a shadow).
- the imaging of the state of the component E on the tray T is executed at the imaging position Li in the middle from the pallet housing part 210 to the supply position Ls. Accordingly, such component imaging can be executed at the imaging position Li deviated from the mounting head 40 located in the vicinity of the supply position Ls. As a result, it is possible to appropriately image the state of the component E in the tray T while suppressing the interference of the mounting head 40 located in the vicinity of the supply position Ls.
- the tray imaging camera Ct has a supply position Ls in a direction (front-rear direction Y) parallel to the transport path P as viewed from a direction perpendicular to the transport direction (front-rear direction Y) of the tray T. It is arranged at a different position. Such a configuration is preferable because the tray imaging camera Ct can be arranged while avoiding contact with the mounting head 40 located in the vicinity of the supply position Ls.
- the tray imaging camera Ct is disposed outside the movable range R61 of the X frame 61. Such a configuration is preferable because the tray imaging camera Ct camera can be prevented from coming into contact with the X frame 61.
- the movable range R61 of the X frame 61 overlaps with the imaging position Li as viewed from above the transport path P, and the tray imaging camera Ct is parallel to the transport direction (front-rear direction Y) of the tray T. Viewed from the side of the movable range R61 on the side opposite to the imaging position Li.
- the movable range R61 of the X frame 61 and the imaging position Li are overlapped when viewed from above the transport path P, so that the component mounting apparatus 100 can be reduced in the direction parallel to the transport path P (front-rear direction Y). Is possible.
- the tray imaging camera Ct is disposed on the opposite side of the imaging position Li with respect to the movable range R61 when viewed from a direction parallel to the transport direction (front-rearward direction Y) of the tray T. Contact between Ct and the X frame 61 is also prevented.
- the transport path P is horizontal, and the tray imaging camera Ct is disposed above the imaging position Li.
- the tray imaging camera Ct is arranged on the opposite side of the imaging range Li with respect to the movable range R61 (that is, the tray imaging camera Ct is arranged above the movable range R61 and below the movable range R61).
- the imaging position Li By arranging the imaging position Li on the side), the interference between the tray imaging camera Ct and the X frame 61 compared to the case where the tray imaging camera Ct directed from above to below is arranged in the movable range R61 of the X frame 61. Can be avoided.
- a sufficient distance from the tray imaging camera Ct to the imaging position Li can be ensured.
- a controller 8 is provided for causing the tray imaging camera Ct to image the state of the component E in the tray T with the X frame 61 removed from between the tray imaging camera Ct and the imaging position Li.
- the pallet transport mechanism 220 temporarily stops the substrate S at the imaging position Li during the transport from the pallet accommodating unit 210 to the supply position Ls. Then, the tray imaging camera Ct images the substrate S that is stopped at the imaging position Li. In such a configuration, since the component E state in the tray T can be imaged while the tray T is stopped, component imaging can be performed with relatively high accuracy.
- the component mounting apparatus 100 corresponds to an example of the “component mounting apparatus” of the present invention
- the component E corresponds to an example of the “component” of the present invention
- the substrate S corresponds to the “substrate” of the present invention.
- the tray T corresponds to the“ tray ”of the present invention
- the pallet housing part 210 corresponds to an example of the“ tray holding part ”of the present invention
- the pallet transport mechanism 220 corresponds to the“ pallet transport mechanism ”of the present invention.
- the transport path P corresponds to an example of the “transport path” of the present invention
- the storage position Lc corresponds to an example of the “accommodation position” of the present invention
- the imaging position Li corresponds to the “imaging position” of the present invention.
- the supply position Ls corresponds to an example of the “supply position” of the present invention
- the tray imaging camera Ct corresponds to an example of the “camera” of the present invention
- the mounting head 40 corresponds to the “head” of the present invention.
- the X frame 61 is a “moving frame” according to the present invention.
- the movable range R61 corresponds to an example of the “movable range” of the present invention
- the controller 8 corresponds to an example of the “control unit” of the present invention
- the user interface 9 corresponds to the “user interface of the present invention. Is equivalent to an example.
- the present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention.
- the component mounting apparatus 100 including the component supply apparatus 200 is illustrated.
- the present invention can also be applied to a component mounting apparatus 100 that is configured separately from the component supply apparatus 200 and to which the component supply apparatus 200 is retrofitted.
- the specific configuration of the tray imaging camera Ct is not particularly mentioned.
- various cameras can be used as the tray imaging camera Ct.
- a camera composed of a solid-state imaging device or the like can be used.
- a one-dimensional image sensor (linear image sensor) or a two-dimensional image sensor (area image sensor) can be used.
- the tray imaging camera Ct faces the imaging position Li from the vertical direction Z.
- the tray imaging camera Ct may be arranged so as to face the imaging position Li from obliquely above, so as to face the imaging position Li from an angle inclined with respect to the vertical direction Z.
- the tray T is temporarily stopped at the imaging position Li.
- the tray T may be transported from the pallet housing part 210 to the supply position Ls without stopping at the imaging position Li.
- the tray T that is transported along the transport path P by the pallet transport mechanism 220 and passes through the imaging position Li may be imaged by the tray imaging camera Ct.
- the present invention may be applied to a case where a plurality of parts E are accommodated in a state of being aligned on the tray T.
- the movable range R61 of the X frame 61 overlapped with the imaging position Li in the direction parallel to the transport path P (front-rear direction Y).
- the movable range R61 and the imaging position Li may deviate from each other in the direction parallel to the transport path P (front-rear direction Y).
- the setting work of the patterns 1 and 2 used for pattern matching is executed based on an image obtained by imaging the component E to be used for component mounting.
- the setting work for the patterns 1 and 2 may be performed while displaying the image on the subview 912.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
E…部品
S…基板
T…トレイ
200…部品供給装置
210…パレット収容部(トレイ保持部)
220…パレット搬送機構(トレイ搬送部)
P…搬送経路
Y…前後方向(トレイTの搬送方向)
Lc…収容位置
Li…撮像位置
Ls…供給位置
Ct…トレイ撮像カメラ(カメラ)
40…実装ヘッド(ヘッド)
61…Xフレーム(移動フレーム)
R61…可動範囲
8…コントローラー(制御部)
9…ユーザーインターフェース
Claims (10)
- 部品が収容されたトレイを保持するトレイ保持部から供給位置まで前記トレイを搬送するトレイ搬送部と、
前記トレイ搬送部が前記トレイを搬送する搬送経路における前記トレイ保持部と前記供給位置との間の撮像位置で前記トレイにおける前記部品の状態を撮像するカメラと、
前記供給位置まで搬送された前記トレイに収容された前記部品を取り上げて基板に移動するヘッドと
を備えた部品実装装置。 - 前記カメラは、前記トレイの搬送方向に対して垂直な方向から視て前記搬送経路と平行な方向において前記供給位置とは異なる位置に配置されている請求項1に記載の部品実装装置。
- 前記ヘッドを伴って移動する移動フレームをさらに備え、
前記カメラは、前記移動フレームの可動範囲の外に配置されている請求項1または2に記載の部品実装装置。 - 前記可動範囲は、前記搬送経路の上方から視て前記撮像位置と重複しており、
前記カメラは、前記トレイの搬送方向に対して平行な方向から視て前記可動範囲に対して前記撮像位置とは反対側に配置されている請求項3に記載の部品実装装置。 - 前記カメラと前記撮像位置の間から前記移動フレームを外した状態で、前記トレイにおける前記部品の状態を前記カメラに撮像させる制御部をさらに備えた請求項4に記載の部品実装装置。
- 前記搬送経路は水平であり、前記カメラは前記撮像位置の上方に配置されている請求項1ないし5のいずれか一項に記載の部品実装装置。
- 前記トレイ搬送部は、前記トレイ保持部から供給位置まで搬送する途中で前記トレイを前記撮像位置で一時的に停止させ、
前記カメラは、前記撮像位置で停止している前記トレイを撮像する請求項1ないし6のいずれか一項に記載の部品実装装置。 - 前記カメラは、前記トレイ搬送部によって前記搬送経路に沿って搬送され、前記撮像位置を通過する前記トレイを撮像する請求項1ないし6のいずれか一項に記載の部品実装装置。
- 前記カメラが撮像した結果を表示するユーザーインターフェースをさらに備える請求項1ないし8のいずれか一項に記載の部品実装装置。
- 部品が収容されたトレイを保持するトレイ保持部から前記トレイを取り出して撮像位置まで搬送する工程と、
前記撮像位置で前記トレイにおける前記部品の状態をカメラで撮像する工程と、
前記撮像位置から前記供給位置まで前記トレイを搬送する工程と、
前記供給位置まで搬送された前記トレイに収容された前記部品をヘッドにより取り上げて基板に移動する工程と
を備えた部品実装方法。
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JP2015554447A JP6009695B2 (ja) | 2013-12-27 | 2013-12-27 | 部品実装装置、部品実装方法 |
KR1020167003238A KR101759633B1 (ko) | 2013-12-27 | 2013-12-27 | 부품 실장 장치, 부품 실장 방법 |
CN201380079796.8A CN107615903B (zh) | 2013-12-27 | 2013-12-27 | 元件安装装置、元件安装方法 |
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JP2019218111A (ja) * | 2018-06-21 | 2019-12-26 | 太陽誘電株式会社 | テーピング装置およびテーピング方法 |
JP2021174878A (ja) * | 2020-04-24 | 2021-11-01 | ヤマハ発動機株式会社 | 部品実装機および部品収容状態判断方法 |
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JP7124126B2 (ja) * | 2019-01-18 | 2022-08-23 | 株式会社Fuji | 部品実装装置 |
WO2022064585A1 (ja) * | 2020-09-24 | 2022-03-31 | 株式会社Fuji | 採取可否判定装置および採取可否判定方法 |
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JPWO2015097865A1 (ja) | 2017-03-23 |
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