JP5774968B2 - 部品移載装置および部品移載装置における吸着位置調整方法 - Google Patents
部品移載装置および部品移載装置における吸着位置調整方法 Download PDFInfo
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- JP5774968B2 JP5774968B2 JP2011250001A JP2011250001A JP5774968B2 JP 5774968 B2 JP5774968 B2 JP 5774968B2 JP 2011250001 A JP2011250001 A JP 2011250001A JP 2011250001 A JP2011250001 A JP 2011250001A JP 5774968 B2 JP5774968 B2 JP 5774968B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
6 突上げ部
7a〜7d ウエハヘッド(取出ヘッド)
7g ノズル
8 部品認識カメラ
11a ベアチップ(ウエハ部品)
11c 調整用チップ
12 制御部
12e 記憶部
20 プリント基板(基板)
41b、42b 基板認識カメラ(撮像部)
100 部品移載装置
Claims (9)
- ウエハ部品を保持可能なウエハ保持テーブルと、
前記ウエハ保持テーブルに保持された前記ウエハ部品を下方から突上げる突上げ部と、
前記突上げ部により突上げられた前記ウエハ部品または前記突上げ部に載置された調整用チップを吸着する取出ヘッドと、
前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを撮像する撮像部と、
前記取出ヘッドの駆動を制御する制御部とを備え、
前記制御部は、吸着位置調整時に、前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により撮像して、その撮像結果に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、部品移載装置。 - 前記撮像部として、前記ウエハ部品が実装される基板を撮像する基板認識カメラを用いる、請求項1に記載の部品移載装置。
- 前記取出ヘッドは、複数設けられており、
前記制御部は、複数の前記取出ヘッドのそれぞれについて、前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により撮像して、その撮像結果に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、請求項1または2に記載の部品移載装置。 - 前記制御部は、前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により複数回撮像した撮像結果の平均に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、請求項1〜3のいずれか1項に記載の部品移載装置。
- 前記制御部は、前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により撮像した後に、前記ウエハ部品または前記調整用チップを前記突上げ部に戻すとともに戻された前記ウエハ部品または前記調整用チップを再び前記取出ヘッドに吸着して前記撮像部により撮像する動作を複数回繰り返して、各々の撮像で得られた撮像結果の平均に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、請求項4に記載の部品移載装置。
- 前記取出ヘッドによる前記ウエハ部品の吸着位置の調整結果を記憶する記憶部をさらに備え、
前記制御部は、基板生産時に、前記記憶部に記憶された前記調整結果に基づいて、前記取出ヘッドに前記ウエハ部品を吸着させる制御を行うように構成されている、請求項1〜5のいずれか1項に記載の部品移載装置。 - 前記突上げ部により突上げられた前記ウエハ部品または前記突上げ部に載置された前記調整用チップを撮像する部品認識カメラをさらに備え、
前記制御部は、前記部品認識カメラにより撮像した前記突上げ部により突上げられた前記ウエハ部品または前記突上げ部に載置された前記調整用チップの撮像結果に基づいて、前記取出ヘッドにより前記ウエハ部品または前記調整用チップを吸着させて、前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により撮像して、その撮像結果に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、請求項1〜6のいずれか1項に記載の部品移載装置。 - 前記取出ヘッドには、基板生産時に前記ウエハ部品を吸着するために用いられるノズルが装着されており、
前記制御部は、基板生産時に前記取出ヘッドに装着される前記ノズルを用いて吸着された状態の前記ウエハ部品または前記調整用チップを前記撮像部により撮像して、その撮像結果に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整するように構成されている、請求項1〜7のいずれか1項に記載の部品移載装置。 - 突上げ部により突上げられたウエハ部品または前記突上げ部に載置された調整用チップを取出ヘッドに吸着する工程と、
前記取出ヘッドに吸着された状態の前記ウエハ部品または前記調整用チップを撮像部により撮像して、その撮像結果に基づいて、前記取出ヘッドによる前記ウエハ部品の吸着位置を調整する工程とを備える、部品移載装置における吸着位置調整方法。
Priority Applications (3)
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JP2011250001A JP5774968B2 (ja) | 2011-11-15 | 2011-11-15 | 部品移載装置および部品移載装置における吸着位置調整方法 |
US13/535,209 US10103041B2 (en) | 2011-11-15 | 2012-06-27 | Component transfer apparatus and suction position adjustment method for component transfer apparatus |
KR1020120080019A KR101431572B1 (ko) | 2011-11-15 | 2012-07-23 | 부품 이송장치 및 부품 이송장치에 있어서의 흡착 위치 조정방법 |
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JP2011250001A JP5774968B2 (ja) | 2011-11-15 | 2011-11-15 | 部品移載装置および部品移載装置における吸着位置調整方法 |
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JP2013105959A JP2013105959A (ja) | 2013-05-30 |
JP5774968B2 true JP5774968B2 (ja) | 2015-09-09 |
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US10448551B2 (en) * | 2015-05-25 | 2019-10-15 | Fuji Corporation | Component mounter |
DE102015112518B3 (de) * | 2015-07-30 | 2016-12-01 | Asm Assembly Systems Gmbh & Co. Kg | Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips |
KR102140520B1 (ko) * | 2015-12-10 | 2020-08-03 | 한화정밀기계 주식회사 | 최적 노즐 및 스피드 선정 장치 |
JP6781677B2 (ja) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 |
CN111801993B (zh) * | 2018-03-13 | 2021-10-15 | 株式会社富士 | 安装装置以及安装方法 |
CN111863690B (zh) * | 2019-04-29 | 2023-10-20 | 成都辰显光电有限公司 | 批量转移头及其加工方法 |
US20230060239A1 (en) * | 2020-02-07 | 2023-03-02 | Fuji Corporation | Suction position adjustment device |
CN112103210B (zh) * | 2020-08-13 | 2023-03-31 | 上饶市广丰时代科技有限公司 | 一种用于半导体芯片封装的芯片粘接工艺设备 |
KR102617398B1 (ko) * | 2020-08-13 | 2023-12-26 | 세메스 주식회사 | 기판 반송 장치, 기판 처리 장치 및 기판 반송 방법 |
CN112718395B (zh) * | 2020-12-29 | 2021-10-26 | 深圳宝创电子设备有限公司 | 一种hp-x3全自动镜头芯片贴装机 |
CN113394154B (zh) * | 2021-05-18 | 2022-08-19 | 桂林芯飞光电子科技有限公司 | 一种用于探测器芯片的吸取装置及方法 |
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JP2002118153A (ja) * | 2000-10-11 | 2002-04-19 | Toshiba Corp | 電子部品の製造方法及び実装装置 |
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KR20130054119A (ko) | 2013-05-24 |
US10103041B2 (en) | 2018-10-16 |
US20130120554A1 (en) | 2013-05-16 |
KR101431572B1 (ko) | 2014-08-20 |
JP2013105959A (ja) | 2013-05-30 |
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