JP5712516B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5712516B2 JP5712516B2 JP2010160111A JP2010160111A JP5712516B2 JP 5712516 B2 JP5712516 B2 JP 5712516B2 JP 2010160111 A JP2010160111 A JP 2010160111A JP 2010160111 A JP2010160111 A JP 2010160111A JP 5712516 B2 JP5712516 B2 JP 5712516B2
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- 239000004065 semiconductor Substances 0.000 title claims description 51
- 150000004767 nitrides Chemical class 0.000 claims description 14
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 13
- 229910002704 AlGaN Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000005533 two-dimensional electron gas Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/765—Making of isolation regions between components by field effect
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Description
14 ドレインフィンガー
16 ゲートフィンガー
18 活性領域
20 ソースバスライン
22 ドレインバスライン
24 ゲートバスライン
26 フィールドプレート
28 フィールドプレート配線
30 基板
32 シード層
34 GaN電子走行層
36 AlGaN電子供給層
38 GaNキャップ層
40 オーミック電極
42 配線層
44 第1絶縁膜
46 第1段差部
48 第2段差部
50 第2絶縁膜
Claims (6)
- 窒化物半導体層上に設けられた複数のソースフィンガーと、
前記ソースフィンガーと交互に配置されるように設けられた複数のドレインフィンガーと、
前記ソースフィンガーと前記ドレインフィンガーとの間にそれぞれ設けられた複数のゲートフィンガーと、
前記ゲートフィンガーの上面と側面を覆うように前記窒化物半導体層上に設けられた第1絶縁膜と、
前記ゲートフィンガーと前記ドレインフィンガーとの間の前記第1絶縁膜上にそれぞれ設けられた複数のフィールドプレートと、
活性領域の外側における前記第1絶縁膜上に前記ソースフィンガーの延在方向と交差する方向にそれぞれ設けられ、前記ソースフィンガーと前記ソースフィンガーの両側に位置する前記フィールドプレートとを接続する複数のフィールドプレート配線と、を備え、
前記フィールドプレートと前記ゲートフィンガーの延在方向に沿った側壁による前記第1絶縁膜の段差部とは100nm以上離れていて、前記フィールドプレート配線と前記ゲートフィンガーの先端の側壁による前記第1絶縁膜の段差部とは100nm以上離れていて、
前記フィールドプレート配線は、前記ソースフィンガーに直接接続されていることを特徴とする半導体装置。 - 前記第1絶縁膜は、窒化シリコン膜よりなることを特徴とする請求項1記載の半導体装置。
- 前記窒化シリコン膜は、プラズマCVD法により形成されたものであることを特徴とする請求項2記載の半導体装置。
- 前記第1絶縁膜の厚さは、200nmから600nmであることを特徴とする請求項1記載の半導体装置。
- 前記フィールドプレートと前記ゲートフィンガーの延在方向に沿った側壁による前記第1絶縁膜の段差部とは300nm以上離れていて、前記フィールドプレート配線と前記ゲートフィンガーの先端の側壁による前記第1絶縁膜の段差部とは1μm以上離れていることを特徴とする請求項1記載の半導体装置。
- 前記窒化物半導体層上に前記ゲートフィンガーの延在方向と交差する方向に設けられ、前記第1絶縁膜により上面と側面とが覆われ、前記複数のゲートフィンガーを互いに接続するゲートバスラインと、
前記ゲートバスラインの上方で前記第1絶縁膜上に設けられた第2絶縁膜と、を備え、
前記ゲートバスラインと前記ソースフィンガーとの間には、前記第1絶縁膜と前記第2絶縁膜とが介在することを特徴とする請求項1記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010160111A JP5712516B2 (ja) | 2010-07-14 | 2010-07-14 | 半導体装置 |
US13/182,933 US8410558B2 (en) | 2010-07-14 | 2011-07-14 | Semiconductor device with field plates |
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JP2010160111A JP5712516B2 (ja) | 2010-07-14 | 2010-07-14 | 半導体装置 |
Publications (2)
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JP2012023210A JP2012023210A (ja) | 2012-02-02 |
JP5712516B2 true JP5712516B2 (ja) | 2015-05-07 |
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JP (1) | JP5712516B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5628416B2 (ja) * | 2011-04-25 | 2014-11-19 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
KR102038626B1 (ko) * | 2013-03-27 | 2019-10-30 | 삼성전자주식회사 | 파워소자 칩 및 그 제조방법 |
JP6211804B2 (ja) * | 2013-05-30 | 2017-10-11 | トランスフォーム・ジャパン株式会社 | 半導体装置 |
CN105264650B (zh) * | 2013-06-13 | 2017-10-31 | 夏普株式会社 | 异质结场效应晶体管 |
JP7068820B2 (ja) * | 2014-12-03 | 2022-05-17 | ジュノー セラピューティクス インコーポレイテッド | 養子細胞療法のための方法および組成物 |
JP6299665B2 (ja) * | 2015-04-30 | 2018-03-28 | 三菱電機株式会社 | 電界効果トランジスタ |
CN110741461B (zh) * | 2017-06-07 | 2023-09-26 | 三菱电机株式会社 | 半导体装置的制造方法 |
JP7095982B2 (ja) * | 2017-12-07 | 2022-07-05 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
US10103239B1 (en) * | 2017-12-28 | 2018-10-16 | Vanguard International Semiconductor Corporation | High electron mobility transistor structure |
US10629526B1 (en) * | 2018-10-11 | 2020-04-21 | Nxp Usa, Inc. | Transistor with non-circular via connections in two orientations |
EP4333304A3 (en) | 2019-10-31 | 2024-06-05 | Infineon Technologies Austria AG | Semiconductor device and inverter |
FR3105580A1 (fr) * | 2019-12-20 | 2021-06-25 | Thales | Transistor hemt ameliore |
US11929408B2 (en) * | 2020-05-14 | 2024-03-12 | Macom Technology Solutions Holdings, Inc. | Layout techniques and optimization for power transistors |
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JP2006524430A (ja) * | 2003-04-22 | 2006-10-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体装置及び該半導体装置を動作させる方法 |
WO2005022645A2 (en) * | 2003-08-27 | 2005-03-10 | Koninklijke Philips Electronics N.V. | Electronic device comprising an ldmos transistor |
US7550783B2 (en) * | 2004-05-11 | 2009-06-23 | Cree, Inc. | Wide bandgap HEMTs with source connected field plates |
US20060175670A1 (en) * | 2005-02-10 | 2006-08-10 | Nec Compound Semiconductor Device, Ltd. | Field effect transistor and method of manufacturing a field effect transistor |
JP2007242751A (ja) * | 2006-03-07 | 2007-09-20 | Sanyo Electric Co Ltd | 化合物半導体スイッチ回路装置 |
JP2007273920A (ja) | 2006-03-31 | 2007-10-18 | Eudyna Devices Inc | 半導体装置およびその製造方法 |
WO2008069074A1 (ja) * | 2006-12-07 | 2008-06-12 | Kabushiki Kaisha Toshiba | 半導体装置及び半導体装置の製造方法 |
JP2008277604A (ja) * | 2007-05-01 | 2008-11-13 | Oki Electric Ind Co Ltd | 電界効果トランジスタ |
JP5499441B2 (ja) * | 2008-04-01 | 2014-05-21 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
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US8410558B2 (en) | 2013-04-02 |
US20120012858A1 (en) | 2012-01-19 |
JP2012023210A (ja) | 2012-02-02 |
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