JP2009099905A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2009099905A JP2009099905A JP2007272443A JP2007272443A JP2009099905A JP 2009099905 A JP2009099905 A JP 2009099905A JP 2007272443 A JP2007272443 A JP 2007272443A JP 2007272443 A JP2007272443 A JP 2007272443A JP 2009099905 A JP2009099905 A JP 2009099905A
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- semiconductor chip
- semiconductor device
- wiring member
- inner lead
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
【解決手段】この半導体装置は、上面上に複数の電極パッド2が設けられた半導体チップ1と、インナーリード部21bを含み、インナーリード部21bが半導体チップ1側となるように配された複数のリード端子21と、互いに絶縁分離された複数の配線層32を一主面上に有するシート状の配線部材30と、少なくとも、半導体チップ1、インナーリード部21bおよび配線部材30を封止する封止樹脂層40とを備えている。そして、半導体チップ1の電極パッド2とリード端子21のインナーリード部21bとは、配線部材30の配線層32を介して互いに電気的に接続されている。
【選択図】図1
Description
2 電極パッド(電極部)
3 接着層
4、5 金属スタッドバンプ(金属バンプ、スタッドバンプ)
10 ダイパッド
11 吊りリード
20 リードフレーム
21 リード端子
21a アウターリード部
21b インナーリード部(リード端子の一方端部)
22 ダム部
30 配線部材
31 ポリイミド部材
32 配線層(導体)
40 封止樹脂層
45 ハンダ層
50 実装基板
Claims (6)
- 一方表面上に複数の電極部が設けられた半導体チップと、
前記半導体チップ側に一方端部が配された複数のリード端子と、
互いに絶縁分離された複数の導体を一主面上に有するシート状の配線部材と、
少なくとも、前記半導体チップ、前記リード端子の一方端部および前記配線部材を封止する封止樹脂層とを備え、
前記半導体チップの電極部と前記リード端子の一方端部とは、前記配線部材の導体を介して互いに電気的に接続されていることを特徴とする、半導体装置。 - 前記半導体チップの電極部上および前記リード端子の一方端部上には、それぞれ、金属バンプが形成されていることを特徴とする、請求項1に記載の半導体装置。
- 前記金属バンプは、スタッドバンプであることを特徴とする、請求項2に記載の半導体装置。
- 前記シート状の配線部材は、シート状のポリイミド部材を含むことを特徴とする、請求項1〜3のいずれか1項に記載の半導体装置。
- 前記半導体チップの厚み方向において、前記リード端子の一方端部の上面と前記半導体チップの上面とが、略同じ高さとなるように構成されていることを特徴とする、請求項1〜4のいずれか1項に記載の半導体装置。
- 前記半導体チップが前記封止樹脂層で封止されることによって、QFP型のパッケージ形態に構成されていることを特徴とする、請求項1〜5のいずれか1項に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007272443A JP2009099905A (ja) | 2007-10-19 | 2007-10-19 | 半導体装置 |
US12/253,383 US8030766B2 (en) | 2007-10-19 | 2008-10-17 | Semiconductor device |
US13/219,010 US20110309483A1 (en) | 2007-10-19 | 2011-08-26 | Semiconductor Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007272443A JP2009099905A (ja) | 2007-10-19 | 2007-10-19 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009099905A true JP2009099905A (ja) | 2009-05-07 |
JP2009099905A5 JP2009099905A5 (ja) | 2010-11-11 |
Family
ID=40562642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007272443A Pending JP2009099905A (ja) | 2007-10-19 | 2007-10-19 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (2) | US8030766B2 (ja) |
JP (1) | JP2009099905A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5817445B2 (ja) * | 2010-11-19 | 2015-11-18 | セイコーエプソン株式会社 | 回路基板 |
US9141157B2 (en) * | 2011-10-13 | 2015-09-22 | Texas Instruments Incorporated | Molded power supply system having a thermally insulated component |
US9041205B2 (en) | 2013-06-28 | 2015-05-26 | Intel Corporation | Reliable microstrip routing for electronics components |
KR20150018350A (ko) * | 2013-08-08 | 2015-02-23 | 삼성전자주식회사 | 지문인식장치와 그 제조방법 및 전자기기 |
JP6284397B2 (ja) * | 2014-03-10 | 2018-02-28 | エイブリック株式会社 | 半導体装置及びその製造方法 |
JP2015176907A (ja) | 2014-03-13 | 2015-10-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51140479A (en) * | 1975-05-30 | 1976-12-03 | Hitachi Ltd | Semiconductor device |
JPH0661406A (ja) * | 1991-02-08 | 1994-03-04 | Toshiba Corp | 半導体装置及び半導体装置の製造方法及びテ−プキャリア |
JPH07142488A (ja) * | 1993-11-15 | 1995-06-02 | Nec Corp | バンプ構造及びその製造方法並びにフリップチップ実装 構造 |
JPH088387A (ja) * | 1994-06-20 | 1996-01-12 | Nec Kansai Ltd | 樹脂モールド型電子部品 |
JPH0817870A (ja) * | 1994-07-05 | 1996-01-19 | Hitachi Ltd | 半導体装置 |
JPH1187405A (ja) * | 1997-09-10 | 1999-03-30 | Oki Electric Ind Co Ltd | 半導体装置の外部端子の製造方法 |
JPH11121542A (ja) * | 1997-10-21 | 1999-04-30 | Iwate Toshiba Electron Kk | 半導体チップ及びtabテープ |
JP2001024139A (ja) * | 1999-07-05 | 2001-01-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2003297874A (ja) * | 2002-03-29 | 2003-10-17 | Nec Electronics Corp | 電子部品の接続構造及び接続方法 |
JP2004281947A (ja) * | 2003-03-18 | 2004-10-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープの製造方法及びスペーサテープ |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS58143541A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置 |
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JPH0212937A (ja) * | 1988-06-30 | 1990-01-17 | Toshiba Corp | Tab用フィルムテープキャリア |
US5164336A (en) * | 1989-09-11 | 1992-11-17 | Nippon Steel Corporation | Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method |
JP3059560B2 (ja) * | 1991-12-25 | 2000-07-04 | 株式会社日立製作所 | 半導体装置の製造方法およびそれに使用される成形材料 |
JPH05267555A (ja) * | 1992-03-23 | 1993-10-15 | Hitachi Ltd | 半導体装置およびその製造方法並びにそれに使用されるリードフレームおよびその製造方法 |
JPH06302653A (ja) * | 1993-04-15 | 1994-10-28 | Rohm Co Ltd | 半導体装置 |
JPH07161902A (ja) * | 1993-12-02 | 1995-06-23 | Hitachi Ltd | 半導体装置およびその製造に用いるリードフレーム |
KR950034696A (ko) * | 1994-05-16 | 1995-12-28 | 김광호 | 초박형 반도체 패키지 및 그 제조방법 |
JP2546195B2 (ja) * | 1994-10-06 | 1996-10-23 | 日本電気株式会社 | 樹脂封止型半導体装置 |
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JPH10116953A (ja) | 1996-10-09 | 1998-05-06 | Oki Electric Ind Co Ltd | リードフレーム及びこれを用いた半導体装置 |
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JP2001244292A (ja) * | 2000-03-01 | 2001-09-07 | Mitsubishi Electric Corp | 半導体装置のワイヤボンデイング装置およびワイヤボンデイング方法 |
US6791166B1 (en) * | 2001-04-09 | 2004-09-14 | Amkor Technology, Inc. | Stackable lead frame package using exposed internal lead traces |
KR101010114B1 (ko) * | 2003-08-29 | 2011-01-24 | 르네사스 일렉트로닉스 가부시키가이샤 | 리드 프레임의 제조 방법 |
JP4290154B2 (ja) * | 2004-12-08 | 2009-07-01 | キヤノン株式会社 | 液体吐出記録ヘッドおよびインクジェット記録装置 |
-
2007
- 2007-10-19 JP JP2007272443A patent/JP2009099905A/ja active Pending
-
2008
- 2008-10-17 US US12/253,383 patent/US8030766B2/en active Active
-
2011
- 2011-08-26 US US13/219,010 patent/US20110309483A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51140479A (en) * | 1975-05-30 | 1976-12-03 | Hitachi Ltd | Semiconductor device |
JPH0661406A (ja) * | 1991-02-08 | 1994-03-04 | Toshiba Corp | 半導体装置及び半導体装置の製造方法及びテ−プキャリア |
JPH07142488A (ja) * | 1993-11-15 | 1995-06-02 | Nec Corp | バンプ構造及びその製造方法並びにフリップチップ実装 構造 |
JPH088387A (ja) * | 1994-06-20 | 1996-01-12 | Nec Kansai Ltd | 樹脂モールド型電子部品 |
JPH0817870A (ja) * | 1994-07-05 | 1996-01-19 | Hitachi Ltd | 半導体装置 |
JPH1187405A (ja) * | 1997-09-10 | 1999-03-30 | Oki Electric Ind Co Ltd | 半導体装置の外部端子の製造方法 |
JPH11121542A (ja) * | 1997-10-21 | 1999-04-30 | Iwate Toshiba Electron Kk | 半導体チップ及びtabテープ |
JP2001024139A (ja) * | 1999-07-05 | 2001-01-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2003297874A (ja) * | 2002-03-29 | 2003-10-17 | Nec Electronics Corp | 電子部品の接続構造及び接続方法 |
JP2004281947A (ja) * | 2003-03-18 | 2004-10-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープの製造方法及びスペーサテープ |
Also Published As
Publication number | Publication date |
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US8030766B2 (en) | 2011-10-04 |
US20110309483A1 (en) | 2011-12-22 |
US20090102029A1 (en) | 2009-04-23 |
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