IL112307A - A network of transmission lines - Google Patents
A network of transmission linesInfo
- Publication number
- IL112307A IL112307A IL112307A IL11230795A IL112307A IL 112307 A IL112307 A IL 112307A IL 112307 A IL112307 A IL 112307A IL 11230795 A IL11230795 A IL 11230795A IL 112307 A IL112307 A IL 112307A
- Authority
- IL
- Israel
- Prior art keywords
- dielectric
- transmission
- network
- stripline
- inner conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Communication Cables (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9400165A NL9400165A (nl) | 1994-02-03 | 1994-02-03 | Transmissielijnnetwerk. |
Publications (2)
Publication Number | Publication Date |
---|---|
IL112307A0 IL112307A0 (en) | 1995-03-30 |
IL112307A true IL112307A (en) | 1998-06-15 |
Family
ID=19863781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL112307A IL112307A (en) | 1994-02-03 | 1995-01-11 | A network of transmission lines |
Country Status (12)
Country | Link |
---|---|
US (1) | US5724012A (nl) |
EP (1) | EP0742962B1 (nl) |
JP (1) | JP3708544B2 (nl) |
KR (1) | KR100467120B1 (nl) |
CA (1) | CA2180543C (nl) |
DE (1) | DE69508925T2 (nl) |
ES (1) | ES2130589T3 (nl) |
IL (1) | IL112307A (nl) |
NL (1) | NL9400165A (nl) |
RU (1) | RU2121734C1 (nl) |
UA (1) | UA28028C2 (nl) |
WO (1) | WO1995021472A1 (nl) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5712607A (en) * | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
SE512578C2 (sv) * | 1997-08-29 | 2000-04-03 | Ericsson Telefon Ab L M | Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort |
US6414573B1 (en) * | 2000-02-16 | 2002-07-02 | Hughes Electronics Corp. | Stripline signal distribution system for extremely high frequency signals |
US6621384B1 (en) * | 2000-12-28 | 2003-09-16 | Nortel Networks Limited | Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies |
US6603376B1 (en) * | 2000-12-28 | 2003-08-05 | Nortel Networks Limited | Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies |
US6600395B1 (en) * | 2000-12-28 | 2003-07-29 | Nortel Networks Limited | Embedded shielded stripline (ESS) structure using air channels within the ESS structure |
US20030214802A1 (en) * | 2001-06-15 | 2003-11-20 | Fjelstad Joseph C. | Signal transmission structure with an air dielectric |
US6809608B2 (en) | 2001-06-15 | 2004-10-26 | Silicon Pipe, Inc. | Transmission line structure with an air dielectric |
WO2003090308A1 (en) * | 2002-04-17 | 2003-10-30 | Silicon Pipe, Inc. | Signal transmission line structure with an air dielectric |
AUPS216702A0 (en) * | 2002-05-07 | 2002-06-06 | Microwave and Materials Designs IP Pty | Filter assembly |
US7557298B2 (en) * | 2002-10-14 | 2009-07-07 | World Properties, Inc. | Laminated bus bar assembly |
US6888427B2 (en) * | 2003-01-13 | 2005-05-03 | Xandex, Inc. | Flex-circuit-based high speed transmission line |
EP2395598B1 (en) | 2003-03-04 | 2018-08-22 | Nuvotronics, LLC | Coaxial waveguide microstructures and methods of formation |
US7453143B2 (en) * | 2003-03-05 | 2008-11-18 | Banpil Photonics, Inc. | High speed electronics interconnect and method of manufacture |
DE60313316T2 (de) * | 2003-07-28 | 2007-12-20 | Qimonda Ag | Mikrostreifenleitung und Verfahren für ihre Herstellung |
US20050190019A1 (en) * | 2004-02-27 | 2005-09-01 | Carsten Metz | Low-loss transmission line structure |
US7719379B2 (en) * | 2004-03-04 | 2010-05-18 | Banpil Photonics, Inc. | High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans |
CN101036226A (zh) * | 2004-07-20 | 2007-09-12 | 不伦瑞克卡罗洛-威廉明娜工业大学 | 被冷却的集成电路 |
US7755445B2 (en) * | 2004-08-03 | 2010-07-13 | Banpil Photonics, Inc. | Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems |
KR100654703B1 (ko) | 2004-08-09 | 2006-12-06 | 주식회사 극동통신 | 하니콤 에어스트립라인의 지지구조 |
US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
US7889031B2 (en) * | 2004-11-24 | 2011-02-15 | Banpil Photonics, Inc. | High-speed electrical interconnects and method of manufacturing |
NL1027641C2 (nl) * | 2004-12-02 | 2006-06-07 | Thales Nederland Bv | Radio/microgolfstructuren en op de betreffende technologie gebaseerde phased array antennes. |
US7295024B2 (en) * | 2005-02-17 | 2007-11-13 | Xandex, Inc. | Contact signal blocks for transmission of high-speed signals |
US7656256B2 (en) | 2006-12-30 | 2010-02-02 | Nuvotronics, PLLC | Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof |
EP3104450A3 (en) | 2007-03-20 | 2016-12-28 | Nuvotronics, LLC | Integrated electronic components and methods of formation thereof |
US7898356B2 (en) | 2007-03-20 | 2011-03-01 | Nuvotronics, Llc | Coaxial transmission line microstructures and methods of formation thereof |
US7855623B2 (en) * | 2007-06-22 | 2010-12-21 | Tessera, Inc. | Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor |
US7999638B2 (en) * | 2007-06-28 | 2011-08-16 | Bae Systems Plc | Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region |
US8659371B2 (en) * | 2009-03-03 | 2014-02-25 | Bae Systems Information And Electronic Systems Integration Inc. | Three-dimensional matrix structure for defining a coaxial transmission line channel |
US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
KR101917052B1 (ko) | 2010-01-22 | 2019-01-30 | 누보트로닉스, 인크. | 열관리 |
US8917150B2 (en) | 2010-01-22 | 2014-12-23 | Nuvotronics, Llc | Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels |
US8482477B2 (en) * | 2010-03-09 | 2013-07-09 | Raytheon Company | Foam layer transmission line structures |
CN102378501B (zh) * | 2010-07-13 | 2013-06-26 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
DE112011104333T5 (de) * | 2010-12-10 | 2013-09-05 | Northrop Grumman Systems Corporation | Elekrische Schaumstruktur mit geringer Masse |
US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
EP2731783A4 (en) | 2011-07-13 | 2016-03-09 | Nuvotronics Llc | METHOD FOR PRODUCING ELECTRONIC AND MECHANICAL STRUCTURES |
JP2013201596A (ja) * | 2012-03-26 | 2013-10-03 | Murata Mfg Co Ltd | 伝送線路 |
WO2014091228A1 (en) * | 2012-12-14 | 2014-06-19 | Bae Systems Plc | Improvements in antennas |
GB2508899B (en) * | 2012-12-14 | 2016-11-02 | Bae Systems Plc | Improvements in antennas |
US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
AU2014220442A1 (en) * | 2013-02-22 | 2015-09-10 | Bae Systems Plc | Improvements in and relating to radar |
EP2770581A1 (en) * | 2013-02-22 | 2014-08-27 | BAE Systems PLC | Improvements in and relating to radar |
US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
EP3095159A4 (en) | 2014-01-17 | 2017-09-27 | Nuvotronics, Inc. | Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors |
US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
EP3224899A4 (en) | 2014-12-03 | 2018-08-22 | Nuvotronics, Inc. | Systems and methods for manufacturing stacked circuits and transmission lines |
CA2970764A1 (en) * | 2014-12-15 | 2016-06-23 | Limited Liability Company "Siemens" | A fluid-cooled balun transformer |
CN109524751B (zh) * | 2017-09-20 | 2021-10-12 | 株式会社东芝 | 高频电力合成器 |
US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
CN108110422A (zh) * | 2017-12-08 | 2018-06-01 | 中国船舶重工集团公司第七二四研究所 | 一种低损耗轻量化结构的pmi泡沫介质板带状线 |
CN109275258A (zh) * | 2018-09-11 | 2019-01-25 | 番禺得意精密电子工业有限公司 | 电路板 |
CN109257867A (zh) * | 2018-09-11 | 2019-01-22 | 番禺得意精密电子工业有限公司 | 电路板 |
KR20210004272A (ko) | 2019-07-04 | 2021-01-13 | 주식회사 아이피미라클 | 금융기관의 사용자정보 스크래핑 방법 및 이를 위한 시스템 |
KR20210004270A (ko) | 2019-07-04 | 2021-01-13 | 주식회사 아이피미라클 | 스크래핑 기술을 이용한 비영리단체 모금 정산방법 및 이를 위한 시스템 |
JP7468634B2 (ja) * | 2020-04-24 | 2024-04-16 | 株式会社村田製作所 | 信号伝送線路 |
CN112423467A (zh) * | 2020-10-28 | 2021-02-26 | 中国电子科技集团公司第五十五研究所 | 一种悬空型分段式共面波导薄膜电路结构 |
WO2022113618A1 (ja) * | 2020-11-30 | 2022-06-02 | 株式会社村田製作所 | 伝送線路及び電子機器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB217114A (en) * | 1923-09-25 | 1924-06-12 | Bernard Godfrey Molsberger | Improvements in and relating to brooms |
NL170695B (nl) * | 1951-06-30 | Giuliano Valentino Balducci Te Monsummano Terme, Italie. | ||
FR2129970B1 (nl) * | 1971-03-24 | 1974-05-31 | Comp Generale Electricite | |
BE792698A (fr) * | 1971-12-21 | 1973-06-13 | Illinois Tool Works | Catheter-canule samenstel |
US3904997A (en) * | 1973-09-13 | 1975-09-09 | Microwave Ass | Trapped-radiation microwave transmission line |
US3961296A (en) * | 1975-03-06 | 1976-06-01 | Motorola, Inc. | Slotted strip-line |
US5227742A (en) * | 1982-07-02 | 1993-07-13 | Junkosha Co., Ltd. | Stripline cable having a porous dielectric tape with openings disposed therethrough |
JPH0812965B2 (ja) * | 1986-06-30 | 1996-02-07 | 株式会社東芝 | 電力合成器 |
FR2616973B1 (fr) * | 1987-06-22 | 1989-07-07 | Riviere Luc | Ligne de transmission hyperfrequence a deux conducteurs coplanaires |
JPH01231403A (ja) * | 1988-03-11 | 1989-09-14 | Toshiba Corp | マイクロストリップ回路 |
JP2700553B2 (ja) * | 1988-03-31 | 1998-01-21 | 株式会社 潤工社 | 伝送回路 |
JPH0290701A (ja) * | 1988-09-27 | 1990-03-30 | Nec Corp | マイクロ波モノリシック集積回路装置 |
GB2232822A (en) * | 1989-06-05 | 1990-12-19 | Marconi Co Ltd | Signal carrier support |
SU1753519A1 (ru) * | 1990-02-05 | 1992-08-07 | Конструкторское бюро приборостроения Научно-производственного объединения "Точность" | Способ изготовлени полосковой линии передачи с полосковыми проводниками, расположенными перпендикул рно металлическим основани м |
US5293140A (en) * | 1991-01-02 | 1994-03-08 | Motorola, Inc. | Transmission line structure |
JPH05243819A (ja) * | 1991-03-07 | 1993-09-21 | Tdk Corp | ストリップラインとその製造方法 |
-
1994
- 1994-02-03 NL NL9400165A patent/NL9400165A/nl not_active Application Discontinuation
-
1995
- 1995-01-11 IL IL112307A patent/IL112307A/en not_active IP Right Cessation
- 1995-01-18 UA UA96073074A patent/UA28028C2/uk unknown
- 1995-01-18 US US08/682,630 patent/US5724012A/en not_active Expired - Lifetime
- 1995-01-18 KR KR1019960704191A patent/KR100467120B1/ko not_active IP Right Cessation
- 1995-01-18 ES ES95906973T patent/ES2130589T3/es not_active Expired - Lifetime
- 1995-01-18 DE DE69508925T patent/DE69508925T2/de not_active Expired - Lifetime
- 1995-01-18 JP JP52034495A patent/JP3708544B2/ja not_active Expired - Lifetime
- 1995-01-18 WO PCT/EP1995/000179 patent/WO1995021472A1/en active IP Right Grant
- 1995-01-18 CA CA002180543A patent/CA2180543C/en not_active Expired - Lifetime
- 1995-01-18 RU RU96118429A patent/RU2121734C1/ru active
- 1995-01-18 EP EP95906973A patent/EP0742962B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2180543A1 (en) | 1995-08-10 |
CA2180543C (en) | 2007-11-13 |
EP0742962B1 (en) | 1999-04-07 |
IL112307A0 (en) | 1995-03-30 |
KR100467120B1 (ko) | 2005-07-28 |
EP0742962A1 (en) | 1996-11-20 |
US5724012A (en) | 1998-03-03 |
WO1995021472A1 (en) | 1995-08-10 |
RU2121734C1 (ru) | 1998-11-10 |
JP3708544B2 (ja) | 2005-10-19 |
JPH09508510A (ja) | 1997-08-26 |
DE69508925D1 (de) | 1999-05-12 |
UA28028C2 (uk) | 2000-10-16 |
DE69508925T2 (de) | 1999-10-14 |
NL9400165A (nl) | 1995-09-01 |
ES2130589T3 (es) | 1999-07-01 |
KR970700947A (ko) | 1997-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
EXP | Patent expired |