IL112307A - A network of transmission lines - Google Patents

A network of transmission lines

Info

Publication number
IL112307A
IL112307A IL112307A IL11230795A IL112307A IL 112307 A IL112307 A IL 112307A IL 112307 A IL112307 A IL 112307A IL 11230795 A IL11230795 A IL 11230795A IL 112307 A IL112307 A IL 112307A
Authority
IL
Israel
Prior art keywords
dielectric
transmission
network
stripline
inner conductor
Prior art date
Application number
IL112307A
Other languages
English (en)
Hebrew (he)
Other versions
IL112307A0 (en
Original Assignee
Hollandse Signaalapparaten Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollandse Signaalapparaten Bv filed Critical Hollandse Signaalapparaten Bv
Publication of IL112307A0 publication Critical patent/IL112307A0/xx
Publication of IL112307A publication Critical patent/IL112307A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Waveguide Aerials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Communication Cables (AREA)
IL112307A 1994-02-03 1995-01-11 A network of transmission lines IL112307A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9400165A NL9400165A (nl) 1994-02-03 1994-02-03 Transmissielijnnetwerk.

Publications (2)

Publication Number Publication Date
IL112307A0 IL112307A0 (en) 1995-03-30
IL112307A true IL112307A (en) 1998-06-15

Family

ID=19863781

Family Applications (1)

Application Number Title Priority Date Filing Date
IL112307A IL112307A (en) 1994-02-03 1995-01-11 A network of transmission lines

Country Status (12)

Country Link
US (1) US5724012A (nl)
EP (1) EP0742962B1 (nl)
JP (1) JP3708544B2 (nl)
KR (1) KR100467120B1 (nl)
CA (1) CA2180543C (nl)
DE (1) DE69508925T2 (nl)
ES (1) ES2130589T3 (nl)
IL (1) IL112307A (nl)
NL (1) NL9400165A (nl)
RU (1) RU2121734C1 (nl)
UA (1) UA28028C2 (nl)
WO (1) WO1995021472A1 (nl)

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US7663064B2 (en) * 2004-09-25 2010-02-16 Banpil Photonics, Inc. High-speed flex printed circuit and method of manufacturing
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US7855623B2 (en) * 2007-06-22 2010-12-21 Tessera, Inc. Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor
US7999638B2 (en) * 2007-06-28 2011-08-16 Bae Systems Plc Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
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US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8482477B2 (en) * 2010-03-09 2013-07-09 Raytheon Company Foam layer transmission line structures
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US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
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US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
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EP3095159A4 (en) 2014-01-17 2017-09-27 Nuvotronics, Inc. Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
EP3224899A4 (en) 2014-12-03 2018-08-22 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
CA2970764A1 (en) * 2014-12-15 2016-06-23 Limited Liability Company "Siemens" A fluid-cooled balun transformer
CN109524751B (zh) * 2017-09-20 2021-10-12 株式会社东芝 高频电力合成器
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN108110422A (zh) * 2017-12-08 2018-06-01 中国船舶重工集团公司第七二四研究所 一种低损耗轻量化结构的pmi泡沫介质板带状线
CN109275258A (zh) * 2018-09-11 2019-01-25 番禺得意精密电子工业有限公司 电路板
CN109257867A (zh) * 2018-09-11 2019-01-22 番禺得意精密电子工业有限公司 电路板
KR20210004272A (ko) 2019-07-04 2021-01-13 주식회사 아이피미라클 금융기관의 사용자정보 스크래핑 방법 및 이를 위한 시스템
KR20210004270A (ko) 2019-07-04 2021-01-13 주식회사 아이피미라클 스크래핑 기술을 이용한 비영리단체 모금 정산방법 및 이를 위한 시스템
JP7468634B2 (ja) * 2020-04-24 2024-04-16 株式会社村田製作所 信号伝送線路
CN112423467A (zh) * 2020-10-28 2021-02-26 中国电子科技集团公司第五十五研究所 一种悬空型分段式共面波导薄膜电路结构
WO2022113618A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

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Also Published As

Publication number Publication date
CA2180543A1 (en) 1995-08-10
CA2180543C (en) 2007-11-13
EP0742962B1 (en) 1999-04-07
IL112307A0 (en) 1995-03-30
KR100467120B1 (ko) 2005-07-28
EP0742962A1 (en) 1996-11-20
US5724012A (en) 1998-03-03
WO1995021472A1 (en) 1995-08-10
RU2121734C1 (ru) 1998-11-10
JP3708544B2 (ja) 2005-10-19
JPH09508510A (ja) 1997-08-26
DE69508925D1 (de) 1999-05-12
UA28028C2 (uk) 2000-10-16
DE69508925T2 (de) 1999-10-14
NL9400165A (nl) 1995-09-01
ES2130589T3 (es) 1999-07-01
KR970700947A (ko) 1997-02-12

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