JPH09508510A - 伝送線路網 - Google Patents
伝送線路網Info
- Publication number
- JPH09508510A JPH09508510A JP7520344A JP52034495A JPH09508510A JP H09508510 A JPH09508510 A JP H09508510A JP 7520344 A JP7520344 A JP 7520344A JP 52034495 A JP52034495 A JP 52034495A JP H09508510 A JPH09508510 A JP H09508510A
- Authority
- JP
- Japan
- Prior art keywords
- transmission line
- line network
- dielectric
- stripline
- inner conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Communication Cables (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 第1の導電性基板と、少なくともほぼ一定の厚さを有する第1の誘電体シ ートと、所定の形状の内部導体構造と、少なくともほぼ一定の厚さを有する第2 の誘電体シートと、第2の導電性基板との集成体を具えた伝送線路網において、 少なくとも一つの誘電体シートに、内部導体構造の少なくとも一部分の形状にほ ぼ一致する形状を有するキャビティが設けられていることを特徴とする伝送線路 網。 2. 両誘電体シートにキャビティが設けられていることを特徴とする請求の範 囲1記載の伝送線路網。 3. 前記キャビティが誘電体シートの厚さ全体に亘って延在していることを特 徴とする請求の範囲1又は2記載の伝送線路網。 4. 前記内部導体構造がストリップライン網を含んでいることを特徴とする請 求の範囲3記載の伝送線路網。 5. 前記ストリップライン網を支持するために、前記キャビティの幅がストリ ップライン網の位置において少なくとも部分的にストリップライン網の幅より小 さく選択されていることを特徴とする請求の範囲4記載の伝送線路網。 6. 前記ストリップライン網が、少なくともほぼ完全に第1及び第2の誘電体 シート間に介挿された誘電体フィルム上に設けられていることを特徴とする請求 の範囲4記載の伝送線路網。 7. 前記ストリップライン網が誘電体フィルム上に設けられたプリント回路を 含んでいることを特徴とする請求の範囲6記載の伝送線路網。 8. 前記誘電体フィルムがkapton又はポリアミドからなることを特徴とする請 求の範囲6又は7記載の伝送線路網。 9. 前記ストリップライン網を冷却するためにストリップライン網の少なくと も一部分に沿って流体を流す手段が設けられていることを特徴とする請求の範囲 5、6又は7に記載の伝送線路網。 10. 前記誘電体シートは合成発泡体からなることを特徴とする請求の範囲9 記載の伝送線路網。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9400165 | 1994-02-03 | ||
NL9400165A NL9400165A (nl) | 1994-02-03 | 1994-02-03 | Transmissielijnnetwerk. |
PCT/EP1995/000179 WO1995021472A1 (en) | 1994-02-03 | 1995-01-18 | Transmission-line network |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09508510A true JPH09508510A (ja) | 1997-08-26 |
JP3708544B2 JP3708544B2 (ja) | 2005-10-19 |
Family
ID=19863781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52034495A Expired - Lifetime JP3708544B2 (ja) | 1994-02-03 | 1995-01-18 | 伝送線路網 |
Country Status (12)
Country | Link |
---|---|
US (1) | US5724012A (ja) |
EP (1) | EP0742962B1 (ja) |
JP (1) | JP3708544B2 (ja) |
KR (1) | KR100467120B1 (ja) |
CA (1) | CA2180543C (ja) |
DE (1) | DE69508925T2 (ja) |
ES (1) | ES2130589T3 (ja) |
IL (1) | IL112307A (ja) |
NL (1) | NL9400165A (ja) |
RU (1) | RU2121734C1 (ja) |
UA (1) | UA28028C2 (ja) |
WO (1) | WO1995021472A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013201596A (ja) * | 2012-03-26 | 2013-10-03 | Murata Mfg Co Ltd | 伝送線路 |
JP2018506842A (ja) * | 2014-12-15 | 2018-03-08 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 流体冷却式バラン変成器 |
JP2019057912A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社東芝 | 高周波電力合成器 |
WO2022113618A1 (ja) * | 2020-11-30 | 2022-06-02 | 株式会社村田製作所 | 伝送線路及び電子機器 |
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US5712607A (en) * | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
SE512578C2 (sv) * | 1997-08-29 | 2000-04-03 | Ericsson Telefon Ab L M | Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort |
US6414573B1 (en) * | 2000-02-16 | 2002-07-02 | Hughes Electronics Corp. | Stripline signal distribution system for extremely high frequency signals |
US6621384B1 (en) * | 2000-12-28 | 2003-09-16 | Nortel Networks Limited | Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies |
US6603376B1 (en) * | 2000-12-28 | 2003-08-05 | Nortel Networks Limited | Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies |
US6600395B1 (en) * | 2000-12-28 | 2003-07-29 | Nortel Networks Limited | Embedded shielded stripline (ESS) structure using air channels within the ESS structure |
US20030214802A1 (en) * | 2001-06-15 | 2003-11-20 | Fjelstad Joseph C. | Signal transmission structure with an air dielectric |
US6809608B2 (en) | 2001-06-15 | 2004-10-26 | Silicon Pipe, Inc. | Transmission line structure with an air dielectric |
WO2003090308A1 (en) * | 2002-04-17 | 2003-10-30 | Silicon Pipe, Inc. | Signal transmission line structure with an air dielectric |
AUPS216702A0 (en) * | 2002-05-07 | 2002-06-06 | Microwave and Materials Designs IP Pty | Filter assembly |
US7557298B2 (en) * | 2002-10-14 | 2009-07-07 | World Properties, Inc. | Laminated bus bar assembly |
US6888427B2 (en) * | 2003-01-13 | 2005-05-03 | Xandex, Inc. | Flex-circuit-based high speed transmission line |
EP2395598B1 (en) | 2003-03-04 | 2018-08-22 | Nuvotronics, LLC | Coaxial waveguide microstructures and methods of formation |
US7453143B2 (en) * | 2003-03-05 | 2008-11-18 | Banpil Photonics, Inc. | High speed electronics interconnect and method of manufacture |
DE60313316T2 (de) * | 2003-07-28 | 2007-12-20 | Qimonda Ag | Mikrostreifenleitung und Verfahren für ihre Herstellung |
US20050190019A1 (en) * | 2004-02-27 | 2005-09-01 | Carsten Metz | Low-loss transmission line structure |
US7719379B2 (en) * | 2004-03-04 | 2010-05-18 | Banpil Photonics, Inc. | High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans |
CN101036226A (zh) * | 2004-07-20 | 2007-09-12 | 不伦瑞克卡罗洛-威廉明娜工业大学 | 被冷却的集成电路 |
US7755445B2 (en) * | 2004-08-03 | 2010-07-13 | Banpil Photonics, Inc. | Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems |
KR100654703B1 (ko) | 2004-08-09 | 2006-12-06 | 주식회사 극동통신 | 하니콤 에어스트립라인의 지지구조 |
US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
US7889031B2 (en) * | 2004-11-24 | 2011-02-15 | Banpil Photonics, Inc. | High-speed electrical interconnects and method of manufacturing |
NL1027641C2 (nl) * | 2004-12-02 | 2006-06-07 | Thales Nederland Bv | Radio/microgolfstructuren en op de betreffende technologie gebaseerde phased array antennes. |
US7295024B2 (en) * | 2005-02-17 | 2007-11-13 | Xandex, Inc. | Contact signal blocks for transmission of high-speed signals |
US7656256B2 (en) | 2006-12-30 | 2010-02-02 | Nuvotronics, PLLC | Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof |
EP3104450A3 (en) | 2007-03-20 | 2016-12-28 | Nuvotronics, LLC | Integrated electronic components and methods of formation thereof |
US7898356B2 (en) | 2007-03-20 | 2011-03-01 | Nuvotronics, Llc | Coaxial transmission line microstructures and methods of formation thereof |
US7855623B2 (en) * | 2007-06-22 | 2010-12-21 | Tessera, Inc. | Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor |
US7999638B2 (en) * | 2007-06-28 | 2011-08-16 | Bae Systems Plc | Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region |
US8659371B2 (en) * | 2009-03-03 | 2014-02-25 | Bae Systems Information And Electronic Systems Integration Inc. | Three-dimensional matrix structure for defining a coaxial transmission line channel |
US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
KR101917052B1 (ko) | 2010-01-22 | 2019-01-30 | 누보트로닉스, 인크. | 열관리 |
US8917150B2 (en) | 2010-01-22 | 2014-12-23 | Nuvotronics, Llc | Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels |
US8482477B2 (en) * | 2010-03-09 | 2013-07-09 | Raytheon Company | Foam layer transmission line structures |
CN102378501B (zh) * | 2010-07-13 | 2013-06-26 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
DE112011104333T5 (de) * | 2010-12-10 | 2013-09-05 | Northrop Grumman Systems Corporation | Elekrische Schaumstruktur mit geringer Masse |
US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
EP2731783A4 (en) | 2011-07-13 | 2016-03-09 | Nuvotronics Llc | METHOD FOR PRODUCING ELECTRONIC AND MECHANICAL STRUCTURES |
WO2014091228A1 (en) * | 2012-12-14 | 2014-06-19 | Bae Systems Plc | Improvements in antennas |
GB2508899B (en) * | 2012-12-14 | 2016-11-02 | Bae Systems Plc | Improvements in antennas |
US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
AU2014220442A1 (en) * | 2013-02-22 | 2015-09-10 | Bae Systems Plc | Improvements in and relating to radar |
EP2770581A1 (en) * | 2013-02-22 | 2014-08-27 | BAE Systems PLC | Improvements in and relating to radar |
US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
EP3095159A4 (en) | 2014-01-17 | 2017-09-27 | Nuvotronics, Inc. | Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors |
US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
EP3224899A4 (en) | 2014-12-03 | 2018-08-22 | Nuvotronics, Inc. | Systems and methods for manufacturing stacked circuits and transmission lines |
US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
CN108110422A (zh) * | 2017-12-08 | 2018-06-01 | 中国船舶重工集团公司第七二四研究所 | 一种低损耗轻量化结构的pmi泡沫介质板带状线 |
CN109275258A (zh) * | 2018-09-11 | 2019-01-25 | 番禺得意精密电子工业有限公司 | 电路板 |
CN109257867A (zh) * | 2018-09-11 | 2019-01-22 | 番禺得意精密电子工业有限公司 | 电路板 |
KR20210004272A (ko) | 2019-07-04 | 2021-01-13 | 주식회사 아이피미라클 | 금융기관의 사용자정보 스크래핑 방법 및 이를 위한 시스템 |
KR20210004270A (ko) | 2019-07-04 | 2021-01-13 | 주식회사 아이피미라클 | 스크래핑 기술을 이용한 비영리단체 모금 정산방법 및 이를 위한 시스템 |
JP7468634B2 (ja) * | 2020-04-24 | 2024-04-16 | 株式会社村田製作所 | 信号伝送線路 |
CN112423467A (zh) * | 2020-10-28 | 2021-02-26 | 中国电子科技集团公司第五十五研究所 | 一种悬空型分段式共面波导薄膜电路结构 |
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GB217114A (en) * | 1923-09-25 | 1924-06-12 | Bernard Godfrey Molsberger | Improvements in and relating to brooms |
NL170695B (ja) * | 1951-06-30 | Giuliano Valentino Balducci Te Monsummano Terme, Italie. | ||
FR2129970B1 (ja) * | 1971-03-24 | 1974-05-31 | Comp Generale Electricite | |
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GB2232822A (en) * | 1989-06-05 | 1990-12-19 | Marconi Co Ltd | Signal carrier support |
SU1753519A1 (ru) * | 1990-02-05 | 1992-08-07 | Конструкторское бюро приборостроения Научно-производственного объединения "Точность" | Способ изготовлени полосковой линии передачи с полосковыми проводниками, расположенными перпендикул рно металлическим основани м |
US5293140A (en) * | 1991-01-02 | 1994-03-08 | Motorola, Inc. | Transmission line structure |
JPH05243819A (ja) * | 1991-03-07 | 1993-09-21 | Tdk Corp | ストリップラインとその製造方法 |
-
1994
- 1994-02-03 NL NL9400165A patent/NL9400165A/nl not_active Application Discontinuation
-
1995
- 1995-01-11 IL IL112307A patent/IL112307A/en not_active IP Right Cessation
- 1995-01-18 UA UA96073074A patent/UA28028C2/uk unknown
- 1995-01-18 US US08/682,630 patent/US5724012A/en not_active Expired - Lifetime
- 1995-01-18 KR KR1019960704191A patent/KR100467120B1/ko not_active IP Right Cessation
- 1995-01-18 ES ES95906973T patent/ES2130589T3/es not_active Expired - Lifetime
- 1995-01-18 DE DE69508925T patent/DE69508925T2/de not_active Expired - Lifetime
- 1995-01-18 JP JP52034495A patent/JP3708544B2/ja not_active Expired - Lifetime
- 1995-01-18 WO PCT/EP1995/000179 patent/WO1995021472A1/en active IP Right Grant
- 1995-01-18 CA CA002180543A patent/CA2180543C/en not_active Expired - Lifetime
- 1995-01-18 RU RU96118429A patent/RU2121734C1/ru active
- 1995-01-18 EP EP95906973A patent/EP0742962B1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013201596A (ja) * | 2012-03-26 | 2013-10-03 | Murata Mfg Co Ltd | 伝送線路 |
JP2018506842A (ja) * | 2014-12-15 | 2018-03-08 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 流体冷却式バラン変成器 |
JP2019057912A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社東芝 | 高周波電力合成器 |
WO2022113618A1 (ja) * | 2020-11-30 | 2022-06-02 | 株式会社村田製作所 | 伝送線路及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
CA2180543A1 (en) | 1995-08-10 |
IL112307A (en) | 1998-06-15 |
CA2180543C (en) | 2007-11-13 |
EP0742962B1 (en) | 1999-04-07 |
IL112307A0 (en) | 1995-03-30 |
KR100467120B1 (ko) | 2005-07-28 |
EP0742962A1 (en) | 1996-11-20 |
US5724012A (en) | 1998-03-03 |
WO1995021472A1 (en) | 1995-08-10 |
RU2121734C1 (ru) | 1998-11-10 |
JP3708544B2 (ja) | 2005-10-19 |
DE69508925D1 (de) | 1999-05-12 |
UA28028C2 (uk) | 2000-10-16 |
DE69508925T2 (de) | 1999-10-14 |
NL9400165A (nl) | 1995-09-01 |
ES2130589T3 (es) | 1999-07-01 |
KR970700947A (ko) | 1997-02-12 |
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Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20050126 |
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