DE69508925D1 - Übertragungsleitung-schaltung - Google Patents

Übertragungsleitung-schaltung

Info

Publication number
DE69508925D1
DE69508925D1 DE69508925T DE69508925T DE69508925D1 DE 69508925 D1 DE69508925 D1 DE 69508925D1 DE 69508925 T DE69508925 T DE 69508925T DE 69508925 T DE69508925 T DE 69508925T DE 69508925 D1 DE69508925 D1 DE 69508925D1
Authority
DE
Germany
Prior art keywords
transmission line
line circuit
circuit
transmission
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69508925T
Other languages
English (en)
Other versions
DE69508925T2 (de
Inventor
Petrus Teunisse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Nederland BV
Original Assignee
Thales Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Nederland BV filed Critical Thales Nederland BV
Application granted granted Critical
Publication of DE69508925D1 publication Critical patent/DE69508925D1/de
Publication of DE69508925T2 publication Critical patent/DE69508925T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Waveguide Aerials (AREA)
  • Communication Cables (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69508925T 1994-02-03 1995-01-18 Übertragungsleitung-schaltung Expired - Lifetime DE69508925T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9400165A NL9400165A (nl) 1994-02-03 1994-02-03 Transmissielijnnetwerk.
PCT/EP1995/000179 WO1995021472A1 (en) 1994-02-03 1995-01-18 Transmission-line network

Publications (2)

Publication Number Publication Date
DE69508925D1 true DE69508925D1 (de) 1999-05-12
DE69508925T2 DE69508925T2 (de) 1999-10-14

Family

ID=19863781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69508925T Expired - Lifetime DE69508925T2 (de) 1994-02-03 1995-01-18 Übertragungsleitung-schaltung

Country Status (12)

Country Link
US (1) US5724012A (de)
EP (1) EP0742962B1 (de)
JP (1) JP3708544B2 (de)
KR (1) KR100467120B1 (de)
CA (1) CA2180543C (de)
DE (1) DE69508925T2 (de)
ES (1) ES2130589T3 (de)
IL (1) IL112307A (de)
NL (1) NL9400165A (de)
RU (1) RU2121734C1 (de)
UA (1) UA28028C2 (de)
WO (1) WO1995021472A1 (de)

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US6603376B1 (en) * 2000-12-28 2003-08-05 Nortel Networks Limited Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies
US6621384B1 (en) * 2000-12-28 2003-09-16 Nortel Networks Limited Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies
US20030214802A1 (en) * 2001-06-15 2003-11-20 Fjelstad Joseph C. Signal transmission structure with an air dielectric
US6809608B2 (en) 2001-06-15 2004-10-26 Silicon Pipe, Inc. Transmission line structure with an air dielectric
WO2003090308A1 (en) * 2002-04-17 2003-10-30 Silicon Pipe, Inc. Signal transmission line structure with an air dielectric
AUPS216702A0 (en) * 2002-05-07 2002-06-06 Microwave and Materials Designs IP Pty Filter assembly
US7557298B2 (en) * 2002-10-14 2009-07-07 World Properties, Inc. Laminated bus bar assembly
US6888427B2 (en) * 2003-01-13 2005-05-03 Xandex, Inc. Flex-circuit-based high speed transmission line
DE602004028349D1 (de) * 2003-03-04 2010-09-09 Rohm & Haas Elect Mat Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
US7432775B2 (en) * 2003-03-05 2008-10-07 Banpil Photonics, Inc. High speed electronics interconnect having a dielectric system with cylindrical holes therein
EP1505685B1 (de) * 2003-07-28 2007-04-18 Qimonda AG Mikrostreifenleitung und Verfahren für ihre Herstellung
US20050190019A1 (en) * 2004-02-27 2005-09-01 Carsten Metz Low-loss transmission line structure
US7719379B2 (en) * 2004-03-04 2010-05-18 Banpil Photonics, Inc. High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans
WO2006007803A1 (de) * 2004-07-20 2006-01-26 Technische Universität Braunschweig Carolo-Wilhelmina Gekühlte integrierte schaltung
US7755445B2 (en) * 2004-08-03 2010-07-13 Banpil Photonics, Inc. Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems
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US7663064B2 (en) * 2004-09-25 2010-02-16 Banpil Photonics, Inc. High-speed flex printed circuit and method of manufacturing
US7889031B2 (en) * 2004-11-24 2011-02-15 Banpil Photonics, Inc. High-speed electrical interconnects and method of manufacturing
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US7295024B2 (en) * 2005-02-17 2007-11-13 Xandex, Inc. Contact signal blocks for transmission of high-speed signals
TWI364399B (en) 2006-12-30 2012-05-21 Rohm & Haas Elect Mat Three-dimensional microstructures and methods of formation thereof
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US7855623B2 (en) * 2007-06-22 2010-12-21 Tessera, Inc. Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor
WO2009001119A1 (en) * 2007-06-28 2008-12-31 Bae Systems Plc Microwave circuit assembly
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
KR101796098B1 (ko) 2010-01-22 2017-11-10 누보트로닉스, 인크. 열관리
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8482477B2 (en) * 2010-03-09 2013-07-09 Raytheon Company Foam layer transmission line structures
CN102378501B (zh) * 2010-07-13 2013-06-26 富葵精密组件(深圳)有限公司 电路板制作方法
DE112011104333T5 (de) * 2010-12-10 2013-09-05 Northrop Grumman Systems Corporation Elekrische Schaumstruktur mit geringer Masse
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
EP2731783A4 (de) 2011-07-13 2016-03-09 Nuvotronics Llc Verfahren zur herstellung von elektronischen und mechanischen strukturen
JP2013201596A (ja) * 2012-03-26 2013-10-03 Murata Mfg Co Ltd 伝送線路
EP2932562B1 (de) * 2012-12-14 2018-10-17 BAE SYSTEMS plc Verbesserungen bei antennen
GB2508899B (en) * 2012-12-14 2016-11-02 Bae Systems Plc Improvements in antennas
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
EP2770581A1 (de) * 2013-02-22 2014-08-27 BAE Systems PLC Verbesserungen an oder im Zusammenhang mit Radar
EP2959543A1 (de) * 2013-02-22 2015-12-30 BAE Systems PLC Verbesserungen an oder im zusammenhang mit radar
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016094129A1 (en) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
US20170345542A1 (en) * 2014-12-15 2017-11-30 Siemens Aktiengesellschaft Gas Chromatograph And Multiport Valve Unit For A Gas Chromatograph
CN109524751B (zh) * 2017-09-20 2021-10-12 株式会社东芝 高频电力合成器
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN108110422A (zh) * 2017-12-08 2018-06-01 中国船舶重工集团公司第七二四研究所 一种低损耗轻量化结构的pmi泡沫介质板带状线
CN109257867A (zh) * 2018-09-11 2019-01-22 番禺得意精密电子工业有限公司 电路板
CN109275258A (zh) * 2018-09-11 2019-01-25 番禺得意精密电子工业有限公司 电路板
KR20210004272A (ko) 2019-07-04 2021-01-13 주식회사 아이피미라클 금융기관의 사용자정보 스크래핑 방법 및 이를 위한 시스템
KR20210004270A (ko) 2019-07-04 2021-01-13 주식회사 아이피미라클 스크래핑 기술을 이용한 비영리단체 모금 정산방법 및 이를 위한 시스템
CN218788856U (zh) * 2020-04-24 2023-04-04 株式会社村田制作所 信号传输线路
CN112423467A (zh) * 2020-10-28 2021-02-26 中国电子科技集团公司第五十五研究所 一种悬空型分段式共面波导薄膜电路结构
WO2022113618A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

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Also Published As

Publication number Publication date
CA2180543C (en) 2007-11-13
DE69508925T2 (de) 1999-10-14
EP0742962A1 (de) 1996-11-20
NL9400165A (nl) 1995-09-01
IL112307A (en) 1998-06-15
UA28028C2 (uk) 2000-10-16
EP0742962B1 (de) 1999-04-07
WO1995021472A1 (en) 1995-08-10
JPH09508510A (ja) 1997-08-26
US5724012A (en) 1998-03-03
KR970700947A (ko) 1997-02-12
KR100467120B1 (ko) 2005-07-28
RU2121734C1 (ru) 1998-11-10
JP3708544B2 (ja) 2005-10-19
ES2130589T3 (es) 1999-07-01
CA2180543A1 (en) 1995-08-10
IL112307A0 (en) 1995-03-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THALES NEDERLAND B.V., HENGELO, NL