DE69842069D1 - Mehrschichtige gedruckte Leiterplatte - Google Patents
Mehrschichtige gedruckte LeiterplatteInfo
- Publication number
- DE69842069D1 DE69842069D1 DE69842069T DE69842069T DE69842069D1 DE 69842069 D1 DE69842069 D1 DE 69842069D1 DE 69842069 T DE69842069 T DE 69842069T DE 69842069 T DE69842069 T DE 69842069T DE 69842069 D1 DE69842069 D1 DE 69842069D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- multilayer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28049997 | 1997-10-14 | ||
JP34018297A JP3564981B2 (ja) | 1997-10-14 | 1997-12-10 | 多層プリント配線板およびその製造方法 |
JP34018097A JPH11186728A (ja) | 1997-10-14 | 1997-12-10 | 多層プリント配線板 |
JP6706598A JP3408417B2 (ja) | 1998-03-17 | 1998-03-17 | スルーホール充填用樹脂組成物および多層プリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69842069D1 true DE69842069D1 (de) | 2011-02-03 |
Family
ID=27464803
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69842069T Expired - Lifetime DE69842069D1 (de) | 1997-10-14 | 1998-10-12 | Mehrschichtige gedruckte Leiterplatte |
DE69841424T Expired - Lifetime DE69841424D1 (de) | 1997-10-14 | 1998-10-12 | Mehrschichtige gedruckte leiterplatte, verfahren zu deren herstellung, und harzzusammensetzung zum füllen von kontaktlöchern |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69841424T Expired - Lifetime DE69841424D1 (de) | 1997-10-14 | 1998-10-12 | Mehrschichtige gedruckte leiterplatte, verfahren zu deren herstellung, und harzzusammensetzung zum füllen von kontaktlöchern |
Country Status (6)
Country | Link |
---|---|
US (3) | USRE40947E1 (de) |
EP (3) | EP2015624B1 (de) |
CN (3) | CN1181717C (de) |
DE (2) | DE69842069D1 (de) |
TW (3) | TW443084B (de) |
WO (1) | WO1999020090A1 (de) |
Families Citing this family (112)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE40947E1 (en) | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
EP1121008B1 (de) | 1998-09-03 | 2008-07-30 | Ibiden Co., Ltd. | Mehrschichtige leiterplatte und verfahren zu deren herstellung |
WO2000018202A1 (fr) * | 1998-09-17 | 2000-03-30 | Ibiden Co., Ltd. | Tableau de connexions multicouche d'accumulation |
US6406750B1 (en) * | 1999-05-28 | 2002-06-18 | Osaka Municipal Government | Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
DE60031680T2 (de) | 1999-06-02 | 2007-09-06 | Ibiden Co., Ltd., Ogaki | Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte |
EP2111087B1 (de) * | 1999-08-06 | 2011-01-19 | Ibiden Co., Ltd. | Mehrschicht-Leiterplatte |
EP1211920B1 (de) | 1999-08-12 | 2010-09-15 | Ibiden Co., Ltd. | Mehrschichtige leiterplatte und leiterplatten-herstellungsmethode |
CN100521868C (zh) * | 1999-10-26 | 2009-07-29 | 伊比登株式会社 | 多层印刷配线板及多层印刷配线板的制造方法 |
JP2001144197A (ja) * | 1999-11-11 | 2001-05-25 | Fujitsu Ltd | 半導体装置、半導体装置の製造方法及び試験方法 |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
JP3527694B2 (ja) * | 2000-08-11 | 2004-05-17 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP3760771B2 (ja) * | 2001-01-16 | 2006-03-29 | 松下電器産業株式会社 | 回路形成基板および回路形成基板の製造方法 |
US7371974B2 (en) | 2001-03-14 | 2008-05-13 | Ibiden Co., Ltd. | Multilayer printed wiring board |
JP2002299512A (ja) * | 2001-03-30 | 2002-10-11 | Nec Corp | 半導体装置及びその製造方法 |
US6465084B1 (en) * | 2001-04-12 | 2002-10-15 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
JP2002324958A (ja) * | 2001-04-25 | 2002-11-08 | Sony Corp | プリント配線板と、その製造方法 |
JP3530149B2 (ja) * | 2001-05-21 | 2004-05-24 | 新光電気工業株式会社 | 配線基板の製造方法及び半導体装置 |
KR100598285B1 (ko) | 2001-06-21 | 2006-07-07 | 엘지전자 주식회사 | 멀티채널 스트림 기록장치 및 방법과, 그에 따른 기록매체 |
KR20020097454A (ko) | 2001-06-21 | 2002-12-31 | 엘지전자 주식회사 | 멀티채널 스트림 기록장치 및 방법과, 그에 따른 기록매체 |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US6649506B2 (en) * | 2001-07-27 | 2003-11-18 | Phoenix Precision Technology Corporation | Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
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JP2003133727A (ja) * | 2001-10-22 | 2003-05-09 | Nec Toppan Circuit Solutions Inc | 樹脂穴埋め基板の製造方法およびそれを用いた多層プリント配線板の製造方法 |
JP4062907B2 (ja) * | 2001-11-12 | 2008-03-19 | 松下電器産業株式会社 | 回路基板およびその製造方法 |
JP2003234572A (ja) * | 2002-02-06 | 2003-08-22 | Nitto Denko Corp | 両面配線基板の製造方法 |
JP4024563B2 (ja) * | 2002-03-15 | 2007-12-19 | 株式会社日立製作所 | 半導体装置 |
KR100757163B1 (ko) * | 2002-05-31 | 2007-09-07 | 다츠다 덴센 가부시키가이샤 | 도전성 페이스트, 이를 이용한 다층기판과 그 제조방법 |
EP1542518A4 (de) * | 2002-06-04 | 2009-08-26 | Sumitomo Electric Industries | Leiterplatte für gedruckte verdrahtung, gedruckte leiterplatte und verfahren zu ihrer herstellung |
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CN101350215B (zh) | 2002-06-24 | 2012-08-29 | Lg电子株式会社 | 记录和再现用于视频数据的再现的数据结构的方法及装置 |
KR20040000290A (ko) | 2002-06-24 | 2004-01-03 | 엘지전자 주식회사 | 고밀도 광디스크의 멀티 경로 데이터 스트림 관리방법 |
KR100554768B1 (ko) | 2002-06-28 | 2006-02-22 | 엘지전자 주식회사 | 다중 재생 경로 비디오 데이터의 재생을 관리하기 위한데이터 구조를 갖는 기록 매체와 그에 따른 기록 및 재생방법 및 장치 |
US6807732B2 (en) * | 2002-07-24 | 2004-10-26 | Agilent Technologies, Inc. | Methods for modifying inner-layer circuit features of printed circuit boards |
US6854179B2 (en) * | 2002-07-25 | 2005-02-15 | Agilent Technologies, Inc. | Modification of circuit features that are interior to a packaged integrated circuit |
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US7720356B2 (en) | 2002-11-12 | 2010-05-18 | Lg Electronics Inc | Recording medium having data structure for managing reproduction of multiple reproduction path video data recorded thereon and recording and reproducing methods and apparatuses |
US7664372B2 (en) | 2002-11-20 | 2010-02-16 | Lg Electronics Inc. | Recording medium having data structure for managing reproduction of multiple component data recorded thereon and recording and reproducing methods and apparatuses |
US7783160B2 (en) | 2002-11-20 | 2010-08-24 | Lg Electronics Inc. | Recording medium having data structure for managing reproduction of interleaved multiple reproduction path video data recorded thereon and recording and reproducing methods and apparatuses |
TW587322B (en) * | 2002-12-31 | 2004-05-11 | Phoenix Prec Technology Corp | Substrate with stacked via and fine circuit thereon, and method for fabricating the same |
US6839965B2 (en) * | 2003-02-06 | 2005-01-11 | R-Tec Corporation | Method of manufacturing a resistor connector |
US7809775B2 (en) | 2003-02-27 | 2010-10-05 | Lg Electronics, Inc. | Recording medium having data structure for managing playback control recorded thereon and recording and reproducing methods and apparatuses |
CN100397882C (zh) | 2003-02-28 | 2008-06-25 | Lg电子株式会社 | 具有用于管理记录其上的视频数据的随机/洗牌重现的数据结构的记录媒体以及记录和重现的方法和装置 |
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TWI268012B (en) * | 2003-08-07 | 2006-12-01 | Phoenix Prec Technology Corp | Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same |
JP4303563B2 (ja) * | 2003-11-12 | 2009-07-29 | 大日本印刷株式会社 | 電子装置および電子装置の製造方法 |
TWI335195B (en) * | 2003-12-16 | 2010-12-21 | Ngk Spark Plug Co | Multilayer wiring board |
AT500807B1 (de) * | 2004-01-23 | 2006-11-15 | Austria Tech & System Tech | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
KR101199285B1 (ko) * | 2004-02-04 | 2012-11-12 | 이비덴 가부시키가이샤 | 다층프린트배선판 |
CN100485913C (zh) * | 2004-02-24 | 2009-05-06 | 揖斐电株式会社 | 半导体搭载用基板 |
DE102004032706A1 (de) | 2004-07-06 | 2006-02-02 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement |
WO2006033315A1 (ja) * | 2004-09-24 | 2006-03-30 | Ibiden Co., Ltd. | めっき方法及びめっき装置 |
TWI301656B (en) * | 2004-11-26 | 2008-10-01 | Via Tech Inc | Circuit board and process thereof |
WO2006080073A1 (ja) * | 2005-01-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | 多層回路基板の製造方法、多層回路基板 |
TWI481024B (zh) | 2005-01-28 | 2015-04-11 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
US8129623B2 (en) * | 2006-01-30 | 2012-03-06 | Kyocera Corporation | Resin film, adhesive sheet, circuit board, and electronic apparatus |
JP2007258436A (ja) * | 2006-03-23 | 2007-10-04 | Alps Electric Co Ltd | 配線基板、及びその製造方法 |
JP2008016630A (ja) * | 2006-07-06 | 2008-01-24 | Matsushita Electric Ind Co Ltd | プリント配線板およびその製造方法 |
WO2008053833A1 (fr) | 2006-11-03 | 2008-05-08 | Ibiden Co., Ltd. | Tableau de câblage imprimé multicouche |
TWI332813B (en) * | 2007-05-11 | 2010-11-01 | Unimicron Technology Corp | Process of structure with embedded circuit |
TW200906263A (en) * | 2007-05-29 | 2009-02-01 | Matsushita Electric Ind Co Ltd | Circuit board and method for manufacturing the same |
US20080311285A1 (en) * | 2007-06-14 | 2008-12-18 | Seiko Epson Corporation | Contact hole forming method, conducting post forming method, wiring pattern forming method, multilayered wiring substrate producing method, electro-optical device producing method, and electronic apparatus producing method |
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1998
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- 1998-10-12 EP EP08018753A patent/EP2015624B1/de not_active Expired - Lifetime
- 1998-10-12 EP EP98947819A patent/EP1030544B1/de not_active Expired - Lifetime
- 1998-10-12 CN CNB988095831A patent/CN1181717C/zh not_active Expired - Lifetime
- 1998-10-12 DE DE69842069T patent/DE69842069D1/de not_active Expired - Lifetime
- 1998-10-12 CN CNB200410057893XA patent/CN100418390C/zh not_active Expired - Lifetime
- 1998-10-12 CN CNB021480109A patent/CN1237852C/zh not_active Expired - Lifetime
- 1998-10-12 EP EP02026472A patent/EP1286578B1/de not_active Expired - Lifetime
- 1998-10-12 DE DE69841424T patent/DE69841424D1/de not_active Expired - Lifetime
- 1998-10-14 TW TW089114870A patent/TW443084B/zh not_active IP Right Cessation
- 1998-10-14 TW TW091124369A patent/TWI249979B/zh not_active IP Right Cessation
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2000
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Also Published As
Publication number | Publication date |
---|---|
EP2015624B1 (de) | 2011-10-12 |
EP1286578B1 (de) | 2010-12-22 |
CN100418390C (zh) | 2008-09-10 |
EP1030544A4 (de) | 2006-03-08 |
EP2015624A2 (de) | 2009-01-14 |
US6376049B1 (en) | 2002-04-23 |
WO1999020090A1 (fr) | 1999-04-22 |
EP1030544A1 (de) | 2000-08-23 |
CN1592554A (zh) | 2005-03-09 |
CN1181717C (zh) | 2004-12-22 |
EP1286578A2 (de) | 2003-02-26 |
TW520629B (en) | 2003-02-11 |
USRE40947E1 (en) | 2009-10-27 |
TWI249979B (en) | 2006-02-21 |
EP2015624A3 (de) | 2010-03-03 |
US6376052B1 (en) | 2002-04-23 |
EP1286578A3 (de) | 2006-03-22 |
TW443084B (en) | 2001-06-23 |
CN1474642A (zh) | 2004-02-11 |
DE69841424D1 (de) | 2010-02-11 |
CN1237852C (zh) | 2006-01-18 |
CN1272298A (zh) | 2000-11-01 |
EP1030544B1 (de) | 2009-12-30 |
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