DE69631315D1 - Halbleiterspeicheranordnung und Verfahren zur Herstellung - Google Patents
Halbleiterspeicheranordnung und Verfahren zur HerstellungInfo
- Publication number
- DE69631315D1 DE69631315D1 DE69631315T DE69631315T DE69631315D1 DE 69631315 D1 DE69631315 D1 DE 69631315D1 DE 69631315 T DE69631315 T DE 69631315T DE 69631315 T DE69631315 T DE 69631315T DE 69631315 D1 DE69631315 D1 DE 69631315D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950034120A KR0179175B1 (ko) | 1995-10-05 | 1995-10-05 | 반도체 메모리 장치 및 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69631315D1 true DE69631315D1 (de) | 2004-02-19 |
DE69631315T2 DE69631315T2 (de) | 2004-10-21 |
Family
ID=19429330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69631315T Expired - Lifetime DE69631315T2 (de) | 1995-10-05 | 1996-08-28 | Halbleiterspeicheranordnung und Verfahren zur Herstellung |
Country Status (7)
Country | Link |
---|---|
US (3) | US5687119A (de) |
EP (1) | EP0767498B1 (de) |
JP (1) | JP2847507B2 (de) |
KR (1) | KR0179175B1 (de) |
CN (1) | CN1163966C (de) |
DE (1) | DE69631315T2 (de) |
TW (1) | TW300338B (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0902466B1 (de) * | 1997-08-27 | 2005-01-19 | STMicroelectronics S.r.l. | Herstellungsverfahren eines nativen MOS-P-Kanal-Transistors mit Verfahren für nichtflüchtige Speicher |
US6054348A (en) * | 1998-05-15 | 2000-04-25 | Taiwan Semiconductor Manufacturing Company | Self-aligned source process |
US6429495B2 (en) * | 1998-06-17 | 2002-08-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with address programming circuit |
US6110779A (en) * | 1998-07-17 | 2000-08-29 | Advanced Micro Devices, Inc. | Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride |
TW399332B (en) * | 1998-08-12 | 2000-07-21 | United Microelectronics Corp | The structure of flash memory cell and the manufacturing method thereof |
JP3344563B2 (ja) * | 1998-10-30 | 2002-11-11 | シャープ株式会社 | 半導体装置 |
JP2000223590A (ja) * | 1999-02-04 | 2000-08-11 | Sony Corp | ゲート電荷蓄積形メモリセル |
KR100387267B1 (ko) * | 1999-12-22 | 2003-06-11 | 주식회사 하이닉스반도체 | 멀티 레벨 플래쉬 이이피롬 셀 및 그 제조 방법 |
US6642111B1 (en) * | 2002-07-09 | 2003-11-04 | Powerchip Semiconductor Corp. | Memory device structure and method of fabricating the same |
JP4346322B2 (ja) * | 2003-02-07 | 2009-10-21 | 株式会社ルネサステクノロジ | 半導体装置 |
US7282401B2 (en) | 2005-07-08 | 2007-10-16 | Micron Technology, Inc. | Method and apparatus for a self-aligned recessed access device (RAD) transistor gate |
US7867851B2 (en) | 2005-08-30 | 2011-01-11 | Micron Technology, Inc. | Methods of forming field effect transistors on substrates |
FR2891398A1 (fr) * | 2005-09-23 | 2007-03-30 | St Microelectronics Sa | Memoire non volatile reprogrammable |
US7700441B2 (en) | 2006-02-02 | 2010-04-20 | Micron Technology, Inc. | Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates |
US7602001B2 (en) * | 2006-07-17 | 2009-10-13 | Micron Technology, Inc. | Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells |
US7772632B2 (en) | 2006-08-21 | 2010-08-10 | Micron Technology, Inc. | Memory arrays and methods of fabricating memory arrays |
US7589995B2 (en) | 2006-09-07 | 2009-09-15 | Micron Technology, Inc. | One-transistor memory cell with bias gate |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
US20090016118A1 (en) * | 2007-07-12 | 2009-01-15 | Silicon Storage Technology, Inc. | Non-volatile dram with floating gate and method of operation |
US8391078B2 (en) * | 2008-02-12 | 2013-03-05 | Chip Memory Technology, Inc. | Method and apparatus of operating a non-volatile DRAM |
US9029863B2 (en) | 2012-04-20 | 2015-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9431253B1 (en) * | 2015-08-05 | 2016-08-30 | Texas Instruments Incorporated | Fabrication flow based on metal gate process for making low cost flash memory |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61165896A (ja) * | 1985-01-17 | 1986-07-26 | Matsushita Electronics Corp | フロ−テイングゲ−ト型不揮発性メモリ素子 |
JPS62155568A (ja) * | 1985-12-27 | 1987-07-10 | Nec Corp | 不揮発性半導体記憶装置 |
JPH0817209B2 (ja) * | 1987-10-16 | 1996-02-21 | 松下電子工業株式会社 | 半導体装置 |
JP2500871B2 (ja) * | 1991-03-30 | 1996-05-29 | 株式会社東芝 | 半導体不揮発性ram |
JP3114155B2 (ja) * | 1991-08-05 | 2000-12-04 | 日本電信電話株式会社 | アナログメモリ素子 |
JPH05243522A (ja) * | 1992-03-02 | 1993-09-21 | Hitachi Ltd | 半導体記憶装置およびその製造方法 |
US5336937A (en) * | 1992-08-28 | 1994-08-09 | State University Of New York | Programmable analog synapse and neural networks incorporating same |
US5446299A (en) * | 1994-04-29 | 1995-08-29 | International Business Machines Corporation | Semiconductor random access memory cell on silicon-on-insulator with dual control gates |
US5554552A (en) * | 1995-04-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | PN junction floating gate EEPROM, flash EPROM device and method of manufacture thereof |
US5541130A (en) * | 1995-06-07 | 1996-07-30 | International Business Machines Corporation | Process for making and programming a flash memory array |
US5753952A (en) * | 1995-09-22 | 1998-05-19 | Texas Instruments Incorporated | Nonvolatile memory cell with P-N junction formed in polysilicon floating gate |
-
1995
- 1995-10-05 KR KR1019950034120A patent/KR0179175B1/ko not_active IP Right Cessation
-
1996
- 1996-03-08 TW TW085102839A patent/TW300338B/zh not_active IP Right Cessation
- 1996-05-07 US US08/646,152 patent/US5687119A/en not_active Expired - Lifetime
- 1996-06-26 CN CNB961086467A patent/CN1163966C/zh not_active Expired - Fee Related
- 1996-08-28 DE DE69631315T patent/DE69631315T2/de not_active Expired - Lifetime
- 1996-08-28 EP EP96113764A patent/EP0767498B1/de not_active Expired - Lifetime
- 1996-10-03 JP JP8281285A patent/JP2847507B2/ja not_active Expired - Fee Related
-
1997
- 1997-06-19 US US08/879,135 patent/US5950088A/en not_active Expired - Lifetime
- 1997-06-19 US US08/879,317 patent/US5998827A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH09129837A (ja) | 1997-05-16 |
US5998827A (en) | 1999-12-07 |
CN1163966C (zh) | 2004-08-25 |
JP2847507B2 (ja) | 1999-01-20 |
US5950088A (en) | 1999-09-07 |
KR970024197A (ko) | 1997-05-30 |
TW300338B (en) | 1997-03-11 |
DE69631315T2 (de) | 2004-10-21 |
CN1147674A (zh) | 1997-04-16 |
KR0179175B1 (ko) | 1999-03-20 |
EP0767498A1 (de) | 1997-04-09 |
EP0767498B1 (de) | 2004-01-14 |
US5687119A (en) | 1997-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |