DE69122910T2 - Verfahren zur Kupfer-Elektroplattierung - Google Patents

Verfahren zur Kupfer-Elektroplattierung

Info

Publication number
DE69122910T2
DE69122910T2 DE69122910T DE69122910T DE69122910T2 DE 69122910 T2 DE69122910 T2 DE 69122910T2 DE 69122910 T DE69122910 T DE 69122910T DE 69122910 T DE69122910 T DE 69122910T DE 69122910 T2 DE69122910 T2 DE 69122910T2
Authority
DE
Germany
Prior art keywords
electroplating process
copper electroplating
copper
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122910T
Other languages
English (en)
Other versions
DE69122910D1 (de
Inventor
Kenichi Ueno
Kazuhiro Hirao
Genzo Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De Nora Permelec Ltd
Original Assignee
Permelec Electrode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Permelec Electrode Ltd filed Critical Permelec Electrode Ltd
Publication of DE69122910D1 publication Critical patent/DE69122910D1/de
Application granted granted Critical
Publication of DE69122910T2 publication Critical patent/DE69122910T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
DE69122910T 1990-06-20 1991-06-12 Verfahren zur Kupfer-Elektroplattierung Expired - Fee Related DE69122910T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2162192A JPH0452296A (ja) 1990-06-20 1990-06-20 銅めっき方法

Publications (2)

Publication Number Publication Date
DE69122910D1 DE69122910D1 (de) 1996-12-05
DE69122910T2 true DE69122910T2 (de) 1997-05-07

Family

ID=15749751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122910T Expired - Fee Related DE69122910T2 (de) 1990-06-20 1991-06-12 Verfahren zur Kupfer-Elektroplattierung

Country Status (6)

Country Link
US (1) US5143593A (de)
EP (1) EP0462943B1 (de)
JP (1) JPH0452296A (de)
KR (1) KR920000974A (de)
DE (1) DE69122910T2 (de)
MY (1) MY129999A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10143076B4 (de) * 2000-09-04 2009-11-26 Tsurumi Soda Co., Ltd., Yokohama Verfahren zur Herstellung eines Kupfergalvanisierungsmaterials und nach dem Verfahren erhältliches Kupfergalvanisierungsmaterial

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69219484D1 (de) * 1992-09-15 1997-06-05 Atr Wire & Cable Co Verfahren und vorrichtung zur elektrolytischen beschichtung mit kupfer
US5908540A (en) * 1997-08-07 1999-06-01 International Business Machines Corporation Copper anode assembly for stabilizing organic additives in electroplating of copper
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
DE19834353C2 (de) * 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
JP2000256896A (ja) * 1999-03-11 2000-09-19 Ebara Corp めっき装置
JP2000256898A (ja) * 1999-03-03 2000-09-19 Permelec Electrode Ltd ウェーハの銅めっき方法
WO2002031228A1 (en) * 2000-10-10 2002-04-18 Learonal Japan Inc. Copper electroplating using insoluble anode
US6451375B1 (en) * 2001-01-05 2002-09-17 International Business Machines Corporation Process for depositing a film on a nanometer structure
US6784104B2 (en) * 2001-07-27 2004-08-31 Texas Instruments Incorporated Method for improved cu electroplating in integrated circuit fabrication
TWI227952B (en) * 2002-05-02 2005-02-11 Mykrolis Corp Device and method for increasing mass transport at liquid-solid diffusion boundary layer
DE10261493A1 (de) * 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
JP2007046092A (ja) * 2005-08-09 2007-02-22 Hyomen Shori System:Kk シート状ワークの銅めっき装置および方法
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5110269B2 (ja) * 2007-08-09 2012-12-26 上村工業株式会社 電気銅めっき方法
CN101275252B (zh) * 2007-12-26 2011-02-16 梧州三和新材料科技有限公司 一种连续电镀的装置及用途
TWI384925B (zh) * 2009-03-17 2013-02-01 Advanced Semiconductor Eng 內埋式線路基板之結構及其製造方法
US9068272B2 (en) * 2012-11-30 2015-06-30 Applied Materials, Inc. Electroplating processor with thin membrane support
KR101451483B1 (ko) * 2012-12-28 2014-10-15 삼성전기주식회사 전해도금 장치
CN103388172B (zh) * 2013-07-22 2016-06-22 苏州昕皓新材料科技有限公司 一种快速判断电镀添加剂性能的方法
CN109056002B (zh) * 2017-07-19 2022-04-15 叶旖婷 一种通孔隔离法酸性电镀铜工艺及其装置
CN111074307A (zh) * 2020-01-04 2020-04-28 安徽工业大学 一种隔膜电解法镀铜镀液稳定工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits
IL43733A (en) * 1973-12-03 1976-06-30 Yeda Res & Dev Method of electrodeposition of metals using catalyzed hydrogen
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPS6063987A (ja) * 1983-09-17 1985-04-12 沖電気工業株式会社 印刷配線基板の製造方法
JPH0679922B2 (ja) * 1988-09-30 1994-10-12 松下冷機株式会社 厨芥収納庫

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10143076B4 (de) * 2000-09-04 2009-11-26 Tsurumi Soda Co., Ltd., Yokohama Verfahren zur Herstellung eines Kupfergalvanisierungsmaterials und nach dem Verfahren erhältliches Kupfergalvanisierungsmaterial

Also Published As

Publication number Publication date
EP0462943B1 (de) 1996-10-30
DE69122910D1 (de) 1996-12-05
JPH0452296A (ja) 1992-02-20
EP0462943A1 (de) 1991-12-27
KR920000974A (ko) 1992-01-29
US5143593A (en) 1992-09-01
MY129999A (en) 2007-05-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee