DE69414324T2 - Elektrobeschichtungsverfahren - Google Patents

Elektrobeschichtungsverfahren

Info

Publication number
DE69414324T2
DE69414324T2 DE69414324T DE69414324T DE69414324T2 DE 69414324 T2 DE69414324 T2 DE 69414324T2 DE 69414324 T DE69414324 T DE 69414324T DE 69414324 T DE69414324 T DE 69414324T DE 69414324 T2 DE69414324 T2 DE 69414324T2
Authority
DE
Germany
Prior art keywords
electroplating process
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69414324T
Other languages
English (en)
Other versions
DE69414324D1 (de
Inventor
John J Bladon
Carl Colangelo
John Robinson
Michael Rousseau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Co
Original Assignee
Rohm and Haas Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Application granted granted Critical
Publication of DE69414324D1 publication Critical patent/DE69414324D1/de
Publication of DE69414324T2 publication Critical patent/DE69414324T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69414324T 1993-08-09 1994-06-27 Elektrobeschichtungsverfahren Expired - Fee Related DE69414324T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/104,801 US5374346A (en) 1993-08-09 1993-08-09 Electroplating process and composition

Publications (2)

Publication Number Publication Date
DE69414324D1 DE69414324D1 (de) 1998-12-10
DE69414324T2 true DE69414324T2 (de) 1999-05-12

Family

ID=22302464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69414324T Expired - Fee Related DE69414324T2 (de) 1993-08-09 1994-06-27 Elektrobeschichtungsverfahren

Country Status (4)

Country Link
US (1) US5374346A (de)
EP (1) EP0638669B1 (de)
JP (1) JP3357473B2 (de)
DE (1) DE69414324T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738776A (en) * 1996-01-19 1998-04-14 Shipley Company, L.L.C. Electroplating process
US5762777A (en) * 1996-05-02 1998-06-09 Persee Chemical Co. Ltd. Process of directly electroplating onto a nonconductive substrate
US6265020B1 (en) 1999-09-01 2001-07-24 Shipley Company, L.L.C. Fluid delivery systems for electronic device manufacture
JP2002223056A (ja) * 2001-01-26 2002-08-09 Hitachi Kokusai Electric Inc 回路パターン形成方法
JP4843164B2 (ja) * 2001-08-21 2011-12-21 日本リーロナール有限会社 銅−樹脂複合材料の形成方法
US20030064158A1 (en) * 2001-10-03 2003-04-03 Thirkeldsen C. G. Method and apparatus for improving corrosion resistance of chrome plated material
US6808751B2 (en) * 2001-10-03 2004-10-26 Industrial Hard Chrome Method for improving corrosion resistance of chrome plated material
US20060065622A1 (en) * 2004-09-27 2006-03-30 Floyd Philip D Method and system for xenon fluoride etching with enhanced efficiency
JP4797611B2 (ja) * 2005-12-09 2011-10-19 富士通株式会社 電気めっき方法、磁気ヘッド用コイルの製造方法及び半導体装置の製造方法
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7623287B2 (en) * 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
EP2104948A2 (de) 2007-02-20 2009-09-30 Qualcomm Mems Technologies, Inc. Ausrüstung und verfahren zur mems-ätzung
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
RU2471210C2 (ru) 2007-07-25 2012-12-27 Квалкомм Мемс Текнолоджис, Инк. Дисплеи на основе микроэлектромеханических систем и способы их изготовления
US8023191B2 (en) * 2008-05-07 2011-09-20 Qualcomm Mems Technologies, Inc. Printable static interferometric images
US8547626B2 (en) * 2010-03-25 2013-10-01 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of shaping the same
EP2556403A1 (de) 2010-04-09 2013-02-13 Qualcomm Mems Technologies, Inc. Mechanische schicht einer elektromechanischen vorrichtung und verfahren zu ihrer herstellung
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3035859A1 (de) * 1980-09-23 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zur aetztechnischen und/oder galvanischen herstellung von ringzonen in engen bohrungen
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US4605471A (en) * 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
US5007968A (en) * 1989-07-28 1991-04-16 Chemcut Corporation Process and apparatus for treating articles of substantial thickness
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
JPH0494591A (ja) * 1990-08-10 1992-03-26 Cmk Corp スルーホールを有するプリント配線板の製造方法
US5207888A (en) * 1991-06-24 1993-05-04 Shipley Company Inc. Electroplating process and composition

Also Published As

Publication number Publication date
DE69414324D1 (de) 1998-12-10
JP3357473B2 (ja) 2002-12-16
EP0638669A1 (de) 1995-02-15
EP0638669B1 (de) 1998-11-04
JPH07180089A (ja) 1995-07-18
US5374346A (en) 1994-12-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee