DE60123624D1 - Dünnfilmtransistoren und deren herstellungsverfahren - Google Patents

Dünnfilmtransistoren und deren herstellungsverfahren

Info

Publication number
DE60123624D1
DE60123624D1 DE60123624T DE60123624T DE60123624D1 DE 60123624 D1 DE60123624 D1 DE 60123624D1 DE 60123624 T DE60123624 T DE 60123624T DE 60123624 T DE60123624 T DE 60123624T DE 60123624 D1 DE60123624 D1 DE 60123624D1
Authority
DE
Germany
Prior art keywords
layer
microcrystalline silicon
gate insulator
insulator layer
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60123624T
Other languages
English (en)
Inventor
J Flewitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE60123624D1 publication Critical patent/DE60123624D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • H01L29/78678Polycrystalline or microcrystalline silicon transistor with inverted-type structure, e.g. with bottom gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Liquid Crystal (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
DE60123624T 2000-07-18 2001-07-04 Dünnfilmtransistoren und deren herstellungsverfahren Expired - Lifetime DE60123624D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0017471.4A GB0017471D0 (en) 2000-07-18 2000-07-18 Thin film transistors and their manufacture
PCT/EP2001/007681 WO2002007207A1 (en) 2000-07-18 2001-07-04 Thin film transistors and their manufacture

Publications (1)

Publication Number Publication Date
DE60123624D1 true DE60123624D1 (de) 2006-11-16

Family

ID=9895773

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60123624T Expired - Lifetime DE60123624D1 (de) 2000-07-18 2001-07-04 Dünnfilmtransistoren und deren herstellungsverfahren

Country Status (9)

Country Link
US (2) US6410372B2 (de)
EP (1) EP1303873B1 (de)
JP (1) JP2004504721A (de)
KR (1) KR20020032586A (de)
CN (1) CN1237590C (de)
AT (1) ATE341833T1 (de)
DE (1) DE60123624D1 (de)
GB (1) GB0017471D0 (de)
WO (1) WO2002007207A1 (de)

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KR20050061446A (ko) * 2002-08-07 2005-06-22 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 절연 게이트 트랜지스터, 트랜지스터 장치, 트랜지스터회로 및 트랜지스터 작동 방법
US7094684B2 (en) * 2002-09-20 2006-08-22 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN100474084C (zh) * 2003-07-14 2009-04-01 株式会社半导体能源研究所 液晶显示器件
US7132298B2 (en) 2003-10-07 2006-11-07 Hewlett-Packard Development Company, L.P. Fabrication of nano-object array
US7547647B2 (en) * 2004-07-06 2009-06-16 Hewlett-Packard Development Company, L.P. Method of making a structure
CN1328768C (zh) * 2004-08-27 2007-07-25 友达光电股份有限公司 薄膜晶体管及其电路的制作方法
CN1317748C (zh) * 2004-12-13 2007-05-23 友达光电股份有限公司 薄膜晶体管的制造方法
US7646367B2 (en) 2005-01-21 2010-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device and electronic apparatus
CN1822385B (zh) 2005-01-31 2013-02-06 株式会社半导体能源研究所 显示装置及含有其的电子设备
US8681077B2 (en) * 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
KR100645718B1 (ko) * 2005-04-28 2006-11-14 삼성에스디아이 주식회사 박막 트랜지스터 및 그 제조방법
CN100386690C (zh) * 2005-05-24 2008-05-07 友达光电股份有限公司 在液晶显示器中形成薄膜晶体管的方法
US7229863B2 (en) * 2005-10-25 2007-06-12 Chunghwa Picture Tubes, Ltd. Method for fabricating thin film transistors
KR100792315B1 (ko) * 2006-08-01 2008-01-07 비오이 하이디스 테크놀로지 주식회사 미세결정 실리콘층의 형성방법 및 이를 이용한 박막트랜지스터의 제조방법
US20100158875A1 (en) * 2006-12-18 2010-06-24 University Of Pittsburgh - Of The Commonwealth System Of Higher Education Muscle derived cells for the treatment of gastro-esophageal pathologies and methods of making and using the same
CN101271923B (zh) * 2007-03-23 2010-12-08 中华映管股份有限公司 薄膜晶体管
JP2008258345A (ja) * 2007-04-04 2008-10-23 Sony Corp 薄膜トランジスタおよびその製造方法ならびに表示装置
KR101576813B1 (ko) * 2007-08-17 2015-12-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US8591650B2 (en) * 2007-12-03 2013-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for forming crystalline semiconductor film, method for manufacturing thin film transistor, and method for manufacturing display device
US8187956B2 (en) * 2007-12-03 2012-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing microcrystalline semiconductor film, thin film transistor having microcrystalline semiconductor film, and photoelectric conversion device having microcrystalline semiconductor film
CN102007586B (zh) * 2008-04-18 2013-09-25 株式会社半导体能源研究所 薄膜晶体管及其制造方法
KR101635625B1 (ko) * 2008-04-18 2016-07-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터 및 그 제작 방법
JP5416460B2 (ja) * 2008-04-18 2014-02-12 株式会社半導体エネルギー研究所 薄膜トランジスタおよび薄膜トランジスタの作製方法
US8053294B2 (en) * 2008-04-21 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor by controlling generation of crystal nuclei of microcrystalline semiconductor film
JP5436017B2 (ja) * 2008-04-25 2014-03-05 株式会社半導体エネルギー研究所 半導体装置
US8049215B2 (en) * 2008-04-25 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
CN102077354B (zh) * 2008-06-27 2014-08-20 株式会社半导体能源研究所 薄膜晶体管、半导体装置及电子设备
US8283667B2 (en) 2008-09-05 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
JP5595004B2 (ja) * 2008-10-21 2014-09-24 株式会社半導体エネルギー研究所 表示装置
JP5595003B2 (ja) * 2008-10-23 2014-09-24 株式会社半導体エネルギー研究所 表示装置
JP5490515B2 (ja) * 2009-01-21 2014-05-14 株式会社半導体エネルギー研究所 半導体装置
WO2010103906A1 (en) * 2009-03-09 2010-09-16 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
JP5495775B2 (ja) * 2009-03-27 2014-05-21 株式会社半導体エネルギー研究所 半導体装置
TWI535028B (zh) * 2009-12-21 2016-05-21 半導體能源研究所股份有限公司 薄膜電晶體
JP5709579B2 (ja) * 2010-03-02 2015-04-30 株式会社半導体エネルギー研究所 微結晶半導体膜の作製方法
JP5525298B2 (ja) * 2010-03-18 2014-06-18 シャープ株式会社 導電性窒化シリコン膜の製造方法
US8440548B2 (en) * 2010-08-06 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of microcrystalline silicon film and manufacturing method of thin film transistor
US8704230B2 (en) 2010-08-26 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI538218B (zh) 2010-09-14 2016-06-11 半導體能源研究所股份有限公司 薄膜電晶體
US8338240B2 (en) 2010-10-01 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing transistor
TWI476931B (zh) * 2010-10-21 2015-03-11 Au Optronics Corp 薄膜電晶體與具有此薄膜電晶體的畫素結構
JP2014055111A (ja) * 2013-12-11 2014-03-27 Sharp Corp 導電性窒化シリコン膜、導電性窒化シリコン膜積層体、および光電変換装置
TWI658587B (zh) * 2018-01-25 2019-05-01 友達光電股份有限公司 顯示裝置之薄膜電晶體及其形成方法

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Also Published As

Publication number Publication date
US20020119590A1 (en) 2002-08-29
ATE341833T1 (de) 2006-10-15
CN1237590C (zh) 2006-01-18
KR20020032586A (ko) 2002-05-03
WO2002007207A1 (en) 2002-01-24
US20020009819A1 (en) 2002-01-24
GB0017471D0 (en) 2000-08-30
EP1303873A1 (de) 2003-04-23
EP1303873B1 (de) 2006-10-04
CN1386301A (zh) 2002-12-18
US6483124B2 (en) 2002-11-19
US6410372B2 (en) 2002-06-25
JP2004504721A (ja) 2004-02-12

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Legal Events

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8332 No legal effect for de