DE10192328T1 - Kalibrierungsverfahren für Bestückungsmaschinen mit On-head-Linescan-Erfassung - Google Patents
Kalibrierungsverfahren für Bestückungsmaschinen mit On-head-Linescan-ErfassungInfo
- Publication number
- DE10192328T1 DE10192328T1 DE10192328T DE10192328T DE10192328T1 DE 10192328 T1 DE10192328 T1 DE 10192328T1 DE 10192328 T DE10192328 T DE 10192328T DE 10192328 T DE10192328 T DE 10192328T DE 10192328 T1 DE10192328 T1 DE 10192328T1
- Authority
- DE
- Germany
- Prior art keywords
- detection
- calibration procedure
- placement machines
- linescan
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40623—Track position of end effector by laser beam
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45063—Pick and place manipulator
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50028—Beam detects x, y deviation on surface, compensates beam of position scanner
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/589,020 US6535291B1 (en) | 2000-06-07 | 2000-06-07 | Calibration methods for placement machines incorporating on-head linescan sensing |
PCT/US2001/011629 WO2001095370A2 (en) | 2000-06-07 | 2001-04-10 | Calibration methods for placement machines incorporating on-head linescan sensing |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10192328T1 true DE10192328T1 (de) | 2002-11-21 |
Family
ID=24356258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10192328T Withdrawn DE10192328T1 (de) | 2000-06-07 | 2001-04-10 | Kalibrierungsverfahren für Bestückungsmaschinen mit On-head-Linescan-Erfassung |
Country Status (6)
Country | Link |
---|---|
US (2) | US6535291B1 (de) |
JP (1) | JP2003536252A (de) |
KR (1) | KR20020021174A (de) |
DE (1) | DE10192328T1 (de) |
GB (1) | GB2368393B (de) |
WO (1) | WO2001095370A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2001062062A2 (en) * | 2000-02-17 | 2001-08-23 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel |
US6535291B1 (en) * | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
US6798925B1 (en) * | 2000-12-22 | 2004-09-28 | Cognex Corporation | Method and apparatus for calibrating an image acquisition system |
US7043820B2 (en) * | 2001-07-27 | 2006-05-16 | Fuji Machine Mfg. Co., Ltd. | Electric-component mounting system |
US6625878B2 (en) * | 2001-09-05 | 2003-09-30 | Delaware Capital Formation | Method and apparatus for improving component placement in a component pick up and place machine |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US7813559B2 (en) * | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US6782334B1 (en) * | 2003-04-01 | 2004-08-24 | Lockheed Martin Corporation | Method and system for calibration of time delay integration imaging devices |
US7706595B2 (en) | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
KR100604309B1 (ko) * | 2004-03-18 | 2006-07-24 | 삼성테크윈 주식회사 | 부품 실장기용 부품인식장치 |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
JP4896136B2 (ja) * | 2005-09-14 | 2012-03-14 | サイバーオプティクス コーポレーション | 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機 |
DE112006003019T5 (de) * | 2005-10-31 | 2008-10-23 | Cyberoptics Corp., Golden Valley | Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung |
US8311311B2 (en) | 2005-10-31 | 2012-11-13 | Mitutoyo Corporation | Optical aberration correction for machine vision inspection systems |
JP4811073B2 (ja) * | 2006-03-22 | 2011-11-09 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
US7738694B2 (en) * | 2006-03-23 | 2010-06-15 | Pratt & Whitney Canada Corp. | Calibration of optical patternator spray parameter measurements |
JP2008305963A (ja) | 2007-06-07 | 2008-12-18 | Yamaha Motor Co Ltd | 部品認識装置、表面実装機及び部品試験機 |
TWI512858B (zh) * | 2009-03-23 | 2015-12-11 | Toray Eng Co Ltd | Installation device and installation method |
US20100295935A1 (en) * | 2009-05-06 | 2010-11-25 | Case Steven K | On-head component alignment using multiple area array image detectors |
CN103379820B (zh) * | 2013-07-16 | 2015-12-23 | 吴江市博众精工科技有限公司 | 一种自动对位零件安装机构 |
DE102014225147A1 (de) * | 2014-12-08 | 2016-06-09 | Robert Bosch Gmbh | Verfahren zur Identifikation einer Kennlinie |
KR102018070B1 (ko) * | 2015-06-19 | 2019-09-04 | 야마하하쓰도키 가부시키가이샤 | 부품 실장 장치 및 부품 실장 방법 |
US10620608B2 (en) | 2017-03-07 | 2020-04-14 | Raytheon Company | Collet contrast disk |
CN107639635B (zh) * | 2017-09-30 | 2020-02-07 | 杨聚庆 | 一种机械臂位姿误差标定方法及*** |
MY186148A (en) * | 2017-11-27 | 2021-06-28 | Mi Equipment M Sdn Bhd | Setup camera auto height alignment |
JP7223136B2 (ja) * | 2019-07-05 | 2023-02-15 | 株式会社Fuji | 部品実装装置 |
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-
2000
- 2000-06-07 US US09/589,020 patent/US6535291B1/en not_active Expired - Fee Related
-
2001
- 2001-04-10 KR KR1020027001654A patent/KR20020021174A/ko not_active Application Discontinuation
- 2001-04-10 GB GB0202156A patent/GB2368393B/en not_active Expired - Fee Related
- 2001-04-10 JP JP2002502813A patent/JP2003536252A/ja active Pending
- 2001-04-10 WO PCT/US2001/011629 patent/WO2001095370A2/en active Application Filing
- 2001-04-10 DE DE10192328T patent/DE10192328T1/de not_active Withdrawn
-
2003
- 2003-01-07 US US10/337,644 patent/US6744499B2/en not_active Expired - Fee Related
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GB2368393A (en) | 2002-05-01 |
US20030156297A1 (en) | 2003-08-21 |
GB0202156D0 (en) | 2002-03-20 |
JP2003536252A (ja) | 2003-12-02 |
US6744499B2 (en) | 2004-06-01 |
WO2001095370A2 (en) | 2001-12-13 |
GB2368393B (en) | 2004-06-09 |
US6535291B1 (en) | 2003-03-18 |
WO2001095370A3 (en) | 2002-03-21 |
KR20020021174A (ko) | 2002-03-18 |
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